All IPs > Memory & Logic Library
The Memory & Logic Library category in our semiconductor IP catalog offers a comprehensive range of intellectual property that is essential for creating efficient and high-performance semiconductor solutions. This category is pivotal for designers who require reliable and optimized components to be integrated into a wide array of electronic products.
Key offerings within this category include Embedded Memories, I/O Libraries, and Standard Cells, each playing a critical role in the functionality of integrated circuits (ICs). Embedded Memories are vital for storing data within semiconductor chips, ranging from simple storage solutions to complex memory architectures that support high-speed operations. These are used in everything from microcontrollers for consumer electronics to high-end processors for enterprise-grade applications.
I/O Libraries, on the other hand, provide the necessary interface between the semiconductor device and the outside world. They encompass a wide variety of input/output configurations and technologies, ensuring efficient communication and data transfer is maintained across the chip's interfaces.
Finally, Standard Cells form the building blocks of digital circuits. They provide pre-designed, pre-verified logic functions that simplify the design process, increase reliability, and reduce time to market. Standard cells are integral in the design of ASICs (Application-Specific Integrated Circuits) and other custom logic devices. Our Memory & Logic Library category thus enables semiconductor engineers to access a diverse set of IPs crucial for modern electronics design and innovation.
KPIT offers tailored solutions that aid in transforming traditional internal combustion engine vehicles into efficient electric and hybrid powertrains. These solutions emphasize reducing the total cost of ownership for new energy vehicles while enhancing their product quality and compliance with global sustainability standards. KPIT's integrative approach includes ready-to-use software platforms that streamline development processes and ensure seamless updates and validations, supporting the shift towards a sustainable future.
Vehicle Engineering & Design Solutions by KPIT revolve around transforming vehicle development through cutting-edge design and simulation technologies. By employing advanced Computer Aided Design (CAD) and virtual prototyping, KPIT enhances product development and market entry speed. The focus is on aligning vehicle aesthetics with functional performance, ensuring that vehicles not only appeal to modern consumers but also comply with modern sustainability mandates. KPIT’s holistic approach offers comprehensive solutions that simplify the design and validation processes, fostering innovation in both conventional and electric vehicle configurations.
DenseMem facilitates a significant enhancement in memory capacity by effectively doubling the CXL-connected memory. This advanced technology is geared towards optimizing data storage solutions, allowing for exponential increases in memory capabilities without requiring additional physical hardware. DenseMem is ideal for environments where memory demands are rigorous, effectively catering to high-performance applications while lowering the cost per byte of storage.
LEE Flash G1 is a highly efficient SONOS-based embedded Flash solution tailored for medium capacity memory requirements. By leveraging a refined SONOS architecture, it ensures minimal changes to existing standard CMOS processes, allowing for seamless integration into current designs without altering the logic characteristics. G1 supports high-temperature reliability and long-term data retention, making it an ideal choice for automotive applications. This product excels in reducing cost thanks to its low power consumption during programming and erasure operations, supported by 2 to 3 additional masks, a significant economization compared to typical Flash solutions. The architecture supports a high number of program/erase cycles and guarantees stable retention over temperature extremes, which is crucial for automotive and industrial applications. Its architecture allows for the reuse of existing IP assets, thus eliminating the need for additional expensive investments on Flash technology-specific designs. Manufacturing adaptations are minimal, aimed at keeping chip costs low while delivering reliable, high-speed performance.
AHB-Lite Memory by Roa Logic refers to an adaptable soft IP solution providing efficient on-chip memory that is directly accessible by an AHB-Lite based master. This memory module is designed with flexibility in mind, customizable to fit the specific data throughput and storage demands of varied applications. The architecture of the AHB-Lite Memory module ensures seamless integration within AHB-Lite systems, supporting reliable and high-speed memory operations. It plays a critical role in facilitating data storage and retrieval, which are fundamental to the performance and efficiency of advanced embedded systems. Furthermore, the module's design supports easy scalability, allowing developers to adjust memory capacity as needed to align with specific project requirements. Its ability to offer consistent performance across various configurations makes it a standout option for system designers aiming for efficiency and speed in their memory hierarchy solutions.
