All IPs > Memory & Logic Library > Embedded Memories
Embedded memories play a crucial role in the architecture of modern electronic devices, offering storage and retrieval capabilities that are integral to processor function and data management. In Silicon Hub's Memory & Logic Library, the Embedded Memories category encompasses a wide variety of semiconductor IPs designed to meet these needs in diverse applications, from consumer electronics to industrial systems.
The primary function of embedded memories is to store and manage data internally within a device, which is essential for efficient processing and quick data access. These semiconductor IPs are typically integrated within a system on chip (SoC) to optimize performance and minimize latency compared to off-chip memory solutions. This integration helps improve overall device performance, reduce power consumption, and enhance the speed of data processing.
Common types of embedded memories available in this category include SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), MRAM (Magnetic Random Access Memory), and non-volatile memory types like Flash and EEPROM. Each type offers distinct advantages, such as high speed in SRAM, lower power consumption in DRAM, or the ability to retain data without power in non-volatile memories. These memory IPs are utilized in a plethora of products from smartphones and tablets to automotive systems and IoT devices, where compact, reliable, and efficient memory solutions are paramount.
Developers seeking to enhance computational efficiency and data handling capabilities in their designs will find this category indispensable. By choosing the right embedded memory IP from our Memory & Logic Library, manufacturers can create products that meet the demanding requirements of modern applications, ensuring reliability and excellent performance in a competitive market.
KPIT's propulsion technologies cover both traditional internal combustion engines and modern electric powertrains. By focusing on reducing the total cost of ownership for new energy vehicles, KPIT helps OEMs streamline development cycles and enhance vehicle quality. The company's platform supports agile software updates and sustains efforts on sustainable practices by increasing offerings in zero-emission vehicles (ZEVs) and exploring alternative fuels like hydrogen. With solutions spanning engine subsystems, transmission, and driveline optimization, KPIT addresses the intricate balance needed between legacy and emerging automotive platforms.
DenseMem facilitates a significant enhancement in memory capacity by effectively doubling the CXL-connected memory. This advanced technology is geared towards optimizing data storage solutions, allowing for exponential increases in memory capabilities without requiring additional physical hardware. DenseMem is ideal for environments where memory demands are rigorous, effectively catering to high-performance applications while lowering the cost per byte of storage.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
LEE Flash G1 is a highly cost-effective embedded Flash solution optimized for scalability down to a 40nm process, making it an excellent fit for medium memory capacity applications requiring up to several hundred kilobytes. Built on a simplified SONOS architecture, it supports automotive-grade temperature and quality standards. The G1 model allows seamless integration with standard CMOS processes, preserving existing IPs and macros without altering the SPICE model of logic transistors, thus avoiding costly redesigns. Its minimal mask requirement (2-3 additional masks) further ensures a cost-efficient setup, with reduced testing and bake times achieved through innovative power management techniques. Proven for long-term data retention in high-temperature conditions, LEE Flash G1 demonstrates unparalleled endurance and performance for demanding embedded applications.
The AndeShape platform supports AndesCore processor system development by providing a versatile infrastructure composed of Platform IP, hardware development platforms, and an ICE Debugger. This allows for efficient integration and rapid prototyping, offering flexibility in design and development across a comprehensive set of hardware options. It aims to reduce design risk and accelerate time-to-market.
The AHB-Lite Memory module is a fully parameterized soft IP that provides on-chip memory access capabilities for AHB-Lite based Masters. This IP ensures high-speed data access and storage solutions within microprocessor-based systems, enhancing overall system performance and efficient resource management.
The ABX Platform by Racyics utilizes Adaptive Body Biasing (ABB) technology to drive performance in ultra-low voltage scenarios. This platform is tailored for extensive applications requiring ultra-low power as well as high performance. The ABB generator, along with the standard cells and SRAM IP, form the core of the ABX Platform, providing efficient compensation for process variations, supply voltage fluctuations, and temperature changes.\n\nFor automotive applications, the ABX Platform delivers notable improvements in leakage power, achieving up to 76% reduction for automotive-grade applications with temperatures reaching 150°C. The platform's RBB feature substantially enhances leakage control, making it ideal for automotive uses. Beyond automotive, the ABX Platform's FBB functionality significantly boosts performance, offering up to 10.3 times the output at 0.5V operation compared to non-bias implementations.\n\nExtensively tested and silicon-proven, the ABX Platform ensures reliability and power efficiency with easy integration into standard design flows. The solution also provides tight cornering and ABB-aware implementations for improved Power-Performance-Area (PPA) metrics. As a turnkey solution, it is designed for seamless integration into existing systems and comes with a free evaluation kit for potential customers to explore its capabilities before committing.
Secure OTP offers advanced anti-fuse memory protection, serving as a reliable safeguard for embedded non-volatile memory. Integrating Physical Macros and Digital RTL, it provides a robust solution for sensitive data storage such as keys and boot code. With a 1024-bit PUF, Secure OTP handles data scrambling and IO shuffling, ensuring high-security protection against physical threats. Its universality in integration across multiple ASIC applications makes it an integral component in securing data within IoT devices and extending its utility to diverse markets such as PCIe and Smart TVs.
