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The NOC-X technology offers a revolutionary approach to interconnect chip architectures, enabling efficient communication pathways across multi-core processors. Aimed at high-demand data-centric applications, it optimizes signal transmission for enhanced processing efficacy and reduced bottlenecks across complex computational frameworks. NOC-X leverages a digital-centric approach to network on chip design, minimizing power consumption without compromising on data exchange speeds. This IP is crucial for scenarios where rapid, reliable communication across various cores is paramount, ensuring that all parts of the system efficiently interact in real-time. This capability is essential for data-heavy industries pushing the boundaries of technology. Supporting tech nodes from 12nm to 28nm, NOC-X is adaptable to a wide range of applications, from consumer electronics to high-performance computing solutions. Its introduction into chiplet technology opens avenues for scalable, adaptable systems that can evolve with advancing technological demands, delivering significant gains in speed and operational efficiency.
The Universal Chiplet Interconnect Express, or UCIe, represents a breakthrough in facilitating communication among chiplets in advanced computing systems. This product aligns with the latest trends in semiconductor manufacturing, focusing on creating a robust interconnect standard that assures compatibility and interoperability between diverse chiplets, revolutionizing modular design methodologies. UCIe's primary strength lies in its architecture, designed to seamlessly integrate into various system configurations. It significantly reduces power consumption while maintaining high throughput, crucial for applications demanding rapid data exchange without sacrificing efficiency. This makes UCIe particularly appealing for industries prioritizing sustainability alongside performance. Engineered for flexibility, UCIe supports tech nodes within the 12nm to 28nm range, thus accommodating cutting-edge semiconductor platforms. By fostering universal chip integration, UCIe sets the stage for enhanced scalability, facilitating developers to explore new horizons in data processing and integration. It's a pivotal tool for engineering teams looking to future-proof their systems with scalable, high-performance chiplet-based architectures.
The High-Speed SerDes technology offered recognizes the growing demand for efficient chiplet-based interconnects. This product is tailored for high-performance computing and communication systems, providing unmatched signal integrity and minimizing latency. Designed to operate at ultra-high speeds, this SerDes solution supports heterogeneous integration, enabling seamless communication between chiplets. Through its innovative digital-centric architecture, the High-Speed SerDes promises low power consumption, making it ideal for energy-conscious applications. It integrates cutting-edge signal processing techniques that enhance data transmission stability, even at extreme speeds. This focus ensures high performance and reliability, vital for mission-critical applications where flawless data exchange between components is non-negotiable. The technology is compatible with mainstream tech nodes ranging from 12nm to 28nm, offering a broad spectrum of versatility and scalability for customers. Its adoption in chiplet ecosystems supports the evolution towards modular, scalable multi-chip packages, laying the foundation for future-proof high-performance interconnect solutions.
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