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Global UniChip Corp.

Global UniChip Corporation (GUC) is a leading force in the domain of Application-Specific Integrated Circuit (ASIC) design services, offering comprehensive solutions that span from the conceptual stage to manufacturing. Positioned as an advanced ASIC leader, the company is renowned for its robust capabilities in design and implementation, catering to the complex needs of billion-gate, GHz-frequency system-on-chip (SoC) and subsystem projects. Dedicated to overcoming challenges associated with design for testability, low power solutions, and rapid time-to-market, GUC leverages its extensive expertise to deliver innovative chip implementation strategies. Additionally, GUC's advanced packaging technology plays a crucial role in ensuring high-quality manufacturing processes that range from initial design phases to finished goods, thereby supporting the full lifecycle of product development and deployment. The firm's distinguished IP portfolio, including High Bandwidth Memory and 2.5D/3D interconnect technologies, is tailored to support the demanding requirements of AI, HPC, and 5G networking applications, enhancing the efficiency and functionality of these cutting-edge sectors. GUC is actively involved in collaborative ecosystems, joining prominent platforms like the Arm Total Design ecosystem, which underscores its commitment to delivering groundbreaking solutions and facilitating rapid deployment of advanced semiconductor innovations. The company's strategic alliances and accumulated expertise in chiplet and 3DIC technology further fortify its position as a key player in high-performance computing system integration. With its headquarters located in Hsinchu Science Park, Taiwan, GUC operates with a global outlook, driving innovation through sustainable practices and ethical governance as detailed in their Environmental, Social, and Governance (ESG) reports. Their extensive service offerings include custom IP design and verification, advanced testing services, and end-to-end supply chain management, ensuring a comprehensive suite of solutions that address diverse client needs across various technological landscapes. GUC's unwavering commitment to quality and customer-centric service enables the company to consistently exceed expectations, paving the way for the future of semiconductor development. Through ongoing advancements in their proprietary silicon-proven IP and extensive process node support, GUC stands at the forefront of delivering ASIC solutions that leverage cutting-edge technologies such as TSMC's 3DFabric and CoWoS packaging. Their dedication to innovation and seamless service delivery continues to propel GUC as an indispensable partner for organizations looking to harness next-generation chip designs for transformative applications. Read more

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TCAM Compiler for High-Speed Memory Applications

GUC offers a range of Ternary Content-Addressable Memory (TCAM) compilers designed to address high-speed data network communication requirements, particularly critical for pattern search and specific match functionalities. These functions are integral to modern networked big data applications, such as those used in switches and routers. Leveraging its expertise in design-friendly solutions, GUC ensures high performance with reasonable power consumption, aiding in developing multiple high-speed network products. The TCAM builds on IP that has seen production success, offering redundancy features and various voltages including low voltage threshold (LVT) and ultra-low voltage threshold (ULVT) options. GUC's TCAM compilers are available across advanced nodes like 7nm, 6nm, 16nm, 12nm, and 5nm, giving designers flexibility in deploying powerful yet energy-efficient network solutions across different technology platforms.

Global UniChip Corp.
10 Views
TSMC
8nm LPP, 10nm, 12nm, 12nm FinFET, 90nm
Embedded Memories, NAND Flash
View Details

Mixed-Signal Front-End for Analog Signal Processing

The Mixed-Signal Front-End offerings from GUC are crafted to support a vast array of analog-signal-to-SoC transceiver applications, including wireless analog front-ends, traditional analog-to-digital converters (ADCs), and digital-to-analog converters (DACs). These designs are adept at handling sampling rates from 10KHz to beyond 10GHz, covering an analog signal bandwidth that spans from DC to over 5GHz. This extensive bandwidth capability is crucial for both direct and IQ sampling applications. To ensure optimal performance, GUC's solutions integrate components such as amplifiers, filters, calibration circuits, and high-performing phase-locked loops (PLLs). Especially designed for efficiency in terms of power, area, and cost, these solutions are ideal for communication systems, specifically in the realms of 5G and Wi-Fi, as well as video system applications. In addition to these features, GUC's Mixed-Signal Front-End IPs provide production testing solutions and interfaces compatible with APB, I2C, and JTAG, facilitating seamless integration into custom ASIC designs.

Global UniChip Corp.
9 Views
TSMC
8nm LPP, 12nm, 40nm
A/D Converter, Analog Front Ends, D/A Converter
View Details
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