All IPs > Memory Controller & PHY > DDR
In the realm of semiconductor IPs, the DDR Memory Controller & PHY category is pivotal in the development of advanced digital electronics. DDR, or Double Data Rate, is a form of synchronous dynamic random-access memory (SDRAM) that is widely used in computing and communication applications. The Memory Controller & PHY (Physical Layer) semiconductor IPs are instrumental in managing the interface between memory modules and processors, ensuring efficient data transfer and system performance.
The DDR Memory Controller is responsible for managing data flow and memory access, optimizing the interaction between the CPU and memory. It oversees tasks such as read/write operations, refresh cycles, and power management. These controllers are critical in applications ranging from high-performance computing and gaming to automotive systems and mobile devices, where speed and reliability are paramount.
Meanwhile, the PHY layer serves as a bridge between the digital domain of the memory controller and the analog world of the physical memory chips. It handles the electrical signaling necessary for data transmission, which includes tasks such as clocking, signaling, and interfaces. The integration of PHY semiconductor IPs ensures that signals are transmitted and received accurately across the memory interface, minimizing errors and maximizing throughput.
Silicon Hub offers an extensive range of DDR Memory Controller & PHY semiconductor IPs, catering to the needs of system designers aiming to enhance data processing speeds and energy efficiency. By implementing these IPs, developers can significantly reduce time-to-market, minimize design risks, and attain higher performance levels in their products. Whether you are developing next-generation consumer electronics, networking devices, or embedded systems, DDR Memory Controller & PHY semiconductor IPs form the backbone of robust and efficient memory systems.
Overview: The DDR5 RCD Controller is a registering clock driver utilized in DDR5 RDIMMs and LRDIMMs. It buffers the Command/Address (CA) bus, chip selects, and clock signals between the host controller and DRAMs. Additionally, it establishes a BCOM bus to control data buffers in LRDIMMs. Key Features: Compliance with JEDEC's JESD82-511 Maximum SCL Operating speed of 12.5MHz in I3C mode DDR5 server speeds up to 4800MT/s Dual-channel configuration with 32-bit data width per channel Support for power-saving mechanisms Rank 0 & rank 1 DIMM configurations Loopback and pass-through modes BCOM sideband bus for LRDIMM data buffer control In-band Interrupt support Packet Error Check (PEC) CCC Packet Error Handling Error log register Parity Error Handling Interrupt Arbitration I2C Fast-mode Plus (FM+) and I3C Basic compatibility Switch between I2C mode and I3C Basic Clearing of Status Registers Compliance with JESD82-511 specification I3C Basic Common Command Codes (CCC) Applications: RDIMM LRDIMM AI (Artificial Intelligence) HPC (High-Performance Computing) Data-intensive applications
The SPD5 Hub Function IP has been developed to interface I3C/I2C Host Bus and it allows an isolation of local devices like Temperature Sensor(TS), from master host bus. This SPD5 has Two wire serial interface like SCL, SDA
This LPDDR4/4X/5 Secondary/Slave PHY provides sophisticated memory-side interfacing capabilities that support AI processors and next-gen ASIC designs. It effectively integrates with devices requiring high-speed, low-power LPDDR communication, aligning with international JEDEC standards. While designed for usage on TSMC's 7nm technology, this IP can adapt to other processes, expanding its scope across advanced and emerging memory technologies such as DRAM and various non-volatile options.
KPIT's propulsion technologies cover both traditional internal combustion engines and modern electric powertrains. By focusing on reducing the total cost of ownership for new energy vehicles, KPIT helps OEMs streamline development cycles and enhance vehicle quality. The company's platform supports agile software updates and sustains efforts on sustainable practices by increasing offerings in zero-emission vehicles (ZEVs) and exploring alternative fuels like hydrogen. With solutions spanning engine subsystems, transmission, and driveline optimization, KPIT addresses the intricate balance needed between legacy and emerging automotive platforms.
SkyeChip’s LPDDR5/5X PHY & Memory Controller is the epitome of efficiency and performance tailored for cutting-edge mobile and portable devices. Conforming to the LPDDR5/5X (JESD209-5C) JEDEC standards, it offers a PHY & Controller integration that achieves over 85% efficiency, handling speeds up to 6400 MT/s with an option to leap to 10667 MT/s. It supports multiple SDRAM configurations, including x8, x16, and x32, and addresses up to 32Gb, ensuring superior performance for a wide array of applications. This solution encompasses advanced I/O designs and training sequences, accommodating varying device specifications and memory interfacing needs.