Static Random-Access Memory (SRAM) from DXCorr is a highly efficient storage solution, optimized for high performance and power efficiency. These memory blocks are crucial for applications requiring rapid access to data with minimal power consumption. Offered in various configurations, DXCorr's SRAM is suitable for a wide range of applications, from consumer electronics to complex data centers. SRAM technology from DXCorr is engineered to deliver exceptional data retention and quick access times, making it ideal for buffer storage and cache memory. It operates without the need for refresh cycles, an advantage over dynamic RAM that translates into faster performance and reduced power usage. The company’s expertise in fine-tuning SRAM to specific needs ensures unmatched performance across different process nodes. This memory technology is integral to many modern systems, including integrated circuits for communications, automotive, and computing industries. The combination of high speed and low power consumption positions DXCorr's SRAM as a vital component in enhancing overall system efficiency.
Building on the G1 architecture, LEE Flash G2 introduces groundbreaking features that extend its capabilities beyond traditional Flash solutions. This IP offers seamless integration with logic circuits, enabling the creation of non-volatile SRAM configurations. The LEE Flash G2 operates without the need for high-voltage isolation, ensuring simplified layout designs and ultra-low power consumption. This makes it particularly valuable for applications demanding high-speed operations and substantial memory capacity, extending up to several megabytes. The G2's support for standard CMOS processes and its minimal impact on the existing PDK and Spice model enable designers to incorporate non-volatile functionalities within logic circuits effortlessly, paving the way for innovative circuit designs.
xT CDx is an advanced genomic profiling solution used for comprehensive tumor and normal matched testing in oncology. With a focus on solid tumors, xT CDx leverages extensive gene coverage to aid in clinical decision-making. The system utilizes high-depth sequencing to provide actionable insights, aligning genomic findings with targeted therapy options. The platform is renowned for its substantial coverage of exons and is accredited for detecting a wide array of variants that contribute significantly to personalized medicine. As an in vitro diagnostic system, xT CDx is designed to serve as a companion diagnostic tool for oncologists, particularly in tailoring treatments that align with existing therapeutic guidelines. Its sophisticated analytical capabilities ensure that oncologists have the support they need to match patient profiles with clinical trials and approved treatments promptly. This facilitates a genomic-centric approach, integrating DNA sequencing insights into the broader clinical workflow. Incorporating both tumor and normal tissue comparisons, xT CDx is able to discern hereditary traits that might influence cancer treatment. This dual-approach testing enhances the diagnosis accuracy and optimizes treatment pathways, setting a new standard in oncology precision testing.
LEE Fuse ZA offers a one-time programmable, non-volatile memory solution well-suited for trimming and redundancy applications, especially when reprogramming is not necessary. This anti-fuse memory IP can be implemented without additional masks, significantly lowering production costs. Adaptable to a wide range of process nodes from 180nm down to sub-10nm, it supports advanced processes with minimal disruptions. LEE Fuse ZA's straightforward manufacturing requirements and robust adaptability make it an ideal choice for applications demanding long data retention at high temperatures, particularly in automotive-grade environments.
Trion FPGAs by Efinix are engineered to meet the demanding needs of the fast-paced edge computing and IoT markets. These FPGAs feature Efinix's innovative Quantum® compute fabric, providing a compact yet powerful processing platform. Particularly suitable for general-purpose applications, Trion devices cover a range of logic densities to suit various needs, from mobile and IoT to consumer-oriented and industrial applications. Built on a 40 nm process node, Trion FPGAs incorporate critical functionalities such as GPIO, PLLs, MIPI interfaces, and DDR controllers, establishing a versatile base for numerous potential implementations. These features allow developers to address complex compute tasks efficiently, making Trion FPGAs ideal for scenarios where space is at a premium and performance cannot be compromised. Trion FPGAs are designed for development speed and simplicity, supported by their small package sizes and efficient power consumption. This makes them particularly appropriate for handheld devices and application sectors such as med-tech and smart home technology. With ready capabilities for image enhancement, feature extraction, and real-time data processing, Trion FPGAs facilitate the rapid deployment of smart solutions. Besides their technical robustness, Trion devices offer a strategic advantage with their long-term lifecycle support until at least 2045, aligning with the extended production needs typical in industrial fields. This, coupled with their seamless configuration and migration features, sets Trion FPGAs apart as a top choice for integrated and edge applications.
