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Multifractal Semiconductors

Multifractal Semiconductors is at the forefront of developing integrated E-band front-end solutions using advanced CMOS technology. With a strong focus on innovation, the company offers an impressive range of V- & E-band mmWave components known for their exceptional performance, compact size, and low power consumption. Their cutting-edge IP portfolio stands out by being highly modular and cost-effective compared to traditional solutions. Dedicated to revolutionizing the semiconductor industry, Multifractal Semiconductors emphasizes the scalability and affordability of CMOS technology. They deliver solutions that are drastically smaller and more economical, with advancements such as the world's smallest E-band diplexer featuring high out-of-band suppression and minimal insertion loss. Their innovative products are designed to support next-generation MIMO arrays and fronthaul applications. The company's technological edge is amplified through their RFCell framework, a Python-based tool facilitating rapid development of RF and mmWave parameterized cells. This flexible framework supports various technology nodes and materials, offering a streamlined design experience that integrates seamlessly with major industry tools. With these innovations, Multifractal Semiconductors is well-positioned to lead in the development of efficient and scalable semiconductor solutions. Read more

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IPs available

RFCell Framework

RFCell Framework is an innovative tool developed by Multifractal for the efficient generation of RF and mmWave parameterized cells (PCELLs) using Python. This framework is designed to facilitate rapid development by reducing the complexity of coding through streamlined processes and compatibility with major industry tools like Keysight ADS and Synopsys PyCell. By supporting various technology nodes such as CMOS, GaAs, and GaN, RFCell ensures wide applicability and accelerates the design process significantly. The framework operates on a '1D wire-frame' mode, enabling engineers to define complex structures effortlessly, and converts these into 3D models. Its versatile nature allows for the creation of intricate RF designs with ease, significantly cutting down the development time from months to weeks. As a process-agnostic tool, RFCell caters to diverse design needs, providing robust support for both novice and seasoned engineers. Integrating seamlessly with DRC-clean processes, RFCell demonstrates Multifractal's commitment to delivering quality and ease of use in semiconductor design. The tool aligns with the needs of modern RF engineers, ensuring optimized performance and rapid prototyping capabilities across various platforms.

Multifractal Semiconductors
18 Views
TSMC
28nm
View Details Datasheet

E-TRX-HP High Power Front-End

This high power front-end component is a part of Multifractal's E-band solutions, specially optimized for delivering superior performance with reduced power consumption in challenging applications like MIMO arrays and wireless fronthaul. It incorporates cutting-edge CMOS technology to deliver 100 times smaller and significantly cost-effective solutions compared to conventional designs. Specifically crafted for serious power demands, it achieves efficient operation and long-term reliability.

Multifractal Semiconductors
13 Views
TSMC
28nm
PLL, RF Modules
View Details Datasheet

E-TRX-LP Low Power Front-End

The E-TRX-LP is a low power front-end solution designed for applications demanding energy efficiency without compromising on performance. Part of the advanced E-band portfolio, this component exploits the benefits of 28 nm Bulk CMOS technology, ensuring minimal power usage and enhanced efficiency in various wireless applications. Its design enables seamless integration into modern systems, adding value through ease of use and reduced operational costs.

Multifractal Semiconductors
13 Views
TSMC
28nm
PLL, RF Modules
View Details Datasheet

E-DIP Integrated Diplexer

The E-DIP is a state-of-the-art integrated diplexer that represents a leap forward in diplexer design for E-band applications. Notably compact, it is crafted using a BT laminate substrate that is suitable for plastic IC packaging. This component is characterized by high out-of-band suppression and low insertion loss, making it ideal for applications requiring tight frequency control and efficiency. Its small size and robust performance make it an attractive option for modern high-frequency systems.

Multifractal Semiconductors
12 Views
TSMC
28nm
PLL, RF Modules
View Details Datasheet
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