The DDR5/4 PHY & Memory Controller from SkyeChip presents an outstanding solution for high-performance and power-efficient memory interfacing, adhering strictly to the DDR5 (JESD79-5) and DDR4 (JESD79-4) standards. This single solution offers a comprehensive PHY & Controller setup with a remarkable efficiency of over 85%. It supports data rates up to 4800 MT/s and can be upgraded to 6400 MT/s, making it ideal for a variety of applications. SkyeChip's design includes advanced I/Os and configurable training sequences, providing flexibility and robustness in supporting diverse SDRAM modules and ranks, and allowing for seamless integration into complex memory systems.
At the forefront of memory interfaces, Dolphin Technology’s DDR PHY IPs offer exceptional performance and versatility for modern applications. This IP suite is designed to support DDR4, DDR3, and DDR2 standards, as well as LPDDR series memories. Notably, these DDR PHYs are engineered to reach speeds up to 4266 Mbps, ensuring compatibility with high-performance computing requirements. The DDR PHY IPs include features such as slew rate control, per-bit de-skew, gate training, and built-in self-test (BIST), all contributing to their robustness and adaptability in various system environments. They are compliant with the DFI 4.0 specification, providing seamless integration with DDR memory controllers to deliver comprehensive memory subsystem solutions. With proven reliability in silicon, these PHYs have been designed to efficiently integrate into SoCs, offering a high degree of speed and data integrity for advanced semiconductor applications. This makes them suitable for an array of high-performance tasks in industries ranging from consumer electronics to data center operations.
Wasiela's DVB-S2-LDPC-BCH provides a sophisticated forward error correction system designed for digital video broadcasting applications, particularly suited for satellite transmission. This product combines low-density parity-check (LDPC) codes with Bose Chaudhuri Hocquenghem (BCH) codes to achieve quasi error-free operation, operating effectively close to the Shannon limit.<br><br>The implementation boasts an irregular parity check matrix and layered decoding to increase decoding efficiency. The minimum sum algorithm is utilized for optimal performance with soft decision decoding capabilities that allow for higher error correction. This product also complies with ETSI EN 302 307-1 V1.4.1 standards, ensuring high quality and reliability in digital transmission systems.<br><br>Additional functionalities include a BCH decoder adept at correcting multiple errors per codeword, making this solution an ideal choice for ensuring data integrity in demanding satellite communication conditions. Wasiela offers this IP complete with synthesizeable Verilog code, a system model in Matlab, and thorough documentation, ensuring a smooth integration process for any application.
OPENEDGES' DDR Memory Controller, known as OMC, boasts an innovative architecture that ensures high utilization and ultra-low latency, crafted to address next-gen SoC needs efficiently. With proprietary scheduling algorithms, it achieves optimal performance, particularly when paired with its proprietary ORBIT DDR PHY and on-chip interconnect. This memory controller supports diverse DRAM memory types, including LPDDR5x/5/4x/4/3, DDR4/3, and GDDR6, offering high configurability. It automatically manages dynamic frequency scaling and DRAM power, ensuring low power consumption while maintaining high area efficiency. Its out-of-order scheduling allows it to handle peak latencies, crucial in high-performance scenarios. Integrating seamlessly within client ecosystems, OMC's robust design adapts well to third-party DDR PHYs, guaranteeing comprehensive compatibility. This adaptability, along with its security features like ECC and a security firewall, makes it an ideal choice for secure high-speed applications.
The Digital Blocks DB9000-AXI Multi-Channel DMA Controller is a robust IP core supporting extensive data transfer protocols through its multi-channel architecture. Each channel operates independently, enabling efficient management of diverse data streams concurrently. Designed for high throughput, this controller supports various burst transfer sizes and integrates seamlessly with the AXI interconnect fabric, offering exceptional performance in data-heavy applications such as computing and network processing. Its architecture supports user-programmed features to tailor data transfer strategies, optimizing system performance and reducing power consumption.