PermSRAM is a dynamic non-volatile memory macro designed to be implemented on standard CMOS platforms, spanning process nodes from 180nm to 22nm and beyond. This memory technology offers a suite of functions including one-time programmable ROM and a multi-time programmable ROM, adaptable through its multi-page configuration. PermSRAM covers a wide range of memory sizes from 64 bits to 512K bits, making it versatile for numerous applications. The memory ensures security with its non-rewritable hardware lock, ideal for storing sensitive security codes. Its invisible charge trap memory mechanism makes it tamper-resistant without needing a charge pump for read operations. Furthermore, the built-in self-test circuit simplifies testing processes, supporting conventional test equipment for ease of use. Targeted applications include analog trimming, program storage, and memory repair, among others. The PermSRAM memory is also optimized for environments demanding high reliability, with proven stability and superior performance. Its capabilities make it an excellent choice for sectors that require robust data retention, even at automotive-grade temperatures exceeding 150 degrees Celsius.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
iModeler is Xpeedic's innovative solution for automated PDK model generation. This tool streamlines the process of creating Process Design Kits, which are foundational for semiconductor manufacturing processes. iModeler’s capabilities in automating PDK generation reduce time and resources required, providing a significant advancement over traditional manual methods. By utilizing sophisticated algorithms, iModeler enhances accuracy in developing intricate models that are essential for advanced semiconductor fabrication. The tool supports a broad range of semiconductor processes, ensuring cross-compatibility and robustness in model output. This level of precision supports engineers in achieving optimal results in both design and manufacturing stages. With iModeler, companies can significantly boost their development productivity, enabling quicker turnarounds in the semiconductor lifecycle. For organizations looking to maintain cutting-edge competitiveness, iModeler is a game-changer, providing the necessary infrastructure to support rapid advancements in chip manufacturing technologies.
Silvaco offers an elite commission of Embedded Memory Compilers, ideal for high-performance, low-power, and dense design necessities. These compilers deliver an excellent yield across a range of process technologies, incorporating advanced cache architectures to optimize scalability and performance. Their multi-mode power management ensures low-leakage and voltage compliance, supporting technologies from SRAM to ROM, facilitating battery-lasting devices with robust validation and redundancy features built in, suitable for diverse manufacture demands. The compilers adjust to an array of foundries and node processes, cementing Silvaco's placement in a multitude of successful designs.
Everspin's xSPI solution caters to the demands of industrial IoT and embedded systems through innovative MRAM technology. Based on the latest JEDEC standard for non-volatile memory, the xSPI series offers multiple input/output compatibility, featuring a clock speed up to 200MHz, accommodating a wide range of high-speed, low-pin applications. This MRAM solution is particularly adept at replacing legacy memory formats such as SRAM and NVSRAM, offering superior performance and enhanced data storage stability. With support for both quad and octal interface configurations, densities range from 4Mb to 128Mb, with the memory performance offering operational speeds of up to 400MBps via its SPI-compatible bus. Developed to satisfy universal memory application requirements, the xSPI series is increasingly foundational to sophisticated systems across industrial control, gaming, and automotive sectors. Its robust architecture assures reliability, endurance, and compatibility with evolving industry standards, making it a pivotal component in modern electronics.
The LEE Flash ZT IP is designed to deliver efficient non-volatile memory solutions for sensor, power, and analog IC applications, particularly within the automotive sector. This IP is distinguished by its capability to operate at high temperatures, ensuring a 20-year data retention at 125°C without the need for additional manufacturing masks, thereby reducing production costs significantly. The ZT model utilizes a standard CMOS process, allowing for easy integration with existing design and IP infrastructures. This compatibility ensures a streamlined and cost-efficient transition to advanced memory solutions. With the FN tunneling technology, it achieves minimal power consumption during program and erase operations, supporting extensive programming cycles and offering the durability required for high-demand environments.
Everspin's Parallel Interface MRAM is engineered to offer SRAM-compatible performance with non-volatile benefits, featuring access times ranging from 35 to 45 nanoseconds. These devices provide substantial data integrity, ensuring retention for more than 20 years through low-voltage inhibit pathways that safeguard against erroneous writes during power anomalies. The Parallel Interface lineup encompasses both 8-bit and 16-bit formats, with memory densities from 256Kb to 32Mb, operating on standard 3.3V voltage. This product line achieves seamless data recovery and instantaneous access, making it particularly optimal for applications like industrial fabrics, avionics, and systems that demand steady data performance and rapid recovery post-power restarts. Engineered for endurance, these MRAM products can operate under intense memory demands without the risk of degradation. Everspin's technical advances allow the Parallel Interface series to function effectively amidst the most strenuous operating conditions, supporting long-lasting data storage and immediate accessibility.
Avant Technology offers a broad range of JEDEC-compliant industrial embedded DRAM memory modules suitable for applications in gaming, point-of-sale systems, kiosks, medical equipment, and automation. These modules feature options including low voltage, high capacitance, and low power consumption, making them versatile for various demanding environments. Available in form factors like UDIMM, SODIMM, ECC DIMM, and Mini DIMM, these memory modules support DDR3, DDR4, and DDR5 interfaces, catering to industrial, commercial, and consumer markets with diverse temperature ranges.
