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The Bioptx Biosensing Band and Platform represents a leap in wearable health technology, enabling continuous and non-invasive monitoring of health parameters through advanced spectroscopic techniques. It integrates Rockley Photonics' proprietary photonic integrated circuit (PIC) technologies, which utilize miniaturized short-wave infrared (SWIR) lasers alongside conventional LED-based photoplethysmography (PPG). This combination allows for real-time biomarker analysis on a compact, wearable form factor, delivering vital insights into hydration and body temperature as well as heart rate, heart rate variability, respiratory rate, and blood oxygen levels. The Bioptx platform is engineered for seamless integration with various applications through its recently released Developer API, which facilitates streamlined connectivity and software integration. This feature paves the way for enhanced data accuracy and accessibility, supporting both consumer and clinical uses. Deployed through their ecosystem of devices, including the Bioptx Band, the platform is designed to provide expanded biomarker data through its cloud-connected framework, thus enabling improved health and wellness monitoring on the go. The development of the Bioptx system illustrates Rockley Photonics' commitment to advancing health monitoring technology through innovative applications of photonics. Collaborations with experts, like Dr. Stavros Kavouras and strategic industry partners, have further strengthened its potential to impact fields ranging from athletic training to chronic disease management, underscoring the broad utility of this next-generation sensing solution.
The Multi-Channel Silicon Photonic Chipset is engineered to support advanced data transmission capabilities, specifically designed to enhance high-speed connectivity through a blend of state-of-the-art photonic technologies. It incorporates a comprehensive transmitter and receiver architecture targeting 4x106Gb/s data rates, efficiently supporting 400 GBASE-DR4 applications. The chipset stands out for its hybrid integration of III-V DFB lasers with electro-absorption modulators, achieving a superior optical modulation amplitude (OMA) and low TDECQ penalty, aligning with IEEE standards for high-performance communication networks. This silicon-based photonic solution leverages unique integrated technologies to address the growing demands for data center and telecommunications infrastructure. By supporting multiple channel capabilities, it provides a scalable approach to handling high-bandwidth data streams, ensuring robust and reliable performance in various network configurations. The precise engineering behind the modulation and laser integration allows this chipset to meet stringent efficiency and output requirements. Rockley Photonics designed the chipset with a focus on minimizing energy consumption while maximizing the data handling capacity, offering a competitive edge for businesses looking to upgrade network throughput without incurring significant costs. This multi-channel chipset exemplifies a significant technological advancement in photonic data transmission, supporting future growth in both enterprise and consumer broadband services.
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