All IPs > Memory & Logic Library > Embedded Memories
Embedded memories play a crucial role in the architecture of modern electronic devices, offering storage and retrieval capabilities that are integral to processor function and data management. In Silicon Hub's Memory & Logic Library, the Embedded Memories category encompasses a wide variety of semiconductor IPs designed to meet these needs in diverse applications, from consumer electronics to industrial systems.
The primary function of embedded memories is to store and manage data internally within a device, which is essential for efficient processing and quick data access. These semiconductor IPs are typically integrated within a system on chip (SoC) to optimize performance and minimize latency compared to off-chip memory solutions. This integration helps improve overall device performance, reduce power consumption, and enhance the speed of data processing.
Common types of embedded memories available in this category include SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), MRAM (Magnetic Random Access Memory), and non-volatile memory types like Flash and EEPROM. Each type offers distinct advantages, such as high speed in SRAM, lower power consumption in DRAM, or the ability to retain data without power in non-volatile memories. These memory IPs are utilized in a plethora of products from smartphones and tablets to automotive systems and IoT devices, where compact, reliable, and efficient memory solutions are paramount.
Developers seeking to enhance computational efficiency and data handling capabilities in their designs will find this category indispensable. By choosing the right embedded memory IP from our Memory & Logic Library, manufacturers can create products that meet the demanding requirements of modern applications, ensuring reliability and excellent performance in a competitive market.
KPIT offers tailored solutions that aid in transforming traditional internal combustion engine vehicles into efficient electric and hybrid powertrains. These solutions emphasize reducing the total cost of ownership for new energy vehicles while enhancing their product quality and compliance with global sustainability standards. KPIT's integrative approach includes ready-to-use software platforms that streamline development processes and ensure seamless updates and validations, supporting the shift towards a sustainable future.
DenseMem facilitates a significant enhancement in memory capacity by effectively doubling the CXL-connected memory. This advanced technology is geared towards optimizing data storage solutions, allowing for exponential increases in memory capabilities without requiring additional physical hardware. DenseMem is ideal for environments where memory demands are rigorous, effectively catering to high-performance applications while lowering the cost per byte of storage.
LEE Flash G1 is a highly efficient SONOS-based embedded Flash solution tailored for medium capacity memory requirements. By leveraging a refined SONOS architecture, it ensures minimal changes to existing standard CMOS processes, allowing for seamless integration into current designs without altering the logic characteristics. G1 supports high-temperature reliability and long-term data retention, making it an ideal choice for automotive applications. This product excels in reducing cost thanks to its low power consumption during programming and erasure operations, supported by 2 to 3 additional masks, a significant economization compared to typical Flash solutions. The architecture supports a high number of program/erase cycles and guarantees stable retention over temperature extremes, which is crucial for automotive and industrial applications. Its architecture allows for the reuse of existing IP assets, thus eliminating the need for additional expensive investments on Flash technology-specific designs. Manufacturing adaptations are minimal, aimed at keeping chip costs low while delivering reliable, high-speed performance.
AHB-Lite Memory by Roa Logic refers to an adaptable soft IP solution providing efficient on-chip memory that is directly accessible by an AHB-Lite based master. This memory module is designed with flexibility in mind, customizable to fit the specific data throughput and storage demands of varied applications. The architecture of the AHB-Lite Memory module ensures seamless integration within AHB-Lite systems, supporting reliable and high-speed memory operations. It plays a critical role in facilitating data storage and retrieval, which are fundamental to the performance and efficiency of advanced embedded systems. Furthermore, the module's design supports easy scalability, allowing developers to adjust memory capacity as needed to align with specific project requirements. Its ability to offer consistent performance across various configurations makes it a standout option for system designers aiming for efficiency and speed in their memory hierarchy solutions.
The ABX Platform by Racyics utilizes Adaptive Body Biasing (ABB) technology to drive performance in ultra-low voltage scenarios. This platform is tailored for extensive applications requiring ultra-low power as well as high performance. The ABB generator, along with the standard cells and SRAM IP, form the core of the ABX Platform, providing efficient compensation for process variations, supply voltage fluctuations, and temperature changes.\n\nFor automotive applications, the ABX Platform delivers notable improvements in leakage power, achieving up to 76% reduction for automotive-grade applications with temperatures reaching 150°C. The platform's RBB feature substantially enhances leakage control, making it ideal for automotive uses. Beyond automotive, the ABX Platform's FBB functionality significantly boosts performance, offering up to 10.3 times the output at 0.5V operation compared to non-bias implementations.\n\nExtensively tested and silicon-proven, the ABX Platform ensures reliability and power efficiency with easy integration into standard design flows. The solution also provides tight cornering and ABB-aware implementations for improved Power-Performance-Area (PPA) metrics. As a turnkey solution, it is designed for seamless integration into existing systems and comes with a free evaluation kit for potential customers to explore its capabilities before committing.