NRAM stands as a revolutionary advance in memory technology, introducing next-generation non-volatile random access memory leveraging carbon nanotube (CNT) technology. Designed to outperform and outlast existing memory solutions like DRAM and NAND, the NRAM is incredibly fast, with speeds equivalent to DRAM and 100 times faster than NAND. It also offers massive scalability with the potential for multilayer 3D architectures, making it exceedingly beneficial for various applications where speed, density, and non-volatility are paramount.\n\nThis innovative technology, grounded in CNT's exemplary electrical and structural properties, allows NRAM to maintain data integrity even under extreme conditions. The memory can withstand high temperatures, radiation, and magnetic fields, and its resistance to these environmental factors makes it indispensable for critical and harsh-use environments like space, automotive, and military applications. Its minimal power draw in standby mode further underscores its ideal fit for energy-sensitive applications.\n\nNRAM's scalability is anticipated to reach process nodes below 5nm, aligning with industry's move towards tinier and more efficient electronic components. Standard production with current CMOS processes without any need for additional equipment not only minimizes production costs but also ensures a broad compatibility across existing fabrication lines. This capability makes it an attractive solution for both standalone memory modules and embedded memory, ready to disrupt and potentially replace entrenched memory technologies.
Trifecta-SSD-RAID is a high-performance, single-slot M.2 NVMe SSD RAID module designed for PXIe and CPCIe platforms. Tailored for wideband, high-speed RF and microwave recording, playback, and data storage, this product excels in both capacity and speed. It supports storage capacities ranging from 8TB to 64TB per slot, and offers robust sequential read/write performance of up to 7 GB/sec. Its architecture enables the use of up to eight M.2 NVMe SSDs, leading to exceptional storage performance without common glitches. The module is ideal for applications requiring sustained high bandwidth streaming, such as multi-channel RF signal recording. Compatible with both Windows and select Linux distributions, the Trifecta-SSD-RAID ensures high compatibility across a variety of operating systems and complies with industry standards including RoHS and FCC Class A. This product sets a new standard for storage solutions with its long lifecycle and value-based pricing, typically offering per-terabyte costs significantly lower than competitors.
CodaCache Last-Level Cache IP enhances system-on-chip (SoC) designs by providing performance-optimized cache solutions geared towards improving data access and power efficiency. It addresses key challenges in SoC development, such as performance bottlenecks, integration complexities, and real-time processing needs. This highly configurable cache ensures efficient utilization of memory resources by reducing the dependence on main memory, thereby lowering overall power consumption and enhancing system performance. CodaCache offers a flexible architecture that accommodates various SoC configurations. Its scratchpad memory and partitioning capabilities allow developers to tailor the cache performance to specific application requirements. The integration of performance monitors facilitates the real-time analysis of system performance, allowing dynamic optimization for both power usage and data throughput. The CodaCache IP is particularly effective in designs that require scalable, distributed memory solutions for optimal data re-use scenarios. An ideal companion for the FlexNoC and FlexWay NoCs, CodaCache strengthens the entire SoC architecture by minimizing latency and improving overall system efficiency. It integrates seamlessly with existing design environments, supporting industry-standard interfaces such as AXI for interoperability across different IP modules. The intuitive configuration tools, coupled with advanced safety options, make CodaCache a preferred choice for complex SoC deployments wanting tailored data management solutions at lower costs.
The Trifecta-SSD-RM offers a flexible, high-performance data storage solution for PXIe and 3U CPCIe environments. It features removable M.2 NVMe SSD cartridges supporting capacities from 1TB to 8TB. This single-slot module boasts read/write speeds up to 3.5 GB/sec, significantly enhancing data throughput compared to traditional Embedded Controller SSDs. Beyond speed, the Trifecta-SSD-RM supports software-based RAID configurations, allowing users to customize capacity and performance as needed. This flexibility makes it an excellent fit for data-intensive applications requiring swift data backup and security level modifications, all while offering an affordable price point. The product's rapid interchangeability of data cartridges simplifies upgrades and replacements, effectively addressing evolving data acquisition needs. With its robust design and manufacturing in the USA, Trifecta-SSD-RM maintains a long lifecycle, making it a reliable choice for advanced data storage solutions.
I-fuse Replaser technology brings a new dimension to fuse-based memory solutions. Tailored to address complex data storage and retrieval needs, it offers heightened performance for high-density applications.\n\nThis IP is characterized by its remarkable capacity for adaptability, supporting seamless integration across multifunctional platforms that require superior data precision and reliability. Such an innovative solution is essential for industries demanding leading-edge memory solutions capable of withstanding intensive data tasks. \n\nThe versatility of this technology spans across industry applications demanding scalability and efficient data processing. By maintaining a continual ability to enhance memory systems, I-fuse Replaser represents the leading edge in cost-effective semiconductor advancements.
