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Blue Cheetah Analog Design, Inc.

Blue Cheetah Analog Design specializes in innovative semiconductor intellectual property solutions that emphasize high-performance, low-latency, and customizable die-to-die interconnects for advanced and standard packaging applications. Their flagship product, the BlueLynx, leverages open standards such as the Open Compute Project's Bunch of Wires and Universal Chiplet Interconnect Express, offering a versatile and high-bandwidth interface for various system architectures. With a strong focus on the rapidly evolving chiplet market, Blue Cheetah aims to streamline the transition from traditional Systems-on-Chip (SoCs) to chiplet-based designs. Their solutions are designed to integrate seamlessly with existing technologies like AMBA, ensuring quick deployment and first-pass silicon success, all while maintaining cost-effectiveness and scalability across multiple processes and foundries. The company's innovative approach ensures that their IPs are optimized for high-performance computing, mobile, and AI-related markets, providing customizable and silicon-proven solutions. Blue Cheetah stands out by delivering highly configurable architectures that meet diverse application requirements, from cost-sensitive to performance-intensive implementations. Read more

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BlueLynx Chiplet Interconnect

The BlueLynx Chiplet Interconnect is an adaptive interconnect solution, offering both physical (PHY) and link layer interfaces that support industry standards such as Universal Chiplet Interconnect Express (UCIe) and Open Compute Project Bunch of Wires (BoW). This IP is engineered for seamless integration with network-on-chip systems, leveraging various established standards like AMBA CHI, AXI, and ACE to provide efficient die-to-die subsystem solutions. The advanced customizable architecture of BlueLynx ensures that users can tailor the IP to specific bandwidth and physical requirements, optimizing power-performance-area (PPA) metrics across applications. With compatibility spanning nodes from 16nm, 12nm, 7nm, to as advanced as 3nm and multi-foundry support, this IP is highly adaptable to various packaging needs, whether low-cost or advanced. Incorporating high data rates from 2 Gb/s to above 24 Gb/s, the BlueLynx boasts very low power consumption and latency, achieved through < 0.375 pJ/bit energy efficiency and < 2 ns latency. It includes innovative features like staggered bump pitch options, integrated DLL with duty-cycle correction, and built-in self-test mechanisms, making it a robust choice for high-performance computing, AI, and mobile applications.

Blue Cheetah Analog Design, Inc.
34 Views
TSMC
3nm, 4nm, 5nm, 7nm, 10nm, 12nm, 16nm
AMBA AHB / APB/ AXI, D2D, Gen-Z, MIPI, Modulation/Demodulation, PCI, VGA
View Details Datasheet
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