The AndeShape Platforms include a range of systems designed for developing with AndesCore processors. These platforms are split into categories such as microcontroller platforms and FPGA development kits. They offer integrated solutions with pre-configured IP blocks to simplify the design process for complex systems. Through its assortment of hardware development tools, AndeShape platforms cater to various stages of product development from inception to demonstration, making it easier for engineers to create efficient, scalable solutions.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
PermSRAM is a highly versatile nonvolatile memory macro that operates on foundry standard CMOS platforms, covering process nodes from 180nm to 22nm and beyond. This memory solution offers a variety of configurations, including one-time programmable ROM and pseudo multi-time PROM with a multi-page format. It features a significant range of memory sizes from 64 bits to 512 Kbits and includes a non-rewritable hardware safety lock, enhancing security for critical data storage. PermSRAM is designed to be a secure and reliable solution with a proven record of stable yields. The technology is ideal for applications such as security code storage, program storage, and analog trimming. Its configuration allows for tamper-resistant storage using an invisible charge-trap mechanism, ensuring data security. Unlike traditional memory solutions, PermSRAM eliminates the need for a charge pump during read operations, reducing complexity and enhancing reliability. The built-in self-test circuits simplify the testing process, supporting ease of use across different applications. PermSRAM is also distinguished by its compact silicon area requirements, significantly smaller compared to conventional e-Fuse solutions. The memory's small footprint and high level of security make it an attractive option for applications that require efficient yet secure memory functionality, including automotive-grade environments where data retention is crucial.
LEE Flash G2 is an innovative Flash technology that extends beyond traditional Flash memory capabilities, designed for large-capacity applications requiring seamless integration with standard CMOS logic circuits. This solution offers direct and low-cost connection to existing volatile logic circuits without needing high voltage for read operations. By utilizing unique VDD operation technology, the G2 enables chip designers to create non-volatile functions directly in standard logic circuits like SRAM, opening new potential for creative and efficient memory applications. This ease of integration is facilitated by the solution’s elimination of additional high voltage areas and minimal mask requirements, thus significantly lowering the costs and time associated with chip development. G2's robust temperature endurance and long retention life meet stringent automotive criteria, enhancing its reliability and adoption in demanding applications. It stands out for its low power program/erase cycles that make it a cost-effective answer for power-sensitive use cases.
Secure OTP is an advanced storage solution utilizing anti-fuse one-time programmable (OTP) memory to protect sensitive data in integrated circuits. With enhanced capabilities over standard OTP systems, Secure OTP offers a unique physical macro and digital RTL design that ensures maximum security for stored data, be it in use, transit, or rest. It features a 1024-bit PUF for improved encryption and supports multiple interfaces for seamless integration across a broad range of applications. The solution mitigates security vulnerabilities in modern chip designs, providing robust protection against data theft and unauthorized access to critical information such as encryption keys and boot codes. This technology is aimed at applications requiring secure data storage, including IoT devices and smart electronics.
Silvaco offers innovative embedded memory compilers equipped to handle the demands of high-performance computing and AI applications. These memory solutions feature advanced architecture for optimized scalability, power efficiency, and enhanced data locality. Designed to support low-power designs, these compilers offer diverse architectures to maintain robust performance while ensuring a balance in power consumption and area efficiency.
The xSPI MRAM products by Everspin are tailored for the industrial and embedded systems market, providing a high-speed, expanded SPI interface adhering to the JEDEC standards. Utilizing the advanced STT-MRAM technology, these products operate using a 1.8V power supply, achieving read and write speeds up to 400MBps. The xSPI product line replaces legacy memory types like SRAM and NVSRAM, empowering applications in industrial automation, automotive, and IoT ecosystems with efficient, reliable memory solutions.
Spin-transfer Torque MRAM (STT-MRAM) is a highly advanced memory technology offering remarkable scalability, energy efficiency, and data retention. Using the principle of spin-transfer torque, it provides significant energy reductions during memory cell switching, supporting high-density designs essential for data centers and industrial applications. The technology is engineered for extensive durability, providing persistent memory solutions without the need for supercapacitors or batteries for energy backup, and delivering high bandwidth and low latency through a DDR4-like interface.
The Flash Protection Series extends PUFsecurity's hardware root of trust capabilities to safeguard flash memory and its embedded systems. This set of solutions enables protection for both embedded and external flash by incorporating PUF-based authentication and encryption across various storage types including NAND and NOR flash. It utilizes PUF technology to enhance the memory's security boundary, preventing unauthorized access and ensuring real-time data integrity. With specialized components like PUFef for embedded flash and PUFenc for external, the series allows seamless integration into larger system-on-chip designs while providing enhanced defenses against common security threats faced by flash-based storage.
