Based in San Jose, California, NanoSILICON, Inc. is a prominent player in the semiconductor industry, specializing in the provision of high-quality silicon wafer processing services. A core focus of their operations revolves around thermal oxide processing, which is a critical stage in the manufacture of semiconductor devices. This process involves the creation of a thin silicon dioxide layer on the surface of a silicon wafer, serving as an essential insulating layer in microelectronics.
NanoSILICON has fine-tuned both dry and wet oxidation processes to deliver consistent, high-quality results. The company uses ultra-pure steam and oxygen in its horizontal furnaces to achieve outstanding thickness uniformity across and between wafers. The precision of their thermal oxide films is validated using sophisticated white light reflection techniques that ensure optimum refractive index and film stress parameters.
With a commitment to innovation and precision, NanoSILICON's offerings include tailored oxide thicknesses ranging from 500 Ångströms to 100,000 Ångströms, alongside process temperature control between 800°C and 1050°C. They accommodate various wafer sizes and materials, enhancing their versatility in semiconductor manufacturing. As such, NanoSILICON stands out as a reliable partner for companies needing intricate and reliable silicon wafer processing solutions.
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