SkyeChip's HBM3 PHY & Memory Controller is an advanced memory interface solution optimized for AI, HPC, data centers, and networking applications. It conforms to the HBM3 (JESD238A) JEDEC standards, ensuring compatibility and reliability. The solution supports a seamless integration of PHY and Controller functions, achieving a remarkable average random efficiency of over 85%. Capable of handling up to 6400 MT/s for HBM3, and extending up to 9600 MT/s for future-proofing with HBM3E. This memory controller supports up to 32Gb density per die and utilizes state-of-the-art 2.5D/3D packaging technologies to cater to diverse design architectures, including interposer designs and memory repairs.
The DDR PHY from OPENEDGES features an embedded microprocessor and a sophisticated mixed-signal architecture to tackle DRAM integration challenges effectively in both high-performance and low-power environments. Its design minimizes long-term impedance drift and clock phase drift, allowing seamless updates without interrupting data processing between the memory controller and DRAM. With configurable timing and boundary flexibility, it significantly reduces read/write latency. The product is meticulously crafted with power management integration and an advanced PLL design to manage power consumption efficiently across various application areas, such as AI, mobile, and automotive sectors. Its remarkable integration within the ORBIT Memory Subsystem lends it ActiveQoS capabilities that balance bandwidth effectively across the SoC memory subsystem. The DDR PHY supports multiple memory standards, including LPDDR5x/5/4x/4, DDR5, and GDDR6 while offering configurations that accommodate varied DRAM package types. Its adaptability and cost-effective design make it suitable for a wide range of applications with constraints on package and PCB layer requirements.
Replicating the capabilities of its counterpart, the Ultra-High Throughput VESA DSC 1.2b Decoder, stakes strong claims in bandwidth conservation for high-resolution displays. It decodes compressed streams into visually lossless output, crucial for video and display technologies. The decoder supports seamless integration with existing hardware, helping achieve excellent display performance in various environments.
The Universal Multi-port Memory Controller (UMMC) by Mobiveil is architected to handle various high-speed memory interfaces including RLDRAM and DDR. This versatile memory controller is optimized for high bandwidth and low power use in applications ranging from mobile to networking devices. Its architecture is meticulously crafted to support reliable high-frequency operation while providing dynamic power management features, enhancing efficiency and performance for next-generation technology integrations.
The D-Series DDR5/4/3 PHY focuses on high-performance applications, ensuring reliability and efficiency in memory operations. This PHY interface supports data rates up to 6400 Mbps, making it ideal for high-performance servers, desktops, and laptops. It is supplied as a hard macro with GDSII, integrating over 150 customizable features to allow differentiation in various technological environments. Capable of handling multiple memory modules with ease, the D-Series DDR solves challenges in dynamic computer environments effectively.
The High Speed Adaptive DDR Interface is a pioneering technology that incorporates patented adaptive features to efficiently handle process, voltage, and temperature variations within a system. This interface is designed to optimize both high performance and low power consumption, making it suitable for diverse market sectors such as data centers, 5G, mobile, ADAS, AI/ML, IoT, and display technologies. Supporting DDR3/4/5, LPDDR3/4/5, and HBM standards, this interface boasts a wide range of compatibility with process nodes from 65nm to 7nm. Looked upon as a reliable choice by industry leaders, this DDR System from Uniquify addresses the crucial need for system reliability and performance enhancement. Its patented Self Calibrating Logic (SCL) efficiently eliminates unnecessary logic gates, reducing power consumption and ensuring the least latency by replacing FIFO with flops. Furthermore, it automatically corrects for bit-to-bit skew, providing a clean output signal for optimal performance. Uniquify's DDR interface holds a significant patent portfolio, with 24 US patents awarded since 2006, underscoring its commitment to innovation. Its adaptive elements support a broad array of applications, ensuring the highest yield and reliability for any given system, in turn fostering increased power efficiency and performance effectiveness.
Terefilm Photopolymer represents a cutting-edge advancement in material technology specifically tailored for semiconductor manufacturing. This innovative photopolymer addresses key challenges in the industry, such as precision mass transfer and high-resolution photolithography, by offering an unparalleled balance of patternability, decomposition cleanliness, and low activation energy. These features make Terefilm an ideal choice for high-throughput semiconductor applications that demand precise control and rigorous cleanliness standards. The Terefilm material offers thermal stability at temperatures up to approximately 180°C before UV exposure, thereby integrating smoothly into manufacturing workflows that involve elevated temperatures. When exposed to low-energy UV irradiation, the decomposition temperature is reduced by over 100°C, significantly lowering the energy required for vaporization. This process is further facilitated by acid catalysis involving photoacid generators, enhancing the decomposition efficiency akin to photoresists. One of the hallmark benefits of Terefilm is its low activation energy requirement, which enables it to operate at temperatures around 60°C. This feature leads to reduced power consumption and longer optical component lifetimes, making large area processing feasible. Moreover, the material's ability to vaporize completely under activation ensures no residual particles remain, eliminating the need for extensive cleaning post-processing. Consequently, Terefilm finds extensive utility in applications such as MicroLED mass transfer, where selective component release via laser transfer is essential.