NuRAM Low Power Memory represents a breakthrough in memory technology, utilizing the reliable MRAM architecture to deliver fast access times while significantly reducing leakage power. This IP is a compelling choice for system designs looking to upgrade from traditional SRAM or nvRAM, as well as embedded Flash. Its innovative design allows for substantial size reduction, enabling more efficient memory footprints, which translates into reduced power needs and potentially minimal DDR memory access. Furthermore, the memory can be completely powered down without losing stored data, offering impressive power and latency optimizations that are critical for modern digital systems.
ReRAM Memory is an advanced memory technology that CrossBar offers, which is designed to revolutionize conventional memory solutions by delivering unmatched energy efficiency and performance. This memory type operates significantly faster, offering 100 times the read performance and 1000 times the write performance compared to traditional memory systems. With its capacity to scale below 10nm and support 3D stacking, ReRAM Memory facilitates increased on-chip storage and efficient integration with logic circuits, making it ideal for high-performance applications. ReRAM technology is particularly beneficial for systems that require high endurance and low power consumption, such as IoT and data center environments. The capability to operate with one-twentieth the energy of conventional memory solutions underscores its suitability for applications where power efficiency and rapid data processing are crucial factors. Additionally, ReRAM provides terabytes of on-chip memory, enabling new methods of handling vast data volumes efficiently and securely. Engineers and system architects interested in pioneering storage solutions can collaborate with CrossBar to integrate ReRAM technology into their Integrated Circuit (IC) designs, starting at 40nm production. This technology's simplicity and effectiveness open pathways for innovative computing methodologies that surpass the limitations of past memory structures.
SmartMem Subsystem IP enhances ease of use and scalability by optimizing power, performance, and endurance across a variety of memory types, including NuRAM and other MRAM technologies, as well as RRAM, PCRAM, and embedded Flash. This versatile memory subsystem is fully synthesizable and configurable, making it an excellent choice for SOC designs that require customizable compute-in-memory solutions. SmartMem supports high performance in demanding environments, providing essential features for adaptive memory management that greatly improve the deployed memory's operational efficiency and effectiveness. Its value lies in its ability to improve the utility of existing memory technologies while offering a robust framework for new developments.
SystemBIST is a revolutionary product within Intellitech’s IP portfolio, providing unparalleled capabilities for FPGA configuration and JTAG-based embedded testing. As a flexible plug-and-play device, SystemBIST allows the configuration of a wide range of IEEE 1532 or IEEE 1149.1 compliant FPGAs and CPLDs. This makes it highly versatile for design engineers looking to develop high-quality, self-testable products that can be reconfigured in the field, extending product life and adaptability. Built on patented architectures, SystemBIST simplifies typical configuration challenges by embedding built-in self-test (BIST) capabilities, thereby eliminating the need for complex software-driven BIT solutions. This device effectively compresses and stores test patterns and scripts within FLASH memory, allowing for comprehensive PCB testing wherever power is available. SystemBIST caters to a broad spectrum of applications, from normal operation reconfigurations to safe field updates, ensuring that the underlying firmware remains secure against potential threats like trojan bitstreams. Its user-friendly development tools facilitate rapid deployment and debugging, offering developers an efficient means of maintaining system integrity and performance over time.
Everspin's Toggle MRAM technology offers a dense and reliable memory solution, utilizing a single transistor, single magnetic tunnel junction (MTJ) memory cell. The unique Toggle MRAM cell design affords high reliability by ensuring data remains non-volatile for two decades, even under variable temperature conditions. The memory integrates seamlessly with existing silicon circuits, provides quick access similar to SRAM, and maintains data in the event of power loss like flash memory. The operational mechanism involves reading data by activating a pass transistor and comparing the MTJ's resistance to a reference. During write operations, the magnetic orientation of the MTJ is altered by intersecting magnetic fields from write lines, without affecting other cells. This magnetic-based storage approach achieves high-speed data access while protecting information integrity across different electronic applications. Toggle MRAM is particularly useful in systems requiring fast power cycles with non-volatile memory needs. Its endurance and reliability make it a favored option in many industrial and consumer electronics, paving the way for its deployment in various high-demand scenarios.
The TySOM Boards family, developed by Aldec, is a range of versatile embedded system prototyping boards tailored to support rapid development of complex applications. With options featuring FPGAs like the Xilinx Zynq UltraScale+, Zynq-7000, and the Microchip PolarFire SoC, these prototyping boards cater to a wide array of sectors from automotive to industrial automation. These boards are distinguished by their compatibility with industry standard interfaces such as FMC and BPX, allowing for flexible expansion through Aldec's extensive range of daughter cards. This adaptability makes TySOM boards an asset for projects in artificial intelligence, machine learning, and Internet of Things (IoT), especially where complex, high-performance embedded systems are in demand. Providing a robust platform for both prototyping and real-world deployment, TySOM boards ensure developers can move swiftly from concept to prototype, achieving efficiency in the design lifecycle. This practicality extends to applications such as automotive ADAS, embedded vision, and edge-processing, making the family integral to contemporary embedded solution projects.
