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The LEE Flash G1 is designed to cater to cost-sensitive embedded flash applications, leveraging a simple SONOS architecture that scales efficiently down to 40nm. This flash technology is perfect for moderate memory capacity needs, typically up to several hundred kilobytes, making it suitable for automotive and power-sensitive tasks. The G1 Flash supports a wide temperature range, enhancing its viability for extreme automotive requirements and ensuring long-term data retention stability. One of the standout features of the LEE Flash G1 is its power efficiency, characterized by low power consumption during program and erase cycles. This efficiency is achieved through Fowler-Nordheim tunneling technology, drastically minimizing power requirements compared to traditional methods. Furthermore, this technology simplifies the integration of flash memory by requiring only 2 to 3 additional masks, reducing the overall cost and complexity of chip fabrication. Operating on a standard CMOS logic process without altering the SPICE model, LEE Flash G1 allows for the re-use of existing IPs and design assets, offering a path to cost savings and simplifying design processes. The G1's architecture also shortens baking and testing times, significantly cutting down on chip production costs while maintaining quality and reliability under rigorous conditions.
The LEE Fuse ZA offers a robust anti-fuse memory solution, optimized for one-time programmable (OTP) applications such as system trimming and memory redundancy setups. This IP eliminates the need for additional manufacturing masks, offering a cost-effective path to integration within wide-ranging process nodes from 180nm down to advanced sub-10nm technologies. Its design, requiring only two or three metal layers, offers flexibility in using upper metal layers for further circuit integration, broadening its applicability across several advanced process technologies. This feature ensures that the LEE Fuse ZA can seamlessly integrate into complex semiconductor environments without the substantial costs usually associated with new IP incorporation. LEE Fuse ZA's support for extensive temperature ranges and long retention periods makes it a valuable resource for automotive standard products requiring severe condition reliability. Its track record spans various manufacturing statuses, making it a mature choice for industries looking for a dependable OTP solution capable of handling modern technology nodes efficiently.
The LEE Flash G2 represents a cutting-edge evolution from its predecessor, offering enhanced memory capabilities and innovative features that cater to advanced electronic requirements. Built upon the proven architecture of the LEE Flash G1, the G2 version incorporates a clever switch transistor array, allowing for direct integration with logic circuits and enabling non-volatile SRAM functionalities. This design maintains a low power profile by not requiring high voltage for read operations and reduces layout complexity by eliminating isolation areas. This innovative flash solution is capable of supporting memory capacities up to several megabytes, making it ideal for applications that demand larger storage space while prioritizing energy efficiency. The G2 architecture also ensures compatibility with existing CMOS platforms without the need for changes in the SPICE model, facilitating the adoption of G2 technology within existing processes seamlessly. Other notable attributes include its suitability for high-temperature environments and long retention times, positioning it as a reliable option for automotive and industrial applications. The use of few additional masks further minimizes costs and accelerates production cycles, making G2 a cost-efficient choice for next-generation flash memory requirements.
The LEE Flash ZT is engineered for automotive and industrial environments where high temperature and durability are critical. What sets the LEE Flash ZT apart is its zero additional mask requirement, significantly reducing manufacturing costs and enabling rapid integration within existing product lines. Its ability to maintain data retention over 20 years at 125°C demonstrates its reliability in demanding applications. Lee Flash ZT supports a wide range of use cases, making it ideal for precision trimming, parameter storage, and sensor integration in high-performance electronic devices. It leverages FN tunneling to achieve ultra-low power during program and erase cycles, which not only cuts down operation costs but also accelerates testing and final product release. Its compact form factor and compatibility with standard CMOS processes allow companies to re-use existing designs and IPs, eliminating the need for bespoke development efforts. This adaptability combined with its performance characteristics makes it a viable solution for manufacturers looking to enhance their product lines without incurring substantial initial investments or production delays.
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