LEE Flash ZT is designed as a zero-additional-mask MTP solution that is perfect for applications requiring automotive-grade robustness and efficiency. Distinguished by its ease of implementation, ZT is crafted specifically for sensor controllers, power circuits, and analog ICs that need reliable trimming and parameter storage. This Flash provides an economical approach to memory programming with its support for standard CMOS processes, which facilitates the reuse of existing designs without incurring additional manufacturing costs. The ZT model operates with minimal power, making it ideal for industries where power consumption is a critical aspect. ZT's engineering ensures excellent data retention over extended periods and under high-temperature stresses, fitting perfectly into the rigorous demands of automotive technology without requiring any additional masking. This combination of traits makes ZT an ideal solution for cost-conscious projects requiring durable NVM capabilities.
Avant Technology offers a broad range of JEDEC-compliant industrial embedded DRAM memory modules suitable for applications in gaming, point-of-sale systems, kiosks, medical equipment, and automation. These modules feature options including low voltage, high capacitance, and low power consumption, making them versatile for various demanding environments. Available in form factors like UDIMM, SODIMM, ECC DIMM, and Mini DIMM, these memory modules support DDR3, DDR4, and DDR5 interfaces, catering to industrial, commercial, and consumer markets with diverse temperature ranges.
I-fuse Replaser technology brings a new dimension to fuse-based memory solutions. Tailored to address complex data storage and retrieval needs, it offers heightened performance for high-density applications.\n\nThis IP is characterized by its remarkable capacity for adaptability, supporting seamless integration across multifunctional platforms that require superior data precision and reliability. Such an innovative solution is essential for industries demanding leading-edge memory solutions capable of withstanding intensive data tasks. \n\nThe versatility of this technology spans across industry applications demanding scalability and efficient data processing. By maintaining a continual ability to enhance memory systems, I-fuse Replaser represents the leading edge in cost-effective semiconductor advancements.
MRAM for Radiation-hard Markets offers a unique combination of non-volatile magnetic memory technology with radiation-hardening capabilities, ideal for space and other extreme environments. These MRAM solutions deliver unparalleled performance in terms of data integrity and durability, ensuring continuous operation even in high-radiation settings. Such reliability makes them indispensable for aerospace and critical mission applications where failure is not an option.
LEE Fuse ZA stands out as an Anti-Fuse Non-Volatile Memory suitable for trimming tasks that do not demand reprogramming. This solution is particularly valued for its application in memory redundancy without the necessity for additional manufacturing steps or mask alterations. ZA leverages a low-complexity manufacturing methodology needing only a basic metal layer setup, distinguishing itself by its suitability for advanced processes. With its versatile compatibility across various process nodes from 180nm to sub-10nm, it is a practical choice for diverse technological requirements. This memory type excels in high-temperature applications, making it particularly useful in automotive sectors where reliability and durability over extended operational periods are crucial. As a proven design, ZA caters to projects looking for cost-effective, robust, and easy-to-deploy NVM solutions.
Trifecta-SSD-RAID is a high-performance, single-slot M.2 NVMe SSD RAID module designed for PXIe and CPCIe platforms. Tailored for wideband, high-speed RF and microwave recording, playback, and data storage, this product excels in both capacity and speed. It supports storage capacities ranging from 8TB to 64TB per slot, and offers robust sequential read/write performance of up to 7 GB/sec. Its architecture enables the use of up to eight M.2 NVMe SSDs, leading to exceptional storage performance without common glitches. The module is ideal for applications requiring sustained high bandwidth streaming, such as multi-channel RF signal recording. Compatible with both Windows and select Linux distributions, the Trifecta-SSD-RAID ensures high compatibility across a variety of operating systems and complies with industry standards including RoHS and FCC Class A. This product sets a new standard for storage solutions with its long lifecycle and value-based pricing, typically offering per-terabyte costs significantly lower than competitors.
NRAM Technology from Nantero is a cutting-edge non-volatile random access memory that stands out due to its use of carbon nanotubes (CNTs). These memory solutions promise significant advantages in terms of speed and durability compared to traditional memory technologies. NRAM is heralded for its potential to surpass DRAM and Flash memory by delivering faster read and write operations while being more power-efficient, especially in non-operational states where it consumes almost negligible power. This technology is built around CNT fabric, which consists of ultra-thin carbon cylinders known for their strength and conductive properties. This unique material allows NRAM to operate at speeds comparable to DRAM but with the non-volatility of Flash memory. The robust nature of carbon nanotubes also ensures high endurance, enabling the memory to handle vast numbers of cycles without degradation. NRAM can be manufactured using standard CMOS fabrication processes, negating the need for specialized equipment. This cost-effective production model allows it to integrate seamlessly into existing manufacturing systems. With scalability to sub-5nm processes and compatibility with 3D structures, this memory solution is positioned as a revolutionary leap poised to enable a wide range of electronic products across multiple industries.