The ABX Platform by Racyics utilizes Adaptive Body Biasing (ABB) technology to drive performance in ultra-low voltage scenarios. This platform is tailored for extensive applications requiring ultra-low power as well as high performance. The ABB generator, along with the standard cells and SRAM IP, form the core of the ABX Platform, providing efficient compensation for process variations, supply voltage fluctuations, and temperature changes.\n\nFor automotive applications, the ABX Platform delivers notable improvements in leakage power, achieving up to 76% reduction for automotive-grade applications with temperatures reaching 150°C. The platform's RBB feature substantially enhances leakage control, making it ideal for automotive uses. Beyond automotive, the ABX Platform's FBB functionality significantly boosts performance, offering up to 10.3 times the output at 0.5V operation compared to non-bias implementations.\n\nExtensively tested and silicon-proven, the ABX Platform ensures reliability and power efficiency with easy integration into standard design flows. The solution also provides tight cornering and ABB-aware implementations for improved Power-Performance-Area (PPA) metrics. As a turnkey solution, it is designed for seamless integration into existing systems and comes with a free evaluation kit for potential customers to explore its capabilities before committing.
Creonic offers a diverse array of miscellaneous FEC (Forward Error Correction) and DSP (Digital Signal Processing) IP cores, catering to various telecommunications and broadcast standards. This collection of IP cores includes highly specialized solutions like ultrafast BCH decoders and FFT/IFFT processors, which are critical for managing high-throughput data streams and maintaining signal fidelity. These IP cores embody the latest in processing technology, delivering precise error correction and signal transformation functions that are essential in complex communication networks. Their integration capabilities are made easy with detailed hardware specifications and software models, designed for flexibility across different platforms and applications. The rigorous development process guarantees that each core adheres to market standards, optimizing performance and ensuring operational reliability. Creonic's portfolio of miscellaneous FEC and DSP cores stands out for its innovative contributions to digital communications, providing unique solutions that meet the sophisticated requirements of modern connectivity.
The AndeShape Platforms include a range of systems designed for developing with AndesCore processors. These platforms are split into categories such as microcontroller platforms and FPGA development kits. They offer integrated solutions with pre-configured IP blocks to simplify the design process for complex systems. Through its assortment of hardware development tools, AndeShape platforms cater to various stages of product development from inception to demonstration, making it easier for engineers to create efficient, scalable solutions.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
The Multi-Channel AXI DMA Engine excels in bridging AXI Stream and AXI Memory mapped operations, managed by a potent DMA engine. Capable of processing data from 16 AXI Stream Slave inputs, it ensures efficient data writing and reading into DDR memories. AXI Stream Masters can extract information, enabling further DSP processing across multiple streams. The inclusion of programmable address generators allows non-linear data storage, simplifying the retrieval process for algorithmic units by categorizing data in easily manageable sections or Regions of Interest (ROI). This functionality greatly aids subsequent data sorting and processing activities. By facilitating compatibility with GStreamer and offering Linux driver support, this IP core is versatile for use in SoC-based environments that demand seamless data handling and processing. Its adaptability extends to non-SoC FPGAs requiring efficient DDR data buffering, making it indispensable for a wide array of data-intensive digital environments.
Cache MX is a revolutionary compression solution that effectively doubles the cache capacity, offering an impressive 80% reduction in area and power compared to comparable SRAM capacity. This technology facilitates substantial savings in space and energy for data centers, allowing for increased efficiency without compromising on performance. By intelligently compressing cache data, Cache MX optimizes the utilization of cache resources, leading to improved processing speeds and enhanced computational capabilities.
The I/O solutions provided by Analog Bits focus on delivering low-power, high-efficiency differential clocking and signaling capabilities. These IPs are designed for minimized transistor count while maintaining superior signaling quality, making them optimal for die-to-die communication. Customization is a key benefit, allowing for client-specific architectural arrangements that suit their exact needs while utilizing the smallest possible area and power budget.
