All IPs > Memory Controller & PHY > DDR
In the realm of semiconductor IPs, the DDR Memory Controller & PHY category is pivotal in the development of advanced digital electronics. DDR, or Double Data Rate, is a form of synchronous dynamic random-access memory (SDRAM) that is widely used in computing and communication applications. The Memory Controller & PHY (Physical Layer) semiconductor IPs are instrumental in managing the interface between memory modules and processors, ensuring efficient data transfer and system performance.
The DDR Memory Controller is responsible for managing data flow and memory access, optimizing the interaction between the CPU and memory. It oversees tasks such as read/write operations, refresh cycles, and power management. These controllers are critical in applications ranging from high-performance computing and gaming to automotive systems and mobile devices, where speed and reliability are paramount.
Meanwhile, the PHY layer serves as a bridge between the digital domain of the memory controller and the analog world of the physical memory chips. It handles the electrical signaling necessary for data transmission, which includes tasks such as clocking, signaling, and interfaces. The integration of PHY semiconductor IPs ensures that signals are transmitted and received accurately across the memory interface, minimizing errors and maximizing throughput.
Silicon Hub offers an extensive range of DDR Memory Controller & PHY semiconductor IPs, catering to the needs of system designers aiming to enhance data processing speeds and energy efficiency. By implementing these IPs, developers can significantly reduce time-to-market, minimize design risks, and attain higher performance levels in their products. Whether you are developing next-generation consumer electronics, networking devices, or embedded systems, DDR Memory Controller & PHY semiconductor IPs form the backbone of robust and efficient memory systems.
Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features: Compliance with JEDEC's JESD82-511 Maximum SCL Operating speed of 12.5MHz in I3C mode DDR5 server speeds up to 4800MT/s Dual-channel configuration with 32-bit data width per channel Support for power-saving mechanisms Rank 0 & rank 1 DIMM configurations Loopback and pass-through modes BCOM sideband bus for LRDIMM data buffer control In-band Interrupt support Packet Error Check (PEC) CCC Packet Error Handling Error log register Parity Error Handling Interrupt Arbitration I2C Fast-mode Plus (FM+) and I3C Basic compatibility Switch between I2C mode and I3C Basic Clearing of Status Registers Compliance with JESD82-511 specification I3C Basic Common Command Codes (CCC) Applications: RDIMM LRDIMM AI (Artificial Intelligence) HPC (High-Performance Computing) Data-intensive applications
The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA
KPIT offers tailored solutions that aid in transforming traditional internal combustion engine vehicles into efficient electric and hybrid powertrains. These solutions emphasize reducing the total cost of ownership for new energy vehicles while enhancing their product quality and compliance with global sustainability standards. KPIT's integrative approach includes ready-to-use software platforms that streamline development processes and ensure seamless updates and validations, supporting the shift towards a sustainable future.
This LPDDR4/4X/5 Secondary/Slave PHY provides sophisticated memory-side interfacing capabilities that support AI processors and next-gen ASIC designs. It effectively integrates with devices requiring high-speed, low-power LPDDR communication, aligning with international JEDEC standards. While designed for usage on TSMC's 7nm technology, this IP can adapt to other processes, expanding its scope across advanced and emerging memory technologies such as DRAM and various non-volatile options.
The DDR5/4 PHY & Memory Controller from SkyeChip presents an outstanding solution for high-performance and power-efficient memory interfacing, adhering strictly to the DDR5 (JESD79-5) and DDR4 (JESD79-4) standards. This single solution offers a comprehensive PHY & Controller setup with a remarkable efficiency of over 85%. It supports data rates up to 4800 MT/s and can be upgraded to 6400 MT/s, making it ideal for a variety of applications. SkyeChip's design includes advanced I/Os and configurable training sequences, providing flexibility and robustness in supporting diverse SDRAM modules and ranks, and allowing for seamless integration into complex memory systems.
SkyeChip’s LPDDR5/5X PHY & Memory Controller is the epitome of efficiency and performance tailored for cutting-edge mobile and portable devices. Conforming to the LPDDR5/5X (JESD209-5C) JEDEC standards, it offers a PHY & Controller integration that achieves over 85% efficiency, handling speeds up to 6400 MT/s with an option to leap to 10667 MT/s. It supports multiple SDRAM configurations, including x8, x16, and x32, and addresses up to 32Gb, ensuring superior performance for a wide array of applications. This solution encompasses advanced I/O designs and training sequences, accommodating varying device specifications and memory interfacing needs.