Spectral MemoryIP comprises a suite of silicon-proven, high-density, and low-power SRAM libraries designed for efficient storage solutions. The library features six main architectures including Single Port and Dual Port SRAMs, ROM, and various register files. These are suited for applications requiring rapid access and minimal energy consumption. Spectral's MemoryIP is implemented with foundry-specific or custom-designed bit cells to uphold robust performance. This technology is tailored to standard CMOS processes and offers a broad array of customization options. Developers can utilize the MemoryDevelopmentPlatform to modify and retarget the designs for other technologies, thereby extending its capabilities in embedded solutions. It is widely applicable, offering configurations with data widths ranging from 4 to 144 bits across different aspect ratios and memory depths. The robust architecture of Spectral MemoryIP ensures high-speed operations and low dynamic power consumption, making it ideal for diverse applications ranging from boot code storage to nonvolatile memory needs. Additionally, users can benefit from various low-power modes and advanced features like BIST and ECC, supporting seamless integration into complex systems.
The Trifecta-SSD-RM offers a flexible, high-performance data storage solution for PXIe and 3U CPCIe environments. It features removable M.2 NVMe SSD cartridges supporting capacities from 1TB to 8TB. This single-slot module boasts read/write speeds up to 3.5 GB/sec, significantly enhancing data throughput compared to traditional Embedded Controller SSDs. Beyond speed, the Trifecta-SSD-RM supports software-based RAID configurations, allowing users to customize capacity and performance as needed. This flexibility makes it an excellent fit for data-intensive applications requiring swift data backup and security level modifications, all while offering an affordable price point. The product's rapid interchangeability of data cartridges simplifies upgrades and replacements, effectively addressing evolving data acquisition needs. With its robust design and manufacturing in the USA, Trifecta-SSD-RM maintains a long lifecycle, making it a reliable choice for advanced data storage solutions.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
Resistive RAM (ReRAM) technology offers a revolutionary approach to memory storage, characterized by its ability to scale below 10nm and stack in 3D configurations. This simple structure not only enhances energy efficiency, consuming just a fraction of the power compared to traditional memory technologies, but also significantly boosts endurance and read/write performance. ReRAM technology is particularly well-suited for Internet of Things (IoT) applications, data centers, mobile computing, and secure computing, due to its low latency and high-density storage capabilities. Crossbar’s ReRAM technology is uniquely positioned as a formidable alternative to conventional flash memory, boasting faster operations and better integration with CMOS processes. This technology can support various memory architectures, including multiple-time programmable (MTP), few-time programmable (FTP), and one-time programmable (OTP) configurations, making it versatile for both non-volatile memory and security applications. The inclusion of secure keys aids in protecting data integrity and enhancing device security, which is crucial in the rapidly growing field of connected devices. Furthermore, ReRAM technology by Crossbar is engineered to withstand a wide range of environmental conditions, making it reliable and durable. Its compatibility with monolithic integration processes allows for its seamless addition to CMOS logic wafers, providing an efficient means of incorporating high-density memory solutions into existing semiconductor infrastructures. This makes it a pivotal component for companies seeking to advance their memory technology beyond the current limitations of flash, thereby unlocking new potential in data-intensive applications.
The Serial Peripheral Interface (SPI) MRAM is designed for systems that require fast data retrieval and minimal pin usage. With quad SPI capabilities, it achieves read and write speeds of up to 52MBps, surpassing traditional 8-bit parallel MRAM. Packaged in a compact 16-pin SOIC, this SPI MRAM is perfect for modern RAID controllers, server system logs, and storage buffers, providing high-speed data and program memory solutions.
Trion FPGAs by Efinix are optimized for the fast-paced demands of the edge computing and IoT sectors. Built on a 40 nm process, these FPGAs provide a blend of power-performance-area efficiency suitable for a wide array of innovative applications including mobile, consumer electronics, industrial systems, and more. With logic densities ranging from 4K to 120K logic elements, Trion FPGAs are versatile enough to cater to both standard and burgeoning tech markets. The Trion lineup features a robust set of integrated interfaces including GPIO, PLLs, oscillators, DDR, MIPI, and LVDS, making them adaptable to varied application needs. These attributes, combined with their commitment to low power consumption, render them ideal for wearables, smart devices, and portable imaging systems where space and power efficiency are paramount. In terms of development flexibility, Trion FPGAs are available in a variety of package options, including tiny WLCSP packages designed for compact, integrated applications. With embedded DDR controllers and support for RISC-V processors, these FPGAs provide scalable solutions for building complete systems encompassing video processing, consumer applications, and advanced IoT deployments.
