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Analog Bits provides highly customizable and efficient clocking solutions, proven at advanced nodes such as 5nm and 3nm. Their clocking IP encompasses ultra-low jitter and low power fractional and integer PLLs, ideal for integration across a plethora of applications including automotive, server, and consumer electronics. Their clocking IP ensures seamless operation within SOCs, enhancing both performance reliability and power efficiency through specialized designs accessible in high-volume production at leading foundries.
Analog Bits offers a wide range of I/O solutions, including differential clocking/signaling and crystal oscillator IP. These solutions are customized to address specific die-to-die communication needs and ensure high signal integrity. The company's I/O technologies are designed using the fewest number of transistors while maintaining robust signaling quality. These solutions are proven in high-volume production and are fully supported by their expert team to meet various client requirements, offering flexibility for integration into diverse semiconductor environments.
Analog Bits' sensors are engineered for PVT (Process, Voltage, Temperature) monitoring, specifically designed to oversee both on-chip and system-level power. Noteworthy for their small footprint, these sensors are silicon proven at advanced nodes like 5nm and 3nm. Beyond traditional applications, they are essential in scenarios where security is a concern, being capable of detecting voltage spikes during potential hacks. The sensors' integration onto the die contributes to energy-efficient software load balancing.
The SERDES (Serializer/Deserializer) solutions offered by Analog Bits are recognized for their low power consumption and customization adaptability to meet unique requirements. With proven capabilities in 8nm, 7nm, and 5nm process nodes, these SERDES support multi-protocols including PCIe Gen 4/5, SAS, and USB, making them a versatile choice for a variety of high-performance applications. The products are engineered to offer flexibility in placement and support unlimited lane count, ensuring optimal functionality across various platform requirements. Their small die area and reduced latency enhance chip-to-chip communication efficiency.
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