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Multifractal Semiconductors

Multifractal Semiconductors is a pioneering company dedicated to developing cutting-edge semiconductor solutions. With a strong focus on CMOS technology, Multifractal delivers an innovative portfolio of V- and E-band mmWave components, renowned for their exceptional performance and compact designs. Their products are tailored to meet the demands of modern communication systems, particularly in applications like MIMO arrays and fronthaul networks, and stand out due to their reduced size and energy efficiency. The company prides itself on creating the industry's first E-band front-end with an integrated diplexer, enhancing signal integrity and performance. By leveraging advanced packaging techniques, such as BT laminate substrates, Multifractal's front-ends ensure compatibility with various modern packaging formats, including FCCSP and BGA. This focus on versatility and performance positions Multifractal at the forefront of mmWave technology innovations. A firm advocate for the scalability of CMOS, Multifractal Semiconductors specializes in RFCell technology, a framework that expedites the development of RF and mmWave parameterized cells. This Python-based solution simplifies the design process across various semiconductor nodes and materials, thereby promoting rapid prototyping and seamless integration with leading EDA tools. In essence, Multifractal's technological advancements provide robust solutions for current and future semiconductor challenges. Read more

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RFCell Framework

The RFCell Framework is a Python-based development framework engineered by Multifractal to accelerate the creation of RF and mmWave parameterized cells. Designed specifically for use with CMOS technology nodes, it also supports GaAs and GaN technologies. This framework is ideal for semiconductor engineers looking to streamline their design processes. One of the RFCell Framework's strongest advantages is its innovative coding approach, transforming complex structures from simple "1D wire-frame" designs into comprehensive 3D models. This functionality significantly shortens development cycles from months to mere weeks, fostering rapid prototyping and iterations. Integrating well with software tools such as Keysight ADS, Synopsys PyCell, and Cadence, RFCell marries ease of use with flexibility. Its design approach is process-agnostic, promoting versatile application across various projects. By automating large parts of the RF cell design, it allows semiconductor companies to focus on innovation and product differentiation.

Multifractal Semiconductors
33 Views
TSMC
28nm
Multiprocessor / DSP
View Details Datasheet

E-TRX-LP Low Power Front-End

The E-TRX-LP is tailored for low power applications, offering an efficient solution for low-energy mmWave communication needs. Designed with cutting-edge CMOS technology, this front-end addresses the crucial demand for smaller, energy-conserving components in modern wireless infrastructure. Ideal for deployment in environments where power economy is paramount, it supports applications including MIMO arrays and system front-haul configurations. This component exemplifies Multifractal's commitment to innovation through its ability to maintain performance while operating at reduced power levels compared to other market solutions. By facilitating a more energy-efficient architecture, the E-TRX-LP ensures better operational economies for service providers deploying large-scale wireless infrastructure. Despite its focus on low power usage, it still manages to deliver excellent performance metrics, such as minimal insertion loss and robust out-of-band suppression. The component's footprint is exceptionally small, which provides installation flexibility, making it a versatile choice for a range of network scenarios that require compact, power-efficient solutions.

Multifractal Semiconductors
30 Views
TSMC
28nm
PLL, RF Modules, Sensor
View Details Datasheet

E-TRX-HP High Power Front-End

The E-TRX-HP is a high-power front-end solution that forms part of Multifractal's innovative range of E-band and V-band mmWave components designed using Bulk CMOS technology. This front-end is engineered for applications requiring high power and efficiency, ideally suited for modern wireless communications infrastructure such as MIMO arrays and fronthaul systems. It excels in delivering robust output while minimizing power consumption. This product integrates seamlessly into various communication ecosystems and is noted for its diminutive size, allowing it to fit into compact setups without sacrificing performance. Its design ensures that it is 100 times smaller and 5 times cheaper than traditional solutions, making it a cost-effective choice for network providers aiming to scale-up infrastructure rapidly with lower environmental impact. Utilizing advanced CMOS technology, the E-TRX-HP boasts low insertion loss and high suppression of out-of-band signals, enhancing both range and quality of wireless transmission. This capability is crucial for maintaining the integrity of signals over longer distances and provides a stable, reliable connection across a network.

Multifractal Semiconductors
28 Views
TSMC
28nm
PLL, RF Modules, Sensor
View Details Datasheet

E-DIP Integrated Diplexer

The E-DIP integrated diplexer is a pioneering product among E-band diplexers, conceived to function within Multifractal's high-performance CMOS-based systems. This product represents a leap in miniaturization and efficiency, designed to be the smallest diplexer available commercially. With its compact size of 3.8 x 4.5 mm, it aligns with current industry demands for more compact components without sacrificing performance. The E-DIP is designed to be highly compatible with various packaging standards including FCCSP and BGA, ensuring that it integrates smoothly with existing systems and new deployments. This compatibility, combined with high out-of-band suppression exceeding 60 dB, makes the E-DIP a critical component for ensuring reliable signal transmission in high-frequency application scenarios. This diplexer achieves a balance of minimal insertion loss and high degree of suppression, which translates to efficient signal management and improved overall network performance. By leveraging BT laminate substrate technology, it exemplifies Multifractal's forward-thinking approach in the deployment of high-functionality, compact form factor components.

Multifractal Semiconductors
27 Views
TSMC
28nm
PLL, RF Modules, Sensor
View Details Datasheet
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