The EverOn memory solution by SureCore offers revolutionary energy efficiency, designed to minimize power consumption without compromising performance. This low-power memory technology is ideal for devices where battery life and power density are critical concerns, such as mobile applications and IoT devices. EverOn incorporates innovative design techniques to extend battery life significantly, allowing for longer device usage between charges.\n\nEverOn achieves its impressive power savings through a combination of architectural advances and process optimizations. It provides flexible configuration options to meet diverse application requirements, making it a suitable choice for a range of industries. The solution is versatile and can easily be integrated into various systems, reducing the overall energy footprint of devices while maintaining optimal functionality.\n\nAdditionally, the EverOn technology supports a wide range of operating voltages, ensuring compatibility with different chip processes and manufacturing technologies. This adaptability is crucial in allowing manufacturers to implement power-efficient designs without the need for extensive system overhauls, making it a practical choice for both new and existing product lines.
The Fast Access Controller (FAC) is Intellitech's specialized solution designed for fast and efficient programming of on-board Flash memory, particularly beneficial in production environments. This pre-engineered IP is ideal for designers of processors, SoCs, and ASICs seeking enhanced test capabilities and performance in Flash programming. A key feature of the FAC is its ability to load a minimal bitstream that enables high-speed data transfer to Flash over the IEEE 1149.1 bus. This capability is particularly valuable in reducing the time and complexity associated with programming external memory components on PCBs, making it a preferred choice for environments requiring rapid throughput. By integrating FAC into a PCB design, engineers can respond to customer demands for improved Design-for-Test methodologies and seamless production support without incurring additional costs. FAC is seamlessly integrated with the Eclipse Test Development Environment, ensuring that it is fully supported in both lab and production line settings. This integration not only enables rapid test development and validation but also allows for consistent application across different stages of a product's lifecycle.
Everspin's MRAM products designed for radiation-hard markets bring resilience and reliability to environments facing high-radiation exposure such as aerospace and space missions. Conventional electronic memory storage uses electric charges; however, in radiation-prone settings, these can easily lead to data loss. Everspin's MRAM circumvents this issue by using magnetic storage, providing a more stable alternative. With proven effectiveness in space applications, Everspin MRAM offers unique robustness with zero hard errors at radiation levels exceeding 1 Mrad. Its U.S. manufacturing capability enables the company to supply both discrete and embedded MRAM that can withstand intense radiation, making it a trusted choice for aerospace and military applications. Additionally, the company provides a roadmap for evolving its MRAM solutions to maintain competitiveness and ensure long-term availability. By offering bespoke solutions, Everspin contributes significantly to equipping advanced systems with memory solutions impervious to radiation-induced failures.
Spin-transfer Torque MRAM (STT-MRAM) by Everspin introduces a paradigm shift in memory technology, efficiently combining high-speed performance with non-volatile data retention. By leveraging the spin of electrons to establish desired magnetic states, STT-MRAM drastically reduces the energy required for switching and offers scalability for higher density memory solutions. Everspin's STT-MRAM is crafted for diverse use cases, such as data center operations and industrial IoT applications. Its DDR-like interface simulates the behavior of DRAM while offering persistent data storage without the typical wear-and-tear associated with traditional memory solutions. This technology allows for high throughput, low latency operations with enduring reliability. With a focus on performance, durability, and capacity, STT-MRAM is suited for environments demanding robust data handling under extreme conditions. The technology further supports significant endurance improvement over prolonged use, making it a key enabler in memory stack optimization in modern computing frameworks.
The Stream Buffer Controller is designed for AMD and Intel FPGAs, acting as a bridge between stream and memory-mapped DMA with support for up to 16 independent streams. It facilitates data buffering in an external memory with up to 4 GB capacity, providing versatile FIFO-like capability. Each stream operates through configurable memory, utilizing AMBA AXI4-Stream interfaces for streamlined communication between embedded CPUs, FPGAs, or controllers.
The Flash Protection Series extends hardware security by safeguarding both embedded and external flash memory, making it essential for maintaining data integrity in System on Chip (SoC) environments. This series includes PUFef, designed for embedded flash, which incorporates a Hardware Root of Trust with a lightweight crypto engine, and PUFenc for external NAND flash memory, which secures stored assets by employing local keys for encryption. Furthermore, PUFxip focuses on NOR flash, offering real-time decryption for execution-in-place efficiency. These solutions facilitate maintaining a secure boundary, thus preventing unauthorized access and upholding the confidentiality of valuable SoC data.