At the forefront of memory interfaces, Dolphin Technology’s DDR PHY IPs offer exceptional performance and versatility for modern applications. This IP suite is designed to support DDR4, DDR3, and DDR2 standards, as well as LPDDR series memories. Notably, these DDR PHYs are engineered to reach speeds up to 4266 Mbps, ensuring compatibility with high-performance computing requirements. The DDR PHY IPs include features such as slew rate control, per-bit de-skew, gate training, and built-in self-test (BIST), all contributing to their robustness and adaptability in various system environments. They are compliant with the DFI 4.0 specification, providing seamless integration with DDR memory controllers to deliver comprehensive memory subsystem solutions. With proven reliability in silicon, these PHYs have been designed to efficiently integrate into SoCs, offering a high degree of speed and data integrity for advanced semiconductor applications. This makes them suitable for an array of high-performance tasks in industries ranging from consumer electronics to data center operations.
The DDR Memory Controller, also known as OMC, is engineered for optimal performance in next-gen SoCs, focusing on high utilization and minimal latency. With its proprietary out-of-order scheduling algorithm, the controller ensures over 90% DRAM utilization. It supports various DRAM types, facilitating integration with different PHYs and optimizing both area and power consumption. The architecture is designed to deliver maximum DRAM bandwidth while automating power management, making it ideal for applications demanding efficiency in both performance and power use.
SkyeChip's HBM3 PHY & Memory Controller is an advanced memory interface solution optimized for AI, HPC, data centers, and networking applications. It conforms to the HBM3 (JESD238A) JEDEC standards, ensuring compatibility and reliability. The solution supports a seamless integration of PHY and Controller functions, achieving a remarkable average random efficiency of over 85%. Capable of handling up to 6400 MT/s for HBM3, and extending up to 9600 MT/s for future-proofing with HBM3E. This memory controller supports up to 32Gb density per die and utilizes state-of-the-art 2.5D/3D packaging technologies to cater to diverse design architectures, including interposer designs and memory repairs.
The DDR PHY is designed to meet stringent demands in high-performance and low-power computing environments. Its mixed-signal architecture tackles challenges such as impedance drift and clock phase shifts, ensuring uninterrupted operation and efficient DRAM integration. Key features include programmable timing for flexibility, low latency in read/write operations, and tight integration with memory controllers to manage bandwidth effectively. The PHY supports multiple DRAM types, including LPDDR and GDDR variants, and is available across several process nodes, ensuring broad applicability for various design requirements.
Wasiela's DVB-S2-LDPC-BCH is engineered to deliver robust forward error correction (FEC) essential for digital video broadcasting, particularly over satellite applications. It efficiently combines LDPC and BCH codes to offer near error-free operation, closely approaching the Shannon limit. This capability ensures high-quality, reliable broadcast signals, even in challenging conditions, adhering to ETSI EN 302 307-1 standards.
The Universal Multi-port Memory Controller (UMMC) caters to demanding applications requiring high bandwidth and low power. Supporting a range of memory technologies, including RLDRAM and DDR variations, it emphasizes reliable performance under high-frequency operations. Its design facilitates easy integration into high-performance networking and consumer electronics, providing swift power management and upgradeable debug systems.
The ONNC Calibrator is crafted to optimize AI System-on-Chips by employing post-training quantization (PTQ) techniques to maintain high precision, especially in architectures using fixed-point formats like INT8. By leveraging architecture-aware quantization, it ensures chips retain 99.99% accuracy, offering unparalleled precision control across diverse hardware configurations. This calibrator supports configurable bit-width architectures, allowing the balance of precision and performance to be tailored for various applications. Capable of working with different AI frameworks such as ONNX and PyTorch, the calibrator aligns seamlessly with standard PTQ workflows without needing complex retraining. Its internal AI engine autonomously determines optimal scaling factors, making it an indispensable tool in maintaining model accuracy while reducing computational demand.
The High Speed Adaptive DDR Interface is a pioneering technology that incorporates patented adaptive features to efficiently handle process, voltage, and temperature variations within a system. This interface is designed to optimize both high performance and low power consumption, making it suitable for diverse market sectors such as data centers, 5G, mobile, ADAS, AI/ML, IoT, and display technologies. Supporting DDR3/4/5, LPDDR3/4/5, and HBM standards, this interface boasts a wide range of compatibility with process nodes from 65nm to 7nm. Looked upon as a reliable choice by industry leaders, this DDR System from Uniquify addresses the crucial need for system reliability and performance enhancement. Its patented Self Calibrating Logic (SCL) efficiently eliminates unnecessary logic gates, reducing power consumption and ensuring the least latency by replacing FIFO with flops. Furthermore, it automatically corrects for bit-to-bit skew, providing a clean output signal for optimal performance. Uniquify's DDR interface holds a significant patent portfolio, with 24 US patents awarded since 2006, underscoring its commitment to innovation. Its adaptive elements support a broad array of applications, ensuring the highest yield and reliability for any given system, in turn fostering increased power efficiency and performance effectiveness.