PermSRAM is a highly versatile nonvolatile memory macro that operates on foundry standard CMOS platforms, covering process nodes from 180nm to 22nm and beyond. This memory solution offers a variety of configurations, including one-time programmable ROM and pseudo multi-time PROM with a multi-page format. It features a significant range of memory sizes from 64 bits to 512 Kbits and includes a non-rewritable hardware safety lock, enhancing security for critical data storage. PermSRAM is designed to be a secure and reliable solution with a proven record of stable yields. The technology is ideal for applications such as security code storage, program storage, and analog trimming. Its configuration allows for tamper-resistant storage using an invisible charge-trap mechanism, ensuring data security. Unlike traditional memory solutions, PermSRAM eliminates the need for a charge pump during read operations, reducing complexity and enhancing reliability. The built-in self-test circuits simplify the testing process, supporting ease of use across different applications. PermSRAM is also distinguished by its compact silicon area requirements, significantly smaller compared to conventional e-Fuse solutions. The memory's small footprint and high level of security make it an attractive option for applications that require efficient yet secure memory functionality, including automotive-grade environments where data retention is crucial.
Silvaco's standard cell libraries provide a comprehensive array of highly optimized cells, each tailored for better power efficiency, area, and yield. They may also be augmented with Power Management Kits and Engineering Change Order Kits, allowing flexibility in power reduction and late-stage design alterations. These libraries are available for various process nodes, enabling the design of high-performance SoCs with increased flexibility in power management and performance.
LEE Flash G2 is an innovative Flash technology that extends beyond traditional Flash memory capabilities, designed for large-capacity applications requiring seamless integration with standard CMOS logic circuits. This solution offers direct and low-cost connection to existing volatile logic circuits without needing high voltage for read operations. By utilizing unique VDD operation technology, the G2 enables chip designers to create non-volatile functions directly in standard logic circuits like SRAM, opening new potential for creative and efficient memory applications. This ease of integration is facilitated by the solution’s elimination of additional high voltage areas and minimal mask requirements, thus significantly lowering the costs and time associated with chip development. G2's robust temperature endurance and long retention life meet stringent automotive criteria, enhancing its reliability and adoption in demanding applications. It stands out for its low power program/erase cycles that make it a cost-effective answer for power-sensitive use cases.
Secure OTP is an advanced storage solution utilizing anti-fuse one-time programmable (OTP) memory to protect sensitive data in integrated circuits. With enhanced capabilities over standard OTP systems, Secure OTP offers a unique physical macro and digital RTL design that ensures maximum security for stored data, be it in use, transit, or rest. It features a 1024-bit PUF for improved encryption and supports multiple interfaces for seamless integration across a broad range of applications. The solution mitigates security vulnerabilities in modern chip designs, providing robust protection against data theft and unauthorized access to critical information such as encryption keys and boot codes. This technology is aimed at applications requiring secure data storage, including IoT devices and smart electronics.
Silvaco offers innovative embedded memory compilers equipped to handle the demands of high-performance computing and AI applications. These memory solutions feature advanced architecture for optimized scalability, power efficiency, and enhanced data locality. Designed to support low-power designs, these compilers offer diverse architectures to maintain robust performance while ensuring a balance in power consumption and area efficiency.
Dolphin Technology provides an extensive range of standard cell libraries that are critical for any SoC design project. These libraries include over 5,000 fully customizable cells, each precisely crafted to optimize speed, power, density, and routability. The standard cells are verified in silicon and designed for use across various process technologies, making them an ideal choice for a wide range of applications. The standard cell libraries support various process nodes such as 6-track, 7-track, and up to 14-track configurations, suitable for everything from high-performance to ultra-high density applications. Dolphin Technology’s standard cell IP offerings include Multi-VT (SVT, HVT, LVT) and multi-channel options, enabling flexibility in design to accommodate the specific needs of semiconductor projects. These cell libraries are tailored to support high-performance computing, provide efficiency in wafer yield, and ensure optimal SoC pricing. This high degree of customization, coupled with a focus on power and density, offers excellent options for semiconductor professionals aiming to create high-performance designs efficiently and cost-effectively.
The xSPI MRAM products by Everspin are tailored for the industrial and embedded systems market, providing a high-speed, expanded SPI interface adhering to the JEDEC standards. Utilizing the advanced STT-MRAM technology, these products operate using a 1.8V power supply, achieving read and write speeds up to 400MBps. The xSPI product line replaces legacy memory types like SRAM and NVSRAM, empowering applications in industrial automation, automotive, and IoT ecosystems with efficient, reliable memory solutions.