The URS500 Solvent Recycler is a top-tier system designed to handle the recycling of solvents efficiently and effectively in various industries such as automotive, coating, and manufacturing. It operates on a 120-volt power supply and utilizes sophisticated vaporization and condensation processes to ensure that used solvents are clean and ready for reuse. The system's solid-state microprocessor offers precise workflow control, equipped with an automatic shut-off, and features a high-efficiency air-cooled copper condenser. Its robust design, crafted from 304-grade stainless steel, guarantees durability and safety compliance, meeting CE standards. Capable of processing 5 gallons (20 liters) of solvent per batch, the URS500 model is lauded for its ability to drastically reduce both the purchase of new solvents and associated disposal costs. This model, therefore, not only cuts operational costs but also contributes significantly to environmental sustainability. The sturdy construction minimizes maintenance needs while maximizing reliability, making it an essential fixture in professional settings aiming to improve solvent usage efficiency. The URS500 offers a seamless user experience with features like temperature settings that can be manually adjusted, allowing businesses to tailor the recycling process to suit specific solvent requirements. Its thoughtful engineering ensures that solvent waste is minimized and non-hazardous, allowing industries to maintain high-quality operational standards while pursuing more eco-conscious practices, ultimately reducing their environmental footprint.
The Vega eFPGA from Rapid Silicon represents an innovative leap in providing customizable FPGA capabilities to System-on-Chip (SoC) designs. This eFPGA is designed to deliver flexibility and efficiency, allowing a seamless integration that enhances performance without raising costs. By embedding programmability directly into SoCs, Vega eFPGA facilitates diverse and adaptable computing needs. Structured with three configurable tile types – CLB, BRAM, and DSP – the Vega eFPGA is engineered for optimal performance. The CLB comprises eight 6-input lookup tables (LUTs), each offering dual independent outputs. It includes features like fast adders with carry chains and programmable registers, ensuring computational versatility. The BRAM component supports 36Kb dual-port memory, adaptable as 18Kb split memory configurations. The DSP tile incorporates an 18×20 multiplier with a 64-bit accumulator, supporting complex mathematical processing. Rapid Silicon's Vega eFPGA is optimized for scalability, providing flexibility in tile configurations to meet varied application requirements. It ensures ample compatibility with existing systems through seamless SoC integration, proprietary Raptor EDA tools, and robust IP libraries. These capabilities enable Vega to offer bespoke solutions tailored to specific end-user needs.
xT CDx is a sophisticated next-generation sequencing platform designed to profile solid tumors through both DNA and RNA analysis. A key feature of this device is its capacity to pinpoint single nucleotide variants, multiple nucleotide variants, and insertion-deletion alterations across 648 genes, thereby offering comprehensive genomic insights. Furthermore, this tool examines microsatellite instability (MSI) using DNA samples taken from formalin-fixed, paraffin-embedded tumor tissues, alongside matched normal blood or saliva specimens. The platform also functions as a companion diagnostic (CDx) for identifying patients who may benefit from various targeted cancer therapies. Integrated with Tempus's robust sequencing capabilities, xT CDx provides healthcare professionals with critical mutation profiles that adhere to oncology professional guidelines, facilitating more precise treatment pathways. By leveraging comprehensive genomic data, xT CDx plays a vital role in enhancing personalized cancer care.
Dedicated to improving one-time programmable memory devices, OTP IP provides extensive configurations that cater to a variety of electronic needs. Central to the function of this IP is its capability to offer robust security measures alongside high-density storage, ensuring data integrity during every use.\n\nBuilt with the latest advancements in process technology, OTP IP supports critical applications such as device calibration and secure boot processes, proving essential for systems where data protection is paramount.\n\nOTP IP's adaptability across multiple platforms makes it a versatile choice for emerging semiconductor needs. Its sophistication allows for integration in complex systems that require stringent reliability and performance benchmarks, demonstrating its worth across multifarious applications.
Crossbar's ReRAM IP Cores for High-Density Data Storage are engineered to meet the demanding needs of modern data-centric applications, providing high-density, non-volatile memory solutions suitable for environments like data centers and server infrastructures. These cores allow for rapid access to large datasets, thanks to their low latency and superior read/write speeds, making them an optimal choice for read-intensive scenarios. The technology enables the storage of significant volumes of data within small physical footprints, utilizing ReRAM's ability to be stacked in 3D configurations. This results in memory solutions that offer not just increased density but also enhanced energy efficiency, which is crucial in reducing the total cost of ownership in large-scale data operations. By offering customizable memory sizes, users can tailor the storage solutions to fit specific applications, ranging from consumer electronics to enterprise-level data handling. Additionally, these high-density memory cores support secure applications through the incorporation of ReRAM-based PUF keys, providing a crucial layer of data protection against potential threats. Crossbar's ReRAM IP is available as hard macros for integration into SoC or FPGA devices, or as standalone memory chips, offering versatile deployment options. This adaptability ensures that organizations can boost their data storage capabilities while maintaining robust security measures, without sacrificing performance or efficiency.
Spectral CustomIP is a specialized collection of silicon-proven memory architectures crafted for a variety of integrated circuit applications. These architectures, which include Binary and Ternary CAMs and multi-ported memories, are engineered to deliver exceptional performance with low dynamic power requirements. CustomIP is ideal for cases requiring specialty memory solutions not readily available in the market. This set of IP utilizes Spectral's proprietary bit cells for consistent and reliable operation across various environments. It is adaptable for use with standard CMOS and embedded Flash processes, making it versatile for a wide range of technological demands from consumer devices to complex networking hardware. CustomIP's architecture is equipped with multiple advanced features such as multi-bank and multi-port options, making it suitable for graphics applications and fast hardware search requirements. In essence, Spectral's CustomIP caters to both companies creating distinctive IC products and those seeking control over their memory IP development.
