Is this your business? Claim it to manage your IP and profile
The E-TRX-LP Low Power Front-End is engineered for applications requiring minimal power consumption without sacrificing performance. This compact and cost-effective front-end leverages advanced CMOS technology to cater to next-gen communication systems focusing on efficiency and reliability. It integrates seamlessly with a variety of substrates and packaging options, enhancing its deployment in space-constrained and energy-saving environments. With its small footprint and modular architecture, it is a perfect fit for communication devices prioritizing longevity and reduced operational costs.
The E-TRX-HP High Power Front-End is an innovative solution designed for high-performance applications requiring stringent power handling capabilities. As part of the company's esteemed E-band products, this front-end significantly pushes the boundaries of integration and miniaturization in CMOS technology. It delivers class-leading performance with reduced power consumption, making it ideal for next-generation wireless communications and MIMO array systems. It supports a variety of use cases looking to optimize both cost and space, ensuring a versatile application in advanced networks.
The RFCell Framework is a Python-based development tool designed to expedite the creation of advanced RF and mmWave parameterized cells. Tailored for compatibility with CMOS, GaAs, and GaN technologies, this framework simplifies the design process with its user-friendly coding interface. By enabling designers to rapidly define complex structures, it significantly shortens the development cycle from months to weeks. It is ideal for professionals seeking to integrate simulation and modeling tasks seamlessly, enhancing the prototyping of RF components in cutting-edge design environments.
The E-DIP Integrated Diplexer stands out as a pioneering product in the E-band mmWave space. Utilizing a novel design approach, it combines compact dimensions with high-performance attributes suitable for a wide range of wireless applications. Crafted to support FCCSP, BGA, CSP, and SiP packaging, it ensures superior interconnectivity with minimal signal loss. This diplexer is not only one of the smallest in the market but also features impressive out-of-band suppression, making it indispensable for sophisticated wireless communication architectures aiming for efficiency and space optimization.
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
To evaluate IP you need to be logged into a buyer profile. Select a profile below, or create a new buyer profile for your company.