Certus Semiconductor's Digital I/O solutions are designed to meet various GPIO/ODIO standards, such as I2C, SPI, and eMMC. Their product portfolio features libraries with unique characteristics like voltage protection, extreme electrostatic discharge resilience, and low capacitance. Certus offers versatile voltage support ranging from 1.2V up to 5V, with a capacity to switch dynamically, ensuring broad applicability across different nodes and foundries. Each solution is crafted to provide optimal fit and performance, tailored to meet the unique demands of individual projects.
Spin-transfer Torque MRAM (STT-MRAM) is a highly advanced memory technology offering remarkable scalability, energy efficiency, and data retention. Using the principle of spin-transfer torque, it provides significant energy reductions during memory cell switching, supporting high-density designs essential for data centers and industrial applications. The technology is engineered for extensive durability, providing persistent memory solutions without the need for supercapacitors or batteries for energy backup, and delivering high bandwidth and low latency through a DDR4-like interface.
Ziptilion BW is designed to deliver enhanced DDR bandwidth, achieving up to 25% more output at nominal frequency and power, thus enabling more performance-optimized and energy-efficient SoC designs. This product integrates seamlessly into existing systems, providing a noticeable boost in data throughput capabilities while minimizing power consumption. Its state-of-the-art design supports the advanced computational needs of modern data centers while significantly reducing operational energy costs.
A robust and versatile CPU architecture from Andes Technology, the A25 processor is built on a 32-bit, 5-stage pipeline that efficiently handles general computing tasks. This processor caters to a wide array of applications, including embedded, IoT, and low-power devices. Its design balances performance with power efficiency, making it suitable for systems where energy conservation is crucial. With support for multiple core configurations, the A25 enables parallel processing capabilities, enhancing its utility in complex computations.
The Cobra platform is designed specifically for the Xilinx Kintex-7, delivering robust performance for development and prototyping within digital systems. This platform facilitates the rapid integration and testing of Trilinear's extended IP offerings, particularly for advanced DisplayPort applications. It provides essential tools for developers looking to streamline their design process and reduce project timelines.
The Flash Protection Series extends PUFsecurity's hardware root of trust capabilities to safeguard flash memory and its embedded systems. This set of solutions enables protection for both embedded and external flash by incorporating PUF-based authentication and encryption across various storage types including NAND and NOR flash. It utilizes PUF technology to enhance the memory's security boundary, preventing unauthorized access and ensuring real-time data integrity. With specialized components like PUFef for embedded flash and PUFenc for external, the series allows seamless integration into larger system-on-chip designs while providing enhanced defenses against common security threats faced by flash-based storage.
LEE Flash ZT is designed as a zero-additional-mask MTP solution that is perfect for applications requiring automotive-grade robustness and efficiency. Distinguished by its ease of implementation, ZT is crafted specifically for sensor controllers, power circuits, and analog ICs that need reliable trimming and parameter storage. This Flash provides an economical approach to memory programming with its support for standard CMOS processes, which facilitates the reuse of existing designs without incurring additional manufacturing costs. The ZT model operates with minimal power, making it ideal for industries where power consumption is a critical aspect. ZT's engineering ensures excellent data retention over extended periods and under high-temperature stresses, fitting perfectly into the rigorous demands of automotive technology without requiring any additional masking. This combination of traits makes ZT an ideal solution for cost-conscious projects requiring durable NVM capabilities.
MRAM for Radiation-hard Markets offers a unique combination of non-volatile magnetic memory technology with radiation-hardening capabilities, ideal for space and other extreme environments. These MRAM solutions deliver unparalleled performance in terms of data integrity and durability, ensuring continuous operation even in high-radiation settings. Such reliability makes them indispensable for aerospace and critical mission applications where failure is not an option.
Avant Technology offers a broad range of JEDEC-compliant industrial embedded DRAM memory modules suitable for applications in gaming, point-of-sale systems, kiosks, medical equipment, and automation. These modules feature options including low voltage, high capacitance, and low power consumption, making them versatile for various demanding environments. Available in form factors like UDIMM, SODIMM, ECC DIMM, and Mini DIMM, these memory modules support DDR3, DDR4, and DDR5 interfaces, catering to industrial, commercial, and consumer markets with diverse temperature ranges.
