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Aragio's General-purpose I/Os are engineered to meet critical requirements for performance, power, and reliability in IC designs. These circuits incorporate power pads, corner pad cells, breakers, and spacers, designed with a focus on power supply sequencing. They utilize Distributed Power-on-Control (POC) during power up and down. With support for multiple supply voltages, these GPIOs enable system designers to have separate power domain options. The I/O library also features cells for analog and digital I/O isolation, offering programmable GPIOs with input buffers and isolated analog power supplies. These circuits are silicon proven across nodes like 7nm and 130nm, emphasizing versatility and reliability in operation across a diverse range of applications.
Aragio's LVDS (Low Voltage Differential Signaling) solutions are optimized for high-speed data transmission, capable of operating at frequencies up to 1.2 GHz. These I/Os are built around a three-module design comprising input, output, and reference blocks, designed to support differential termination of 50Ω or 100Ω. The LVDS I/O adheres to IEEE standards and is engineered for low power consumption and minimal skew between differential pairs. With support spanning multiple voltage supplies and a wide range of technologies, these solutions are well-suited for applications requiring high-speed, low-jitter signal integrity.
Aragio's ESD protection solution for USB 2.0 hard macro cells provides a comprehensive defense against electrostatic discharge. This innovative design is capable of passing a 4KV ESD test using the Human Body Model (HBM), including a 5-Volt tolerant protection scheme to provide high current capability while minimizing capacitance. The library features power pads that can handle high DC currents exceeding 30 mA at 125°C. For RF, the ESD protection device library optimizes paths for ESD currents up to 6A, utilizing clamp diodes and silicon-controlled rectifiers to deliver robust protection with reduced capacitance. The RF ESD protection is characterized to minimize input resistance drops through metal interconnects, ensuring reliable chip-level ESD analysis.
Aragio Solutions provides a versatile range of memory interface I/O pads supporting various DDR standards, including DDR, DDR2, DDR3, and DDR4. These pads are designed to form a comprehensive padring by abutment and support isolated power domains. Engineering focus on low power consumption and JEDEC compliance ensures high-performance operation at frequencies up to 800MHz for DDR3. The offering includes flexible ODT capabilities for efficient impedance matching, with variations to suit specific requirements. With proven silicon performance across foundries, these interfaces are ideal for integrating into high-performance memory applications.
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