Brite Semiconductor provides a comprehensive DDR solution that includes DDR controllers, PHY, and I/O components. It also features unique calibration and testing software for a complete subsystem. The YouDDR offers compatibility with LPDDR2, DDR3, LPDDR3, DDR4, and LPDDR4/4x applications, supporting data rates from 667Mbps to 4266Mbps. The system is designed to optimize high speed and low power consumption, with advanced technologies like Dynamic Self-Calibrating Logic and Dynamic Adaptive Bit Calibration to compensate for process voltage and temperature variations. The solution enables high-performance, low-power DDR interfaces with quick market readiness.
The Scan Ring Linker (SRL) is an innovative solution from Intellitech, designed to simplify the complexities of managing multiple scan chains within PCBs. This complete IP module can be effortlessly embedded into CPLDs, FPGAs, or ASICs, effectively linking various scan rings into a singular, high-speed test bus. By doing so, it allows for independent testing and configuration of devices situated on secondary scan chains, streamlined through the IEEE 1149.1 interface. The SRL module facilitates a reduction in design complexity and cost by unifying divergent scan paths, which traditionally require significant overhead to manage. Its implementation ensures that all scan chains operate cohesively, providing a singular route for both test and configuration data. This level of integration considerably enhances the efficiency and reliability of boundary-scan testing, offering an adaptable solution to manage diverse PCB architectures. SRL stands out by seamlessly integrating with the broader Eclipse Testing Environment, ensuring that all test and configuration protocols remain consistent across the PCB’s lifecycle. This underscores the module’s utility across a range of applications requiring precise, efficient JTAG test integration, ensuring that even the most complex systems maintain high reliability and performance.
The DDR and LPDDR solutions offered by InPsytech address the needs for high-performance memory interfaces in complex electronic environments. These interfaces integrate combo PHY options that support both DDR and LPDDR standards, ensuring versatility and adaptability in design applications where memory performance is critical. They are suitable for use in high-speed computing and mobile applications.
TwinBit Gen-1 is an embedded non-volatile memory solution that excels in high-endurance performance, suitable for process nodes ranging from 180nm to 55nm. This memory type is seamlessly incorporated into CMOS logic processes without the need for additional masks or processing steps, making it highly efficient and cost-effective. Engineered for low-voltage and low-power operations, TwinBit Gen-1 is ideal for various applications such as IoT devices, ASICs, and systems requiring embedded NOR FLASH. It offers high density and a small physical footprint, maintaining data integrity and performance even under extreme conditions, up to automotive-grade standards specified by AEC-Q100. Its technology supports operations like analog trimming and security key storage, with built-in test circuits facilitating straightforward testing. TwinBit Gen-1's compatibility extends to products that need field-rewritable functionalities, reflecting its flexibility and application versatility across multiple domains.
TwinBit Gen-2 expands the capabilities of true logic-based non-volatile memory across advanced process nodes from 40nm to 22nm and beyond. This generation continues the tradition of eschewing additional masks or process requirements, offering ultra-low-power operations with its innovative Pch Schottky Non-Volatile Memory Cell. This memory type leverages hot carrier injection and advanced cell bias control to perform program and erase functions effectively. It stands out for its low-power footprint, ensuring efficient performance in different technological applications. These features make it suitable for refined uses within sectors that demand cutting-edge, power-efficient memory solutions. TwinBit Gen-2 is designed to integrate effortlessly into sophisticated electronic devices, supporting high-density memory applications without compromising on reliability or performance standards. Its groundbreaking design underlines NSCore’s commitment to delivering robust non-volatile memory solutions for modern semiconductor challenges.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus Note: **JESD302-1A** and also we have **JESD302-1**
The FPGA Pre-Trade Risk Check IP by Algo-Logic is engineered to perform lightning-fast, real-time risk analyses prior to trade execution. This solution is tailored for financial institutions that need to adhere to strict compliance mandates while executing trades at speeds that approach the limits of current technology. By integrating directly into trading systems, the IP enables pre-trade checks without compromising speed, offering a significant advantage in the fast-paced environment of financial trading. Designed for use with FPGA technology, this risk check system provides an infrastructure for reducing the lag associated with traditional software-based risk assessments. It allows firms to verify parameters and assess risks instantly as trades are enqueued, enhancing both the speed and accuracy of trade verifications. The Pre-Trade Risk Check system built on FPGAs benefits from low-latency processing and high-determinism, crucial for maintaining a competitive edge in the trading industry. By leveraging this IP, firms can better manage operational risks and maintain regulatory compliance more efficiently.