I-fuse Replaser technology brings a new dimension to fuse-based memory solutions. Tailored to address complex data storage and retrieval needs, it offers heightened performance for high-density applications.\n\nThis IP is characterized by its remarkable capacity for adaptability, supporting seamless integration across multifunctional platforms that require superior data precision and reliability. Such an innovative solution is essential for industries demanding leading-edge memory solutions capable of withstanding intensive data tasks. \n\nThe versatility of this technology spans across industry applications demanding scalability and efficient data processing. By maintaining a continual ability to enhance memory systems, I-fuse Replaser represents the leading edge in cost-effective semiconductor advancements.
LEE Fuse ZA stands out as an Anti-Fuse Non-Volatile Memory suitable for trimming tasks that do not demand reprogramming. This solution is particularly valued for its application in memory redundancy without the necessity for additional manufacturing steps or mask alterations. ZA leverages a low-complexity manufacturing methodology needing only a basic metal layer setup, distinguishing itself by its suitability for advanced processes. With its versatile compatibility across various process nodes from 180nm to sub-10nm, it is a practical choice for diverse technological requirements. This memory type excels in high-temperature applications, making it particularly useful in automotive sectors where reliability and durability over extended operational periods are crucial. As a proven design, ZA caters to projects looking for cost-effective, robust, and easy-to-deploy NVM solutions.
Trifecta-SSD-RAID is a high-performance, single-slot M.2 NVMe SSD RAID module designed for PXIe and CPCIe platforms. Tailored for wideband, high-speed RF and microwave recording, playback, and data storage, this product excels in both capacity and speed. It supports storage capacities ranging from 8TB to 64TB per slot, and offers robust sequential read/write performance of up to 7 GB/sec. Its architecture enables the use of up to eight M.2 NVMe SSDs, leading to exceptional storage performance without common glitches. The module is ideal for applications requiring sustained high bandwidth streaming, such as multi-channel RF signal recording. Compatible with both Windows and select Linux distributions, the Trifecta-SSD-RAID ensures high compatibility across a variety of operating systems and complies with industry standards including RoHS and FCC Class A. This product sets a new standard for storage solutions with its long lifecycle and value-based pricing, typically offering per-terabyte costs significantly lower than competitors.
NRAM Technology from Nantero is a cutting-edge non-volatile random access memory that stands out due to its use of carbon nanotubes (CNTs). These memory solutions promise significant advantages in terms of speed and durability compared to traditional memory technologies. NRAM is heralded for its potential to surpass DRAM and Flash memory by delivering faster read and write operations while being more power-efficient, especially in non-operational states where it consumes almost negligible power. This technology is built around CNT fabric, which consists of ultra-thin carbon cylinders known for their strength and conductive properties. This unique material allows NRAM to operate at speeds comparable to DRAM but with the non-volatility of Flash memory. The robust nature of carbon nanotubes also ensures high endurance, enabling the memory to handle vast numbers of cycles without degradation. NRAM can be manufactured using standard CMOS fabrication processes, negating the need for specialized equipment. This cost-effective production model allows it to integrate seamlessly into existing manufacturing systems. With scalability to sub-5nm processes and compatibility with 3D structures, this memory solution is positioned as a revolutionary leap poised to enable a wide range of electronic products across multiple industries.
The Serial Peripheral Interface (SPI) MRAM is designed for systems that require fast data retrieval and minimal pin usage. With quad SPI capabilities, it achieves read and write speeds of up to 52MBps, surpassing traditional 8-bit parallel MRAM. Packaged in a compact 16-pin SOIC, this SPI MRAM is perfect for modern RAID controllers, server system logs, and storage buffers, providing high-speed data and program memory solutions.
Spectral MemoryIP comprises a suite of silicon-proven, high-density, and low-power SRAM libraries designed for efficient storage solutions. The library features six main architectures including Single Port and Dual Port SRAMs, ROM, and various register files. These are suited for applications requiring rapid access and minimal energy consumption. Spectral's MemoryIP is implemented with foundry-specific or custom-designed bit cells to uphold robust performance. This technology is tailored to standard CMOS processes and offers a broad array of customization options. Developers can utilize the MemoryDevelopmentPlatform to modify and retarget the designs for other technologies, thereby extending its capabilities in embedded solutions. It is widely applicable, offering configurations with data widths ranging from 4 to 144 bits across different aspect ratios and memory depths. The robust architecture of Spectral MemoryIP ensures high-speed operations and low dynamic power consumption, making it ideal for diverse applications ranging from boot code storage to nonvolatile memory needs. Additionally, users can benefit from various low-power modes and advanced features like BIST and ECC, supporting seamless integration into complex systems.