TwinBit Gen-1 is NSCore's innovative embedded non-volatile memory solution specifically designed to work with logic-based systems across 180nm to 55nm process nodes. Renowned for its high endurance, this memory solution supports over 10,000 program cycles, making it both robust and reliable for a wide variety of applications. TwinBit Gen-1 is seamlessly integrated into CMOS logic processes, requiring no additional masks or processing steps, which facilitates easy adoption within existing semiconductor manufacturing workflows. The TwinBit Gen-1 range includes a flexibility of memory sizes from 64 to 512 Kbits, which makes it an ideal choice for functions such as analog trimming and the storage of security keys. Applications also extend to systems where ASIC/ASSP implementations require secure and efficient non-volatile storage. The solution's high density and compact area use ensure that it is well-suited for devices that prioritize space efficiency without compromising on performance. TwinBit Gen-1 offers automotive-grade quality under the AEC-Q100 standards, supporting low-voltage and low-power operations that align with modern energy efficiency requirements. A built-in test circuit aids in simplifying stress-free testing environments, enabling easy verification and validation in various industrial applications. The process compatibility further enhances TwinBit’s appeal, allowing for fast, cost-effective deployment in cutting-edge technology environments.
TwinBit Gen-2 from NSCore extends the capabilities of embedded non-volatile memory solutions to support advanced process nodes ranging from 40nm to 22nm and beyond. Like its predecessor, the TwinBit Gen-2 integrates seamlessly into CMOS logic processes without necessitating additional masks or modifications to existing workflows. This solution is designed with ultra-low-power operations in mind, reducing energy consumption significantly across its applications. The Gen-2 iteration utilizes the Pch Schottky Non-Volatile Memory Cell technology, which optimizes the programming and erasing processes through controlled carrier injection, making it both efficient and reliable. This approach to design ensures that the TwinBit Gen-2 can perform at high efficiency without increasing the complexity or cost of implementation. The technical advancements in this generation make it a suitable option for high-performance applications that demand substantial data security and energy efficiency. Ideal for a variety of uses, the TwinBit Gen-2 caters to needs such as security data storage, system configuration updates, and more sophisticated electronic control mechanisms. The advanced cell design and operation modes position the TwinBit Gen-2 as a leading choice for next-generation semiconductor solutions seeking to balance performance with efficiency and security.
TySOM Boards are a powerful solution in Aldec's line of embedded system prototyping tools, bringing the practicality of high-performance FPGA-based platforms to system design applications. These boards integrate a range of FPGAs like Xilinx’s Zynq UltraScale+, Zynq-7000, and Microchip's PolarFire SoC, catering to a broad spectrum of advanced computational needs. With industry standard interfaces such as FMC and BPX, these boards are not only versatile but also easily expandable with Aldec’s extensive daughter card selection. Thus, they stand out in facilitating the fast development of embedded applications spanning from automotive systems to AI, machine learning, and IoT. TySOM Boards provide a user-friendly platform that enables engineers to bridge the gap between conceptual design and physical implementation, fostering innovation in high-demand sectors like automotive advanced driver assistance systems (ADAS) and industrial automation. Their design supports a multitude of applications where performance and reliability are paramount, thus allowing designers unprecedented flexibility and capability in high-stakes development environments. As embedded system prototyping continues to grow in complexity, TySOM Boards offer a scalable path forward, meeting the challenges of next-generation technology design and deployment.
SRAM or Static Random-Access Memory is integral to chip design, known for its ability to provide high-speed data access with low power consumption. This type of memory retains data bits in its memory as long as power is being supplied, making it an essential component for modern electronic devices, computers, and communication equipment. DXCorr offers cutting-edge SRAM designs that maximize speed and efficiency while minimizing energy consumption. Their SRAM solutions are designed for both high performance and high density, suiting applications that require fast access times and efficient power usage. Working on advanced technology nodes like 5nm, 7nm, and even future nodes such as 2nm and 3nm, DXCorr ensures their SRAM implementations are ready to meet the demands of the new generation of electronic devices. With a focus on resolving the issues related to concurrent operations in dual-port configurations, DXCorr's SRAM offers enhanced reliability and robustness, ensuring data integrity and system stability in complex computational tasks. Suitable for a broad range of applications, their SRAM designs support various domains from consumer electronics to high-end computing applications.