MEMTECH's D-Series DDR5/4/3 PHY excels in providing a highly reliable, high-speed memory interface solution perfect for sophisticated computing needs. Engineered to support data rates up to 6400 Mbps, it brings about superior performance suitable for devices using registered and load-reduced DIMMs. The D-Series PHY features advanced calibration routines and supports both hardware and software-based techniques, ensuring high accuracy and precision in real-world usage. The PHY's digital calibration modules offer optional settings such as DLL tuning, write leveling, and data eye training, which can be customized to meet varied application requirements. This level of configurability reduces integration complexity and enhances interoperability with MEMTECH's DDR Controller, employing a DFI 5.0 interface for seamless collaboration in complex designs. Not only does this PHY support innovative signal processing techniques like CTLE and DFE equalizations for clear data paths, but it also ensures optimal performance under varying conditions with DQS-DQ delay calibrations and more. It establishes benchmarks in energy conservation through full DLL off-support, crucial for minimizing power in high-efficiency drives.
TwinBit Gen-1 is NSCore's innovative embedded non-volatile memory solution specifically designed to work with logic-based systems across 180nm to 55nm process nodes. Renowned for its high endurance, this memory solution supports over 10,000 program cycles, making it both robust and reliable for a wide variety of applications. TwinBit Gen-1 is seamlessly integrated into CMOS logic processes, requiring no additional masks or processing steps, which facilitates easy adoption within existing semiconductor manufacturing workflows. The TwinBit Gen-1 range includes a flexibility of memory sizes from 64 to 512 Kbits, which makes it an ideal choice for functions such as analog trimming and the storage of security keys. Applications also extend to systems where ASIC/ASSP implementations require secure and efficient non-volatile storage. The solution's high density and compact area use ensure that it is well-suited for devices that prioritize space efficiency without compromising on performance. TwinBit Gen-1 offers automotive-grade quality under the AEC-Q100 standards, supporting low-voltage and low-power operations that align with modern energy efficiency requirements. A built-in test circuit aids in simplifying stress-free testing environments, enabling easy verification and validation in various industrial applications. The process compatibility further enhances TwinBit’s appeal, allowing for fast, cost-effective deployment in cutting-edge technology environments.
TwinBit Gen-2 from NSCore extends the capabilities of embedded non-volatile memory solutions to support advanced process nodes ranging from 40nm to 22nm and beyond. Like its predecessor, the TwinBit Gen-2 integrates seamlessly into CMOS logic processes without necessitating additional masks or modifications to existing workflows. This solution is designed with ultra-low-power operations in mind, reducing energy consumption significantly across its applications. The Gen-2 iteration utilizes the Pch Schottky Non-Volatile Memory Cell technology, which optimizes the programming and erasing processes through controlled carrier injection, making it both efficient and reliable. This approach to design ensures that the TwinBit Gen-2 can perform at high efficiency without increasing the complexity or cost of implementation. The technical advancements in this generation make it a suitable option for high-performance applications that demand substantial data security and energy efficiency. Ideal for a variety of uses, the TwinBit Gen-2 caters to needs such as security data storage, system configuration updates, and more sophisticated electronic control mechanisms. The advanced cell design and operation modes position the TwinBit Gen-2 as a leading choice for next-generation semiconductor solutions seeking to balance performance with efficiency and security.
Dyumnin Semiconductors' RISCV SoC is a powerful, 64-bit quad-core server-class processor tailored for demanding applications, integrating a multifaceted array of subsystems. Key features include an AI/ML subsystem equipped with a tensor flow unit for optimized AI operations, and a robust automotive subsystem supporting CAN, CAN-FD, and SafeSPI interfaces.\n\nAdditionally, it includes a multimedia subsystem comprising HDMI, Display Port, MIPI, camera subsystems, Gfx accelerators, and digital audio, offering comprehensive multimedia processing capabilities. The memory subsystem connects to various prevalent memory protocols like DDR, MMC, ONFI, NorFlash, and SD/SDIO, ensuring vast compatibility.\n\nThe RISCV SoC's design is modular, allowing for customization to meet specific end-user applications, offering a flexible platform for creating SoC solutions with bespoke peripherals. It also doubles as a test chip available as an FPGA for evaluative purposes, making it ideal for efficient prototyping and development workflows.