The Trifecta-SSD-RM offers a flexible, high-performance data storage solution for PXIe and 3U CPCIe environments. It features removable M.2 NVMe SSD cartridges supporting capacities from 1TB to 8TB. This single-slot module boasts read/write speeds up to 3.5 GB/sec, significantly enhancing data throughput compared to traditional Embedded Controller SSDs. Beyond speed, the Trifecta-SSD-RM supports software-based RAID configurations, allowing users to customize capacity and performance as needed. This flexibility makes it an excellent fit for data-intensive applications requiring swift data backup and security level modifications, all while offering an affordable price point. The product's rapid interchangeability of data cartridges simplifies upgrades and replacements, effectively addressing evolving data acquisition needs. With its robust design and manufacturing in the USA, Trifecta-SSD-RM maintains a long lifecycle, making it a reliable choice for advanced data storage solutions.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
NVMe Expansion allows for the extension of NVMe storage capacities by two to four times, utilizing hardware-accelerated compression methods such as LZ4 or zstd. This innovative approach to storage management enables substantial enhancements in data retention abilities, making it an ideal solution for data-hungry applications needing extensive storage capabilities. NVMe Expansion ensures that data centers can meet growing demands for storage without expanding their physical infrastructure, maintaining efficiency and scalability.
Resistive RAM (ReRAM) technology offers a revolutionary approach to memory storage, characterized by its ability to scale below 10nm and stack in 3D configurations. This simple structure not only enhances energy efficiency, consuming just a fraction of the power compared to traditional memory technologies, but also significantly boosts endurance and read/write performance. ReRAM technology is particularly well-suited for Internet of Things (IoT) applications, data centers, mobile computing, and secure computing, due to its low latency and high-density storage capabilities. Crossbar’s ReRAM technology is uniquely positioned as a formidable alternative to conventional flash memory, boasting faster operations and better integration with CMOS processes. This technology can support various memory architectures, including multiple-time programmable (MTP), few-time programmable (FTP), and one-time programmable (OTP) configurations, making it versatile for both non-volatile memory and security applications. The inclusion of secure keys aids in protecting data integrity and enhancing device security, which is crucial in the rapidly growing field of connected devices. Furthermore, ReRAM technology by Crossbar is engineered to withstand a wide range of environmental conditions, making it reliable and durable. Its compatibility with monolithic integration processes allows for its seamless addition to CMOS logic wafers, providing an efficient means of incorporating high-density memory solutions into existing semiconductor infrastructures. This makes it a pivotal component for companies seeking to advance their memory technology beyond the current limitations of flash, thereby unlocking new potential in data-intensive applications.
The SMVsubscriber: IEC 61850 SMV Frame Processing module is engineered to facilitate the processing of Sampled Measured Values (SMVs) within IEC 61850 compliant networks. Critical in substation automation environments, this module ensures real-time data handling and processing for precise monitoring and control. Adhering to the IEC 61850 standards, the SMVsubscriber efficiently manages electricity distribution data, which is vital to maintaining grid stability and performance. It offers real-time frame processing capabilities, ensuring robust and accurate data handling within automated systems. The integration of the SMVsubscriber into power networks ensures improved response times and reliability, which are essential for maintaining continuous operation and efficient power management. By implementing this solution, network operators can ensure that all components of the grid are correctly synchronized and monitored in real time.
Trion FPGAs by Efinix are optimized for the fast-paced demands of the edge computing and IoT sectors. Built on a 40 nm process, these FPGAs provide a blend of power-performance-area efficiency suitable for a wide array of innovative applications including mobile, consumer electronics, industrial systems, and more. With logic densities ranging from 4K to 120K logic elements, Trion FPGAs are versatile enough to cater to both standard and burgeoning tech markets. The Trion lineup features a robust set of integrated interfaces including GPIO, PLLs, oscillators, DDR, MIPI, and LVDS, making them adaptable to varied application needs. These attributes, combined with their commitment to low power consumption, render them ideal for wearables, smart devices, and portable imaging systems where space and power efficiency are paramount. In terms of development flexibility, Trion FPGAs are available in a variety of package options, including tiny WLCSP packages designed for compact, integrated applications. With embedded DDR controllers and support for RISC-V processors, these FPGAs provide scalable solutions for building complete systems encompassing video processing, consumer applications, and advanced IoT deployments.