EFLX eFPGA is a cutting-edge embedded FPGA solution that offers unprecedented flexibility and adaptability for SoC designs. It allows developers to enhance their chip designs by incorporating reconfigurable logic that can be adjusted even post-production. This capability enables shorter time-to-market and reduced costs by allowing rapid prototyping and customization without full chip redesigns. The EFLX eFPGA is particularly beneficial for applications requiring frequent updates or where multiple variants of a product are needed. By integrating reprogrammable logic into an SoC, it provides a scalable solution adaptable to various applications, from consumer electronics to complex communication systems. Its architecture is optimized for fast configuration and supports a wide range of processes and nodes, ensuring compatibility with major foundries. Moreover, the EFLX eFPGA's innovative approach reduces latency and power consumption compared to traditional FPGA solutions. Its seamless integration into existing hardware platforms makes it an ideal choice for upgrading legacy systems with new functionalities, giving companies a competitive edge in rapidly evolving markets.
Xenergic's High-Speed Turbo Memory IP represents a significant evolution in high-speed data processing. This memory architecture leverages predictable access patterns to achieve tremendous reductions in power usage and chip area. By exploiting these predictable patterns, such as those found in AI and graphic processing applications, it manages to operate at double the speed of the fastest current SRAMs available. This solution reduces dynamic power consumption by 80%, diminishes leakage by up to 60%, and minimizes area by 60%, all while maintaining cutting-edge performance capabilities. Its design supports high throughput for applications scalable to large buffer and cache systems, making it perfect for ML, AI, and advanced image processing tasks.
TwinBit Gen-1 is an embedded non-volatile memory solution that excels in high-endurance performance, suitable for process nodes ranging from 180nm to 55nm. This memory type is seamlessly incorporated into CMOS logic processes without the need for additional masks or processing steps, making it highly efficient and cost-effective. Engineered for low-voltage and low-power operations, TwinBit Gen-1 is ideal for various applications such as IoT devices, ASICs, and systems requiring embedded NOR FLASH. It offers high density and a small physical footprint, maintaining data integrity and performance even under extreme conditions, up to automotive-grade standards specified by AEC-Q100. Its technology supports operations like analog trimming and security key storage, with built-in test circuits facilitating straightforward testing. TwinBit Gen-1's compatibility extends to products that need field-rewritable functionalities, reflecting its flexibility and application versatility across multiple domains.
TwinBit Gen-2 expands the capabilities of true logic-based non-volatile memory across advanced process nodes from 40nm to 22nm and beyond. This generation continues the tradition of eschewing additional masks or process requirements, offering ultra-low-power operations with its innovative Pch Schottky Non-Volatile Memory Cell. This memory type leverages hot carrier injection and advanced cell bias control to perform program and erase functions effectively. It stands out for its low-power footprint, ensuring efficient performance in different technological applications. These features make it suitable for refined uses within sectors that demand cutting-edge, power-efficient memory solutions. TwinBit Gen-2 is designed to integrate effortlessly into sophisticated electronic devices, supporting high-density memory applications without compromising on reliability or performance standards. Its groundbreaking design underlines NSCore’s commitment to delivering robust non-volatile memory solutions for modern semiconductor challenges.
CrossBar's ReRAM IP Cores for High-Density Data Storage represent a breakthrough in memory technology, tailored for applications requiring substantial data handling capabilities. These cores provide an exceptional combination of low power consumption and high-speed data access, making them perfect for use in environments like data centers, mobile computing, and AI applications where memory performance is critical. Engineered to support densities from 64 Gbits to custom sizes, these high-density IP cores enable the realization of innovative storage solutions such as non-volatile DIMMs (NVDIMMs), capable of achieving impressive performance benchmarks like 25.6 GB/s with random read latencies of around 250 ns. The architecture supports up to 1TB per package, allowing for the design of sophisticated systems that manage intense workloads with efficiency. Furthermore, the technology underpinning these IP cores includes built-in security features, leveraging ReRAM's ability to function as a secure source of cryptographic keys. This ensures that data integrity and protection against unauthorized access are maintained, critical for applications that store and process sensitive information.
Xenergic's High-Speed Low-Power SRAM IP is designed to deliver maximum power efficiency without compromising on performance. This solution sees significant reductions in dynamic power usage and leakage, while maintaining high speeds and a competitive area. It is specifically optimized for applications such as IoT, sensors, and wearables, where conserving power is critical due to limited power budgets. The SRAM architecture supports better power optimization through both dynamic and static adjustments, positioning it as an ideal choice for always-on applications. By leveraging its low power nature, it enables efficient computation at the edge, particularly valuable in the burgeoning IoT landscape, ensuring reduced latency and improved device performance.
The ReRAM IP Cores for Embedded NVM in MCU & SOCs are advanced memory cores designed to enhance embedded systems with efficient non-volatile memory solutions. Highly versatile, these cores can be deployed in a range of applications, from Internet of Things to high-performance consumer electronics. They offer multi-time programming capabilities, making them optimal for systems requiring flexibility in data storage and execution. These IP cores excel in providing low latency and high endurance, qualities essential for modern microcontroller units and Systems-on-Chip that demand efficient memory utilization. Starting from the 28nm process technology node, they reduce power consumption while improving performance, vital for the energy-efficient operation of wearables and portable devices. CrossBar's technology also supports secure memory operations, including the use of secure physical unclonable function (PUF) keys, facilitating a robust architecture for storing sensitive information securely in semiconductor devices. Given the flexibility in memory density and the IP's capability to scale below 10nm, developers can integrate these cores into designs that require a high degree of adaptability and efficiency.