The DDR and LPDDR solutions offered by InPsytech address the needs for high-performance memory interfaces in complex electronic environments. These interfaces integrate combo PHY options that support both DDR and LPDDR standards, ensuring versatility and adaptability in design applications where memory performance is critical. They are suitable for use in high-speed computing and mobile applications.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus Note: **JESD302-1A** and also we have **JESD302-1**
Brite Semiconductor offers a comprehensive YouDDR solution that includes a DDR controller, PHY, and I/O. This package is complemented by specially developed tuning and testing software to ensure seamless operation. YouDDR stands out with its capability to support various DDR applications such as LPDDR2, DDR3, LPDDR3, DDR4, and LPDDR4/4x, with data transfer rates ranging from 667 Mbps to 4266 Mbps. One of the hallmarks of the YouDDR system is its integration of high-speed performance with low power consumption, crafting an unparalleled DDR experience. It incorporates unique Dynamic Self Calibration Logic (DSCL) and Dynamic Adaptive Bit Calibration (DABC) technologies. These features automatically compensate for device variability caused by changes in chip design, voltage, temperature, and process variations, enhancing the robustness of data transfer. YouDDR's full suite of DDR solutions is designed to offer clients high performance, energy efficiency, compact size, and rapid market deployment. This system prioritizes flexibility, offering customizable features like multiple protocol support, comprehensive DFI 4.0 compliance, and optional features like Combo PHYs for broader application support.
DDR Solutions encompass a comprehensive range of DDR technologies designed to enhance memory bandwidth and efficiency within various computing environments. Constant updates ensure they are aligned with the current standards, maintaining backward compatibility to support earlier DDR generations. These solutions support DDR, DDR2/3/4/5, and LPDDR configurations, making them suitable for everything from consumer electronics to computational servers. They include memory interfaces and PHY elements, which are critical in optimizing system performance and stability. The advanced capabilities of DDR Solutions make them ideal for developers aiming to exploit high-speed memory interfaces in their designs. Whether dealing with desktop computers, mobile devices, or complex server architecture, these solutions provide the necessary framework to enhance memory performance significantly.
M31's LPDDR4/4X IP is a robust DDR solution, supporting memory interfaces up to 4267Mbps. Ideal for applications demanding high performance and energy efficiency, such as mobile and automotive systems, it is equipped with configuration flexibility to adapt to various system layouts and process requirements.
Terefilm® Photopolymer is an advanced material solution designed to tackle critical challenges in the semiconductor industry such as precision mass transfer, high-resolution photolithography, and temporary bonding-debonding. Its unique characteristics include a perfect blend of precise patternability, clean decomposition, and low activation energy, making it ideal for high-throughput semiconductor applications that demand stringent cleanliness and precise control. Terefilm® is engineered to offer thermal stability up to 180°C, integrating seamlessly into high-temperature manufacturing processes. Upon exposure to low-energy UV irradiation, Terefilm®'s decomposition temperature is significantly reduced, necessitating substantially lower energy for vaporization. This reaction, assisted by photo-acid generators similar to those in photoresists, occurs almost instantaneously, vaporizing the material without leaving residues. This clean transformation from a solid to an entirely gaseous phase ensures that the transition leaves no particulates, setting Terefilm apart in applications requiring absolute cleanliness. One of the standout features of Terefilm® is its low activation energy, which allows it to function efficiently under the fluence threshold of most mask materials, facilitating processes like MicroLED mass transfer. It contributes to reducing operational costs while extending the lifespan of lasers and optics involved in LIFT systems, offering a more cost-effective alternative to traditional ablation methods. The polymer's design allows for precise component transfers, high-resolution patterning, and the delicate release of bonded wafers, supporting an array of semiconductor process innovations.
Eliyan's NuLink Die-to-Memory (D2M) PHY technology enables robust communication between logic dies and memory dies using standard packaging solutions. By offering high-speed data transfer rates and low latency operations, this technology is critical in overcoming traditional memory wall challenges in advanced computing systems. The technology supports seamless, high-efficiency interconnects creating a perfect synergy between computational and memory components within a single package. As opposed to conventional unidirectional solutions, the D2M technology from Eliyan provides a bidirectional data flow in a low-power, high-performance framework. This increases the throughput efficiency enabling intensive data-driven applications to optimize their processing cycles effectively. Additionally, the NuLink D2M PHY supports configurable bump map layouts, facilitating seamless integration into various industry-standard protocols and enhancing its adaptability for different design architectures. This solution is engineered for situations where separation between high-temperature processors and heat-sensitive memory components is crucial. It achieves interposer-like performance levels without the cost implications of advanced silicon interposer technologies, making it ideal for scalable high performance applications demanding extensive memory interaction.