The URS500 Solvent Recycler is a top-tier system designed to handle the recycling of solvents efficiently and effectively in various industries such as automotive, coating, and manufacturing. It operates on a 120-volt power supply and utilizes sophisticated vaporization and condensation processes to ensure that used solvents are clean and ready for reuse. The system's solid-state microprocessor offers precise workflow control, equipped with an automatic shut-off, and features a high-efficiency air-cooled copper condenser. Its robust design, crafted from 304-grade stainless steel, guarantees durability and safety compliance, meeting CE standards. Capable of processing 5 gallons (20 liters) of solvent per batch, the URS500 model is lauded for its ability to drastically reduce both the purchase of new solvents and associated disposal costs. This model, therefore, not only cuts operational costs but also contributes significantly to environmental sustainability. The sturdy construction minimizes maintenance needs while maximizing reliability, making it an essential fixture in professional settings aiming to improve solvent usage efficiency. The URS500 offers a seamless user experience with features like temperature settings that can be manually adjusted, allowing businesses to tailor the recycling process to suit specific solvent requirements. Its thoughtful engineering ensures that solvent waste is minimized and non-hazardous, allowing industries to maintain high-quality operational standards while pursuing more eco-conscious practices, ultimately reducing their environmental footprint.
The Vega eFPGA from Rapid Silicon represents an innovative leap in providing customizable FPGA capabilities to System-on-Chip (SoC) designs. This eFPGA is designed to deliver flexibility and efficiency, allowing a seamless integration that enhances performance without raising costs. By embedding programmability directly into SoCs, Vega eFPGA facilitates diverse and adaptable computing needs. Structured with three configurable tile types – CLB, BRAM, and DSP – the Vega eFPGA is engineered for optimal performance. The CLB comprises eight 6-input lookup tables (LUTs), each offering dual independent outputs. It includes features like fast adders with carry chains and programmable registers, ensuring computational versatility. The BRAM component supports 36Kb dual-port memory, adaptable as 18Kb split memory configurations. The DSP tile incorporates an 18×20 multiplier with a 64-bit accumulator, supporting complex mathematical processing. Rapid Silicon's Vega eFPGA is optimized for scalability, providing flexibility in tile configurations to meet varied application requirements. It ensures ample compatibility with existing systems through seamless SoC integration, proprietary Raptor EDA tools, and robust IP libraries. These capabilities enable Vega to offer bespoke solutions tailored to specific end-user needs.
xT CDx is a sophisticated next-generation sequencing platform designed to profile solid tumors through both DNA and RNA analysis. A key feature of this device is its capacity to pinpoint single nucleotide variants, multiple nucleotide variants, and insertion-deletion alterations across 648 genes, thereby offering comprehensive genomic insights. Furthermore, this tool examines microsatellite instability (MSI) using DNA samples taken from formalin-fixed, paraffin-embedded tumor tissues, alongside matched normal blood or saliva specimens. The platform also functions as a companion diagnostic (CDx) for identifying patients who may benefit from various targeted cancer therapies. Integrated with Tempus's robust sequencing capabilities, xT CDx provides healthcare professionals with critical mutation profiles that adhere to oncology professional guidelines, facilitating more precise treatment pathways. By leveraging comprehensive genomic data, xT CDx plays a vital role in enhancing personalized cancer care.
Dedicated to improving one-time programmable memory devices, OTP IP provides extensive configurations that cater to a variety of electronic needs. Central to the function of this IP is its capability to offer robust security measures alongside high-density storage, ensuring data integrity during every use.\n\nBuilt with the latest advancements in process technology, OTP IP supports critical applications such as device calibration and secure boot processes, proving essential for systems where data protection is paramount.\n\nOTP IP's adaptability across multiple platforms makes it a versatile choice for emerging semiconductor needs. Its sophistication allows for integration in complex systems that require stringent reliability and performance benchmarks, demonstrating its worth across multifarious applications.
