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I-fuse Replaser is designed to provide a compelling alternative to conventional laser fuses, offering an array of advantages including low programming voltage and time, along with the ability to perform programming post-packaging. The solution excels in reliability, meeting AEC-Q100 Grade 0 standards, and offers a compact footprint of less than 100um2 per bit up to 64 bits. Coupled with its soft programming capabilities, it reduces risks during the testing phases while supporting a broad temperature range during operation.
The I-fuse S3 represents an evolution of the I-fuse technology, boasting a remarkably small footprint especially advantageous for bit densities below 4Kbits. This enhanced architecture improves scalability, maintaining linear growth with increased bit count, and ensuring minimal power consumption with low programming voltages suitable for core or I/O specifications. Its auto-grade capability meets the rigorous standards required in automotive applications, making it a versatile choice across various technological platforms.
I-fuse is a revolutionary one-time programmable (OTP) mechanism that offers a reliable, physically modeled programming process based on heat dissipation and electro-migration. Unlike traditional fuses that can create debris upon breaking, I-fuse ensures a seamless and compact integration by operating without additional mask steps or hidden layers, thereby offering foundry independence. Its robust programming is grounded in true electro-migration physics, ensuring both programmability and high data security, with a short programming time and high reliability even in harsh environments exceeding 150°C.
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