Analog Circuit Works offers Processor/Memory Interface solutions that include popular LPDDR3 and LPDDR4 standards. These interfaces extend beyond traditional processor-to-memory connectivity, finding applications in broader areas requiring efficient data handling and low power consumption. These interface blocks are designed with a focus on power efficiency, making them ideal for mobile and portable devices where battery life is a priority. They are engineered to deliver excellent performance in terms of power, size, and testability, enabling cost-effective implementations. By offering adaptable and dependable interfaces, Analog Circuit Works supports the seamless operation of modern devices that rely heavily on fast and efficient data exchange between components. These interfaces are fundamental to the functionality of complete system-on-chip (SoC) designs, providing reliable connectivity solutions.
Dyumnin Semiconductors' RISCV SoC is a powerful, 64-bit quad-core server-class processor tailored for demanding applications, integrating a multifaceted array of subsystems. Key features include an AI/ML subsystem equipped with a tensor flow unit for optimized AI operations, and a robust automotive subsystem supporting CAN, CAN-FD, and SafeSPI interfaces.\n\nAdditionally, it includes a multimedia subsystem comprising HDMI, Display Port, MIPI, camera subsystems, Gfx accelerators, and digital audio, offering comprehensive multimedia processing capabilities. The memory subsystem connects to various prevalent memory protocols like DDR, MMC, ONFI, NorFlash, and SD/SDIO, ensuring vast compatibility.\n\nThe RISCV SoC's design is modular, allowing for customization to meet specific end-user applications, offering a flexible platform for creating SoC solutions with bespoke peripherals. It also doubles as a test chip available as an FPGA for evaluative purposes, making it ideal for efficient prototyping and development workflows.
The Calibrator for AI-on-Chips epitomizes precision in maintaining high accuracy for AI System-on-Chips through advanced post-training quantization (PTQ) techniques. It offers architecture-aware quantization that sustains accuracy levels up to 99.99% even in fixed-point architectures like INT8. This ensures that AI chips deliver maximum performance while staying within defined precision margins. Central to its operation, Calibrator uses a unique precision simulator to emulate various precision-change points in a data path, incorporating control information that synchronizes with ONNC's compiler for enhanced performance. The integration with ONNC's calibration protocols allows for the seamless refinement of precision, thereby reducing precision drop significantly. Highly adaptable, the Calibrator supports multiple hardware architectures and bit-width configurations, ensuring robust interoperability with various deep learning frameworks. Its proprietary entropy calculation policies and architecture-aware algorithms ensure optimal scaling factors, culminating in a deep learning model that is both compact and precise.
The LPDDR4/4X technology from M31 Technology accommodates demanding memory interface requirements, with dual-interface support operating up to 4267Mbps. It integrates power saving and performance enhancement features, vital for high-end applications in automotive, mobile, and computing sectors. Adapted for a flexible floor plan with package design support, this PHY solution assures performance enhancement with low power draw, ideal for device-level designs such as ASICs and SoCs.
DDR Solutions encompass a comprehensive range of DDR technologies designed to enhance memory bandwidth and efficiency within various computing environments. Constant updates ensure they are aligned with the current standards, maintaining backward compatibility to support earlier DDR generations. These solutions support DDR, DDR2/3/4/5, and LPDDR configurations, making them suitable for everything from consumer electronics to computational servers. They include memory interfaces and PHY elements, which are critical in optimizing system performance and stability. The advanced capabilities of DDR Solutions make them ideal for developers aiming to exploit high-speed memory interfaces in their designs. Whether dealing with desktop computers, mobile devices, or complex server architecture, these solutions provide the necessary framework to enhance memory performance significantly.