KNiulink's DDR product line offers advanced architecture and cutting-edge technology to provide high-performance, low-power DDR3, DDR4, DDR5, and LPDDR IP solutions. Tailored for customer needs, these solutions uphold exceptional efficiency and power consumption standards, making them suitable for a wide array of applications from data centers to mobile devices. The lineup includes a diverse range of options such as DDR3/4/5 and LPDDR2/3/4/4x/5, ensuring compatibility for various performance demands and power budgets.
The FPGA Pre-Trade Risk Check provides an immediate analysis of trade conditions before they are executed, ensuring adherence to regulatory and financial constraints. This product utilizes the high-speed processing capabilities of FPGAs to swiftly assess trade parameters, offering banks and financial institutions a reliable method to mitigate operational risk. The risk check process is executed in real-time, thus reducing the potential for slippage and ensuring trade compliance.
The ORBIT Memory Subsystem is a highly integrated solution that combines interconnects, memory controllers, and PHYs to create a synergistic memory management environment. Primarily targeted at AI chips, it offers features like reduced latency, energy conservation, and broad DRAM protocol support, which are crucial for extending product lifecycles and increasing competitive edge. The product includes ActiveQoS technology that ensures low-latency memory access and optimal traffic management. By leveraging an automated configuration system, users can easily adapt the memory subsystem to diverse application requirements, making it a versatile solution for various market demands.
Green Mountain Semiconductor's LPDDR5 PHY represents the frontier of memory-side interface technology within high-performance DRAM applications. It effectively bridges AI co-processors and in-memory compute solutions, delivering exceptional data handling efficiency. Adhering to JEDEC's stringent LPDDR5 standards, this robust interface is crafted for TSMC's 7nm process but allows adaptability to other fabrication technologies. The IP empowers devices to achieve high throughput and low power consumption, appealing to a wide array of memory configurations, including novel non-volatile solutions.
The LPDDR4/4X/5 PHY from Green Mountain Semiconductor is a cutting-edge memory interface solution designed for seamless data transmission across a spectrum of modern devices, including AI co-processors and in-memory compute systems. It strictly adheres to JEDEC standards, ensuring high-speed and low-power protocols are maintained throughout. This IP is tailored for integration in TSMC's 7nm process technology, yet holds the flexibility to be adapted to other logic processes. Its versatility makes it ideal for deploying across a vast range of memory types, from DRAM and SRAM to emerging non-volatile memory technologies.
This LPDDR5X PHY offers a sophisticated interface solution, expertly designed to support high-speed and energy-efficient data transactions for AI processors and versatile ASIC applications. It respects JEDEC's LPDDR5X specifications, making it ideal for DRAM, SRAM, and emerging memory products. Initially targeted towards the 7nm TSMC node, its architecture allows for expansion to different process technologies, making it a flexible and future-proof choice for cutting-edge data-intensive tasks.
Synopsys offers a robust DDR Memory Interface solution to facilitate efficient memory management in digital systems. This IP is designed to handle a variety of DDR standards, offering flexibility in adapting to different memory needs within SoC designs. Its high-bandwidth support ensures that memory access speeds are optimized, enhancing overall system performance. The DDR Memory Interface IP is equipped with advanced power management features, which help in reducing power consumption during memory operations. This is particularly beneficial for portable devices and applications where energy efficiency is a priority. Additionally, the IP's design supports high-density memory configurations amenable to various data-centric applications. Providing a reliable bridge between the processor and memory, the DDR Memory Interface assists in maintaining data integrity and consistent performance. Synopsys backs this technology with extensive verification and validation tools to ensure smooth integration into complex system architectures, supporting developers with comprehensive technical support and documentation.
Designed for maximum compatibility, the LPDDR4X PHY serves as a highly-efficient memory interface, particularly suited for integration within commodity DRAM products. This solution is crafted to handle the complexities of AI and in-memory computing by facilitating high-speed, low-power data transfer. Built on 7nm technology from TSMC, this interface paves the way for innovative applications across various memory types, offering a robust foundation for AI processors and advanced ASIC designs seeking enhanced performance without compromises.
InnoSilicon's GDDR7 PHY and Controller is a complete solution aligned with JEDEC's GDDR7 standard that supports high-bandwidth applications. It facilitates data transfer rates of up to 32Gbps using PAM3 signaling, which enhances data throughput while maintaining lower power consumption. Utilizing advanced FinFET processes, this IP is ideal for graphics-intensive applications and high-performance computing environments, providing a solid foundation for integrating with high-speed memory controllers. The flexible integration allows for seamless incorporation into various system architectures, promoting efficient design cycles and downstream testing.