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All IPs > Wireline Communication > Interleaver/Deinterleaver

Interleaver/Deinterleaver Semiconductor IP Solutions

In the realm of wireline communication, interleavers and deinterleavers play a crucial role in ensuring data integrity and enhancing signal reliability. These components are vital in the preprocessing of data, often used in communication protocols to rearrange digital signals, which enables the system to counteract errors introduced during data transmission. Interleaver/Deinterleaver semiconductor IP solutions are designed to offer this functionality in a highly efficient manner, frequently optimizing the performance of digital communication systems.

The main function of an interleaver is to rearrange input data into a non-sequential order before transmission. This process effectively disperses error bursts that commonly occur in wireline communication. When these errors are scattered across the data stream, they become easier to manage and correct using error correction codes. On the other side of the transmission, a deinterleaver reassembles the data back into its original sequence, ready for decoding and further processing.

Interleaver/Deinterleaver semiconductor IPs cater to various applications in communications like DSL, fiber optics, and other high-speed data transmission technologies. By facilitating this reordering process, these IPs help ensure that the communication link maintains high fidelity even in environments susceptible to noise and interference. This capability is invaluable for maintaining robust and reliable connections, which are essential in applications ranging from internet infrastructure to enterprise networking solutions.

Products in this category are engineered for performance and scalability, accommodating the needs of both consumer and industrial-grade technologies. This includes supporting diverse data rates and modulation techniques, which are critical in optimizing the transmission capabilities of wireline systems. Through these highly specialized semiconductor IPs, developers can integrate advanced error management and correction methods, ultimately enhancing the overall efficiency of the communication systems they are designing.

All semiconductor IP
4
IPs available

M-PHY

The M-PHY serves as a high-performance physical layer targeted at energy-sensitive applications in mobile and wearable technologies. Engineered for speed without excessive power draw, the M-PHY finds its place in environments where long-lasting performance is crucial. The architecture is modular, adapting to various data rates and power management states, enabling it to align with the stringent power requirements of modern electronics, such as smartphones and portable IoT devices. The integration-ready IP supports a multitude of technology nodes, ensuring compatibility across a wide spectrum of manufacturing settings.

Mixel Inc
34 Views
GLOBALFOUNDARIES, TSMC, UMC
22nm, 28nm, 32/28nm, 65nm
Analog Front Ends, Interleaver/Deinterleaver, MIPI, NAND Flash
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SpaceWire Node

The SpaceWire Node by SoC-e provides a reliable platform for high-speed data transfer across space and satellite networks. This node is fully compliant with the ECSS-E-ST-50-12C space standard, ensuring it meets rigorous industry requirements for space communications. SpaceWire Nodes are integral to satellite systems, facilitating real-time communication between different modules within spacecraft. By providing communication speeds up to 200 Mbps, these nodes enhance data throughput without compromising on reliability or data integrity. With built-in AXI4-Lite management interfaces and statistic registers, the SpaceWire Node supports efficient data handling and monitoring, making it a critical component for robust aerospace networking solutions. It offers seamless interoperability with existing space communication protocols and systems, facilitating expansive networks of connected satellite nodes.

System-on-Chip Engineering, S.L. (SoC-e)
26 Views
FlexRay, Interleaver/Deinterleaver, OBSAI, Optical/Telecom, VESA
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Altera Stratix 10 SoC

The Altera Stratix 10 SoC is a powerful module utilizing Intel's Stratix FPGA technology to achieve remarkable levels of data processing and bandwidth handling. Its design incorporates high-speed transceivers and extensive logic capabilities, suited for applications in data centers and communications. The embedded system-on-chip (SoC) form factor ensures efficient data management and processing within compact spaces. Supporting advanced connectivity options, including PCI Express and Ethernet, this module paves the way for rapid data transfer and enhanced computational tasks. With its focus on applications that demand high reliability and performance, the Stratix 10 SoC is a perfect fit for industries requiring robust embedded solutions.

Reflex CES
21 Views
Intel Foundry
16nm, 22nm
AI Processor, Interleaver/Deinterleaver, Multiprocessor / DSP, Processor Core Dependent, Processor Core Independent, Standard cell
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Digital Down Conversion

Digital Down Conversion (DDC) is instrumental in translating high-frequency signals down to a baseband frequency, making them easier to process and analyze. The technology integrates a carrier selector, frequency down converter, filter, and decimator, each playing a pivotal role in transforming signals into a more manageable form without sacrificing data integrity. Faststream Technologies' DDC is designed to provide accurate frequency conversion, ensuring that signals maintain their integrity through each processing stage. It efficiently utilizes filtering techniques to eliminate noise and unwanted frequencies, while the decimator optimizes sampling rates for better data handling. DDC is particularly essential in applications where signal clarity and precision are crucial, such as in wireless communication systems. It enables efficient data processing, reducing complexity while maintaining high-quality signal outputs, which is vital for advanced digital communication infrastructure.

Faststream Technologies
17 Views
3GPP-5G, Interleaver/Deinterleaver, Modulation/Demodulation, RF Modules
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