The DDR solution from KNiulink Semiconductor incorporates state-of-the-art architecture and technology to provide customers with high-performance, energy-efficient DDR3, DDR4, and DDR5 memory solutions. This range also includes LPDDR2 to LPDDR5, catering to various low-power applications. These IPs are specifically designed to meet the increasing demands for efficient and powerful memory performance across multiple applications.
Eliyan’s NuLink technology extends its innovation to die-to-memory connections, providing unmatched bidirectional signaling, which maximizes bandwidth efficiency and system performance on standard and advanced packaging platforms. The NuLink die-to-memory PHY supports advanced communication for memory-intensive applications, utilizing transceivers that operate in bidirectional mode, adapting based on the memory activity, either as sender or receiver. The technology caters to memory connections that require quick switching between operations, such as read and write, and dramatically enhances memory integration capabilities using the Universal Memory Interface (UMI) proposals. This supports seamless pairing of an ASIC with a variety of memory chip configurations, including DDR and HBM, leveraging the versatility of dynamic half-duplex transceivers. This capability significantly augments memory traffic handling, doubling the bandwidth potential on memory lanes, even when using cost-efficient standard packaging substrates. Moreover, Eliyan's proposition for broader adoption within industry standards suggests replacing traditional DRAM PHYs and controllers with more efficient configurations using NuLink PHYs. Consequently, this not only optimizes the ASIC design by saving power and space but also positions Eliyan’s solutions as a pillar for advancing chiplet-based architectures, particularly in high-demand applications like AI, automotive, and telecommunication markets.
ORBIT Memory Subsystem is a state-of-the-art memory solution by OPENEDGES, integrating sophisticated interconnect, memory controller, and PHY IPs designed to deliver superior performance and system efficiency. It's crafted to support the demands of next-generation AI chips, offering capabilities like reduced latency, high bandwidth, and multiple DRAM protocol support. This subsystem ensures excellent synergy between its components through a design that balances bandwidth and latency dynamically, improving the SoC's overall performance and reliability. It incorporates ActiveQoS technology, which finely tunes these parameters to prioritize latency-sensitive tasks, thereby avoiding potential congestion and ensuring smooth data flow. ORBIT's innovation lies in its ability to scale and adapt to emerging DRAM technologies quickly, which expands its application range and extends product cycles. This memory subsystem is especially suitable for industries requiring robust and adaptable memory solutions, such as AI markets, enabling versatile deployments and enhanced application competitiveness.
The D-Series DDR5/4/3 Controller offers a cutting-edge memory control solution optimized for latency, bandwidth, and efficiency. Notable for its support of the DFI 5.0 interface, this controller integrates advanced command scheduling, sequencing, and ECC. Supporting multiple channels, the controller offers over 300 customizable features to suit varied customer needs, ensuring maximum efficiency and flexibility. This makes it a go-to choice for developers looking to implement responsive and adaptable memory solutions in a wide array of technical landscapes.
The GDDR7 PHY and Controller from InnoSilicon fully complies with JEDEC's GDDR7 standard, showcasing an impressive data rate of up to 32Gbps using PAM3 signaling. PAM3 modulation allows high data throughput by utilizing ten DQ signals along with a DQE signal per byte. Additionally, this GDDR7 solution supports NRZ IO signaling for reduced power consumption. The design is tailored to meet the high integration needs of advanced consumer electronics, providing a bandwidth efficiency of up to 128Gbps per storage device. Furthermore, the incorporation of FinFET process nodes significantly enhances integration for high-end clients, promoting faster execution of high-performance computing tasks. Overall, the GDDR7 PHY and Controller optimize power and bandwidth in next-generation graphics and AI-based systems.
SafeIP™ represents a suite of intellectual property solutions engineered specifically to meet the stringent requirements of DO-254 DAL A, providing design assurance for the most critical applications. These IPs are verified against rigorous standards, modified as necessary to ensure compliance, and packaged with a comprehensive Certification Data Packet (CDP). This CDP includes documentation that demonstrates the IP's compliance to DO-254 standards, offering crucial support and guidance for integration. The process involves white-box testing by Logicircuit and black-box testing by the end-user to ensure full compliance at the FPGA level. Each IP is encrypted, allowing for use in various design tools while protecting the underlying source code. Logicircuit's SafeIP™ solutions have been accepted by both the FAA and EASA, making them suitable for a wide array of safety-critical domains including medical, automotive, and nuclear industries. With a business model that includes Sponsor and Standard licenses, Logicircuit ensures minimal cost barriers to entry, providing clients with reliable access and support for integrating IP into their projects.