The Serial Peripheral Interface MRAM from Everspin is designed for applications where rapid data storage and retrieval are paramount, yet with minimal pin usage. Designed with a streamlined 16-pin SOIC package, it allows for efficient space utilization making it perfect for embedded system applications with size constraints. The architecture enables quad and higher I/O paths that provide swift read and write capabilities, reaching transfer rates of up to 52MB per second, outperforming many parallel MRAM systems. This makes it particularly useful for RAID systems, server logs, and storage buffers where quick data access and refresh cycles are critically important. Engineers value this MRAM series for its low power consumption and high durability under varied operational conditions, making it a versatile solution for cutting-edge electronic applications requiring persistent memory. With SPI interfacing, these devices offer low pin count integration and reliable operations, ensuring robust performance with optional evaluation boards for prototyping and testing.
Spectral MemoryIP comprises a suite of silicon-proven, high-density, and low-power SRAM libraries designed for efficient storage solutions. The library features six main architectures including Single Port and Dual Port SRAMs, ROM, and various register files. These are suited for applications requiring rapid access and minimal energy consumption. Spectral's MemoryIP is implemented with foundry-specific or custom-designed bit cells to uphold robust performance. This technology is tailored to standard CMOS processes and offers a broad array of customization options. Developers can utilize the MemoryDevelopmentPlatform to modify and retarget the designs for other technologies, thereby extending its capabilities in embedded solutions. It is widely applicable, offering configurations with data widths ranging from 4 to 144 bits across different aspect ratios and memory depths. The robust architecture of Spectral MemoryIP ensures high-speed operations and low dynamic power consumption, making it ideal for diverse applications ranging from boot code storage to nonvolatile memory needs. Additionally, users can benefit from various low-power modes and advanced features like BIST and ECC, supporting seamless integration into complex systems.
Spectral CustomIP is a specialized collection of silicon-proven memory architectures crafted for a variety of integrated circuit applications. These architectures, which include Binary and Ternary CAMs and multi-ported memories, are engineered to deliver exceptional performance with low dynamic power requirements. CustomIP is ideal for cases requiring specialty memory solutions not readily available in the market. This set of IP utilizes Spectral's proprietary bit cells for consistent and reliable operation across various environments. It is adaptable for use with standard CMOS and embedded Flash processes, making it versatile for a wide range of technological demands from consumer devices to complex networking hardware. CustomIP's architecture is equipped with multiple advanced features such as multi-bank and multi-port options, making it suitable for graphics applications and fast hardware search requirements. In essence, Spectral's CustomIP caters to both companies creating distinctive IC products and those seeking control over their memory IP development.
The Vega eFPGA from Rapid Silicon represents an innovative leap in providing customizable FPGA capabilities to System-on-Chip (SoC) designs. This eFPGA is designed to deliver flexibility and efficiency, allowing a seamless integration that enhances performance without raising costs. By embedding programmability directly into SoCs, Vega eFPGA facilitates diverse and adaptable computing needs. Structured with three configurable tile types – CLB, BRAM, and DSP – the Vega eFPGA is engineered for optimal performance. The CLB comprises eight 6-input lookup tables (LUTs), each offering dual independent outputs. It includes features like fast adders with carry chains and programmable registers, ensuring computational versatility. The BRAM component supports 36Kb dual-port memory, adaptable as 18Kb split memory configurations. The DSP tile incorporates an 18×20 multiplier with a 64-bit accumulator, supporting complex mathematical processing. Rapid Silicon's Vega eFPGA is optimized for scalability, providing flexibility in tile configurations to meet varied application requirements. It ensures ample compatibility with existing systems through seamless SoC integration, proprietary Raptor EDA tools, and robust IP libraries. These capabilities enable Vega to offer bespoke solutions tailored to specific end-user needs.
RIFTEK's Absolute Linear Position Sensors stand as a testament to the company's commitment to precision and innovation in non-contact measurement. Designed specifically for measuring displacements and other dimensional properties, these sensors ensure unrivaled precision in tracking changes in the objects' positions. The sensors are particularly beneficial in environments demanding exactness such as automated production lines and quality control settings. These devices employ advanced absolute measurement technology ensuring consistent accuracy across their entire measuring range, which spans from a minimal 3 mm to a maximum of 55 mm. They are equipped with a fine resolution of 0.1 μm, offering precise details of every minor movement or displacement, making them indispensable tools in applications where high precision is critical. In practice, these sensors shine in their capacity to deliver real-time displacement data, facilitating better control and quality management in manufacturing processes. Their robust construction ensures long-lasting performance, and their application versatility means they can be integrated seamlessly into various industrial setups requiring positional accuracy.