This IP offers a robust memory configuration of 4Kx9 bits, designed to handle substantial data volumes effectively. Operable at 0.8V and 1.8V, it is engineered to accommodate power variability in different operational settings, ensuring adaptability across device architectures.\n\nUtilizing an advanced 12nm process node, it maintains a focus on reduced power consumption and size efficiency, which are essential for state-of-the-art electronic solutions requiring dense memory storage. The scope of deployment includes diverse technology sectors that benefit from compact and efficient data storage capabilities.\n\nAttopsemi's focus on providing high-capacity solutions is evident in the scalability offerings from 4 Kilobits onward, making this IP highly suitable for systems or applications that require high data throughput amid stringent power and space constraints. This design demonstrates the tailored approach to solving modern technological challenges with enhanced memory performance.
The Menta eFPGA IP Cores v5 are designed to be highly versatile, high-density programmable logic blocks embedded within SoCs or ASICs. These cores help designers define precise resource requirements to meet application-specific needs, available in both Soft RTL and Hard GDSII options. The key advantages of these cores include significant cost reduction, improved performance, and lower power consumption compared to traditional on-board FPGAs. One of the main features of Menta's eFPGA is its architecture, which conserves board space and drastically reduces power usage, as much as 50% less than comparable FPGA-based solutions. Integration directly on-chip reduces I/O latency and overcomes the limitations of traditional chip-to-chip communication interfaces. Additionally, Menta's eFPGA supports a broad range of technology nodes, from 350nm to less than 5nm, offering unparalleled silicon process portability. Menta's eFPGA architecture is easy to integrate, verified at various stages including formal verification and system simulation. It features trusted controls over bitstream loading and offers customization options for logic blocks, DSP arithmetic functions, and power-saving features. The standard-cell designed eFPGAs cater to unique application needs while being platform adaptive, ensuring broad compatibility and design flexibility.
Genesis is a fully integrated solution aimed at streamlining package and PCB design workflows. With its comprehensive design suite, Genesis enables engineers to create sophisticated electronic packages, ensuring alignment with industry standards for performance and reliability. By leveraging the capabilities of Genesis, design teams can efficiently manage complex projects from conception to final layout. The tool's advanced features allow for seamless integration of various design elements, promoting a cohesive design environment that supports multi-layer designs and intricate interconnection schemes. Genesis's robust design capabilities help cut down on development times while maintaining high standards of accuracy and detail, crucial for performance-critical packages. As an essential tool in a modern designer's toolkit, Genesis stands out for its ability to manage the intricacies of PCB layouts alongside advanced packaging structures, making it invaluable for engineers tasked with delivering top-tier electronic solutions across a range of industries.
Xenergic's High-Speed Turbo Memory IP represents a significant evolution in high-speed data processing. This memory architecture leverages predictable access patterns to achieve tremendous reductions in power usage and chip area. By exploiting these predictable patterns, such as those found in AI and graphic processing applications, it manages to operate at double the speed of the fastest current SRAMs available. This solution reduces dynamic power consumption by 80%, diminishes leakage by up to 60%, and minimizes area by 60%, all while maintaining cutting-edge performance capabilities. Its design supports high throughput for applications scalable to large buffer and cache systems, making it perfect for ML, AI, and advanced image processing tasks.
iModeler is Xpeedic's innovative solution for automated PDK model generation. This tool streamlines the process of creating Process Design Kits, which are foundational for semiconductor manufacturing processes. iModeler’s capabilities in automating PDK generation reduce time and resources required, providing a significant advancement over traditional manual methods. By utilizing sophisticated algorithms, iModeler enhances accuracy in developing intricate models that are essential for advanced semiconductor fabrication. The tool supports a broad range of semiconductor processes, ensuring cross-compatibility and robustness in model output. This level of precision supports engineers in achieving optimal results in both design and manufacturing stages. With iModeler, companies can significantly boost their development productivity, enabling quicker turnarounds in the semiconductor lifecycle. For organizations looking to maintain cutting-edge competitiveness, iModeler is a game-changer, providing the necessary infrastructure to support rapid advancements in chip manufacturing technologies.
Xenergic's High-Speed Low-Power SRAM IP is designed to deliver maximum power efficiency without compromising on performance. This solution sees significant reductions in dynamic power usage and leakage, while maintaining high speeds and a competitive area. It is specifically optimized for applications such as IoT, sensors, and wearables, where conserving power is critical due to limited power budgets. The SRAM architecture supports better power optimization through both dynamic and static adjustments, positioning it as an ideal choice for always-on applications. By leveraging its low power nature, it enables efficient computation at the edge, particularly valuable in the burgeoning IoT landscape, ensuring reduced latency and improved device performance.
The EM-30 e.MMC 5.1 storage solution by Swissbit is crafted for reliability and efficiency in industrial environments. Utilizing NAND TLC technology, it provides storage capacities reaching up to 256 GB. This e.MMC device integrates NAND flash and a controller in a compact form, ensuring that it efficiently manages data even in rugged conditions. The design enhances PCB designs by integrating vital components, cutting down on space while boosting security and device longevity. Engineered especially for non-removable storage uses, the EM-30 offers built-in security features aimed at safeguarding critical data against various threats. Its robust architecture makes it the ideal choice for embedded systems that demand high reliability and durability under fluctuating temperatures and widespread environmental factors. This memory solution contributes significantly to lowering the total cost of ownership through its longevity and minimal re-qualification requirements.
