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This innovative chiplet offers a complete transmission solution, integrating a 16-channel 112G modulator and driver. The chip is designed for optimal performance in transmitting optical signals and features advanced digital control for precision tuning and stability. It is built to support systems requiring high bandwidth and efficient modulation, making it ideal for deployment in next-generation telecommunication networks. The combination of integrated modulator and driver ensures reduced power consumption and higher signal integrity, addressing the needs of modern data center applications.
These optical components serve as foundational elements for building advanced optical systems. Designed to offer flexibility and customization, the building blocks cover a spectrum of applications from simple optical connections to intricate network configurations. They are integral in streamlining the optical design process, providing reliable, high-performance solutions that are pre-tested to meet industry standards. Their adaptability makes them suitable for diverse application scenarios, pushing the boundaries of optical communication technologies.
Enosemi's analog and mixed-signal devices are engineered for seamless integration into advanced photonic circuits, enabling high-speed data processing and signal conversion. These devices leverage cutting-edge technologies to offer both low and high-speed functionalities, catering to a wide range of applications, including telecommunications and data communications. The IP is silicon-verified, which ensures reliability and reduces integration times, offering a cost-effective solution for complex photonic systems.
Enosemi's photonic subsystems offer a comprehensive platform for deploying optical circuits in various high-tech applications. Designed for integration into larger systems, these subsystems enhance the overall functionality and performance of photonic infrastructures. They incorporate high-efficiency components that deliver precision and stability required for demanding environments, such as telecommunications and data centers. The subsystems are built with a keen focus on reducing the time-to-market while improving system reliability and operational efficiency.
The 16x112G Rx Chiplet integrates a complete photodetection and amplification solution, supporting up to 16 channels at 112G each. It features a built-in photodetector and transimpedance amplifier (TIA) to efficiently convert optical signals into electrical outputs. This chiplet is geared towards high-speed, high-throughput applications requiring robust signal processing capabilities. With its digital control interface, the chip provides seamless integration into complex systems, ensuring smooth operation across various frequencies and conditions.
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