Green Mountain Semiconductor's LPDDR5 PHY represents the frontier of memory-side interface technology within high-performance DRAM applications. It effectively bridges AI co-processors and in-memory compute solutions, delivering exceptional data handling efficiency. Adhering to JEDEC's stringent LPDDR5 standards, this robust interface is crafted for TSMC's 7nm process but allows adaptability to other fabrication technologies. The IP empowers devices to achieve high throughput and low power consumption, appealing to a wide array of memory configurations, including novel non-volatile solutions.
The DDR Memory Interface IP from Synopsys provides a crucial solution for integrating high-speed memory interfaces into various semiconductor designs. This IP supports a wide range of DDR standards, including DDR3, DDR4, and the upcoming DDR5, offering flexibility and future-proofing for digital designs. Ideal for use in data-centric applications such as networking and data centers, the DDR Memory Interface IP provides scalable performance and robust data integrity. Designed with an emphasis on high-speed data throughput and low latency, this IP enables efficient system design with enhanced power management techniques. It supports features such as differential clock inputs, automatic power down modes, and dynamic threshold capability, enhancing the overall energy efficiency of the system. Synopsys ensures that this interface IP is rigorously verified for silicon-proven reliability across numerous process nodes, providing complete design assurance. The comprehensive documentation and design kits that accompany the DDR Memory Interface IP facilitate smooth integration into diverse application environments, ensuring fast time-to-market.
The P-Series MRAM-DDR3, MRAM-DDR4 Solution is crafted for environments requiring high endurance and non-volatility under extreme conditions. With advanced timing control to accommodate MRAM's unique characteristics, including the support for various activation commands and integration modes, this solution supports efficient power and reset sequences. Its rigorous design optimizes performance with modified termination and driver configurations, making it well-suited for aerospace, industrial, and specialized applications demanding reliable and persistent storage solutions.
This LPDDR5X PHY offers a sophisticated interface solution, expertly designed to support high-speed and energy-efficient data transactions for AI processors and versatile ASIC applications. It respects JEDEC's LPDDR5X specifications, making it ideal for DRAM, SRAM, and emerging memory products. Initially targeted towards the 7nm TSMC node, its architecture allows for expansion to different process technologies, making it a flexible and future-proof choice for cutting-edge data-intensive tasks.
The LPDDR4/4X/5 PHY from Green Mountain Semiconductor is a cutting-edge memory interface solution designed for seamless data transmission across a spectrum of modern devices, including AI co-processors and in-memory compute systems. It strictly adheres to JEDEC standards, ensuring high-speed and low-power protocols are maintained throughout. This IP is tailored for integration in TSMC's 7nm process technology, yet holds the flexibility to be adapted to other logic processes. Its versatility makes it ideal for deploying across a vast range of memory types, from DRAM and SRAM to emerging non-volatile memory technologies.
An advanced memory controller designed to facilitate efficient memory management and data transfer processes within integrated circuits. This product is optimized for handling high-bandwidth data transactions, ensuring that systems can operate at peak performance without bottlenecks or data latency issues. It supports a variety of memory types and configurations, providing flexibility for different application needs.\n\nThe memory controller integrates seamlessly into a wide range of systems, making it an ideal choice for applications that require robust data handling and efficient memory utilization. Additionally, it includes features to support error correction and advanced data management protocols, ensuring data integrity and system reliability.\n\nBy leveraging leading-edge technology and innovative design, Xicore's memory controller offers a comprehensive solution for modern computing environments, catering to the needs of high-performance computing, consumer electronics, and embedded systems.
Designed for maximum compatibility, the LPDDR4X PHY serves as a highly-efficient memory interface, particularly suited for integration within commodity DRAM products. This solution is crafted to handle the complexities of AI and in-memory computing by facilitating high-speed, low-power data transfer. Built on 7nm technology from TSMC, this interface paves the way for innovative applications across various memory types, offering a robust foundation for AI processors and advanced ASIC designs seeking enhanced performance without compromises.