I-fuse technology introduces a cutting-edge method for memory integration within silicon chips. This technology involves Permanent Electronic Fuses fit for a range of parameter trimming and identification applications. Through its unique design, I-fuse is optimized for cost-effectiveness and high performance.\n\nThe essential feature of this IP is its ability to facilitate zero-overhead reprogrammability, supporting a wide range of configurations and systems. This ensures sustainable power efficiency and enhances the adaptability of the technology in various industrial domains.\n\nWith a focus on delivering functional scalability, I-fuse technology optimally supports data encoding and protection functions, providing trusted solutions for security and data integrity in broad industry applications.
Metis stands as a powerful solution designed for tackling the complexities of 2.5D/3D IC packaging. Tailored to support the analysis of multi-die integration, Metis provides comprehensive simulation capabilities essential for modern IC design requirements. As the industry moves towards more compact and complex packaging, Metis plays a pivotal role in ensuring that these designs meet the necessary criteria for SI/PI performance and thermal management. What sets Metis apart is its extensive capacity to handle large-scale simulations, enabling designers to model and evaluate the electromagnetic interactions within densely packed IC assemblies. This capability is crucial in maintaining signal integrity and power integrity, which are often the bedrock of functional and reliable electronic systems. Metis supports the development of advanced IC packaging solutions by offering detailed visualizations and simulation insights, empowering engineers to address critical design challenges proactively. Its role in optimizing packaging solutions ensures that products not only meet but exceed industry standards for performance and reliability.
XPLM is an innovative solution for managing simulation processes and data in the ever-evolving field of electronic design. This tool provides a centralized platform for storing, organizing, and accessing large volumes of data, ensuring that design teams can operate efficiently and effectively. By integrating data management into the design process, XPLM reduces the complexity associated with handling vast amounts of information, thereby streamlining workflows and enhancing productivity. It supports engineers in maintaining version control and collaboration across different projects, helping manage resources and timelines more effectively. XPLM's comprehensive data handling capabilities make it indispensable for organizations committed to maintaining a competitive edge in the semiconductor industry. By simplifying the intricacies of data management, XPLM helps transform simulation insights into actionable strategies, driving design innovation and operational excellence.
The I-fuse S3 represents an evolution in programmable silicon fuses, carrying the legacy of its predecessor while enhancing storage capacity. It builds on the advantages of the base I-fuse technology, offering greater sparsifying efficiency and extended configurability across data retention frameworks. \n\nThis IP's ability to reprogram with minimal overhead simplifies updates and customization, maintaining relevance across varying application domains that benefit from refined power consumption and spatial use. \n\nTargeted primarily at sectors that necessitate variable versatility without losing the reliability of fuse technologies, I-fuse S3 serves as a significant asset for electronics looking to integrate advanced memory technologies that are robust and cost-efficient.
Crossbar's ReRAM IP Cores for Embedded NVM are specifically designed to support integration within microcontrollers (MCU), System-on-Chip (SoC), and FPGA architectures. These cores offer a versatile approach to embedded memory solutions, providing a high-performance, low-latency alternative to traditional embedded flash. By enabling support for multiple-time programmable (MTP), few-time programmable (FTP), and one-time programmable (OTP) memory solutions, they provide flexibility for various embedded applications. The embedded ReRAM IP cores boast superior energy efficiency and performance, making them ideal for IoT devices, wearables, tablets, and consumer electronics. These cores are built to seamlessly integrate with modern process nodes, starting at 28nm and scaling below 10nm, thus allowing for cost-effective manufacturing solutions. Crossbar's technology leverages the simplicity and scalability of ReRAM, offering customizable memory densities that can be tailored to specific application needs, from small-scale consumer electronics to complex industrial systems. In addition to their memory capabilities, these IP cores also support secure computing applications, employing secure cryptographic keys that enhance device security and data integrity. This embedded memory technology enables designers to implement reliable and scalable solutions that meet the demands of contemporary electronic devices. By providing a robust platform for secure and efficient NVM, Crossbar's Embedded ReRAM IP Cores are an essential component for next-generation semiconductor devices.
SmartMem Subsystem IP enhances ease of use and scalability by optimizing power, performance, and endurance across a variety of memory types, including NuRAM and other MRAM technologies, as well as RRAM, PCRAM, and embedded Flash. This versatile memory subsystem is fully synthesizable and configurable, making it an excellent choice for SOC designs that require customizable compute-in-memory solutions. SmartMem supports high performance in demanding environments, providing essential features for adaptive memory management that greatly improve the deployed memory's operational efficiency and effectiveness. Its value lies in its ability to improve the utility of existing memory technologies while offering a robust framework for new developments.