Crossbar's ReRAM IP Cores for High-Density Data Storage are engineered to meet the demanding needs of modern data-centric applications, providing high-density, non-volatile memory solutions suitable for environments like data centers and server infrastructures. These cores allow for rapid access to large datasets, thanks to their low latency and superior read/write speeds, making them an optimal choice for read-intensive scenarios. The technology enables the storage of significant volumes of data within small physical footprints, utilizing ReRAM's ability to be stacked in 3D configurations. This results in memory solutions that offer not just increased density but also enhanced energy efficiency, which is crucial in reducing the total cost of ownership in large-scale data operations. By offering customizable memory sizes, users can tailor the storage solutions to fit specific applications, ranging from consumer electronics to enterprise-level data handling. Additionally, these high-density memory cores support secure applications through the incorporation of ReRAM-based PUF keys, providing a crucial layer of data protection against potential threats. Crossbar's ReRAM IP is available as hard macros for integration into SoC or FPGA devices, or as standalone memory chips, offering versatile deployment options. This adaptability ensures that organizations can boost their data storage capabilities while maintaining robust security measures, without sacrificing performance or efficiency.
Spectral CustomIP is a specialized collection of silicon-proven memory architectures crafted for a variety of integrated circuit applications. These architectures, which include Binary and Ternary CAMs and multi-ported memories, are engineered to deliver exceptional performance with low dynamic power requirements. CustomIP is ideal for cases requiring specialty memory solutions not readily available in the market. This set of IP utilizes Spectral's proprietary bit cells for consistent and reliable operation across various environments. It is adaptable for use with standard CMOS and embedded Flash processes, making it versatile for a wide range of technological demands from consumer devices to complex networking hardware. CustomIP's architecture is equipped with multiple advanced features such as multi-bank and multi-port options, making it suitable for graphics applications and fast hardware search requirements. In essence, Spectral's CustomIP caters to both companies creating distinctive IC products and those seeking control over their memory IP development.
Topaz FPGAs are crafted for applications that require high-performance and cost-effective solutions with a focus on low power usage. Designed for volume production, these FPGAs leverage a unique architecture that maximizes logic utilization, facilitating a broad spectrum of applications from industrial automation to consumer electronics. These FPGAs support a variety of standards such as PCIe Gen3, MIPI, and Ethernet, making them versatile for communications and data processing tasks. Their robust protocol support allows integration into systems requiring machine vision, robotics, and broadcasting capabilities. Topaz's flexible and efficient architecture also allows for seamless migration to Titanium FPGAs if enhanced performance is necessary. A notable feature of Topaz FPGAs is their commitment to longevity and reliability. Efinix ensures stable production support for Topaz FPGAs well into the future, promising long-term reliability in embedded systems that demand uninterrupted performance. This durability and adaptability make Topaz FPGAs an excellent choice for industries that revolve around innovative and evolving tech solutions.
TwinBit Gen-1 is NSCore's innovative embedded non-volatile memory solution specifically designed to work with logic-based systems across 180nm to 55nm process nodes. Renowned for its high endurance, this memory solution supports over 10,000 program cycles, making it both robust and reliable for a wide variety of applications. TwinBit Gen-1 is seamlessly integrated into CMOS logic processes, requiring no additional masks or processing steps, which facilitates easy adoption within existing semiconductor manufacturing workflows. The TwinBit Gen-1 range includes a flexibility of memory sizes from 64 to 512 Kbits, which makes it an ideal choice for functions such as analog trimming and the storage of security keys. Applications also extend to systems where ASIC/ASSP implementations require secure and efficient non-volatile storage. The solution's high density and compact area use ensure that it is well-suited for devices that prioritize space efficiency without compromising on performance. TwinBit Gen-1 offers automotive-grade quality under the AEC-Q100 standards, supporting low-voltage and low-power operations that align with modern energy efficiency requirements. A built-in test circuit aids in simplifying stress-free testing environments, enabling easy verification and validation in various industrial applications. The process compatibility further enhances TwinBit’s appeal, allowing for fast, cost-effective deployment in cutting-edge technology environments.
TwinBit Gen-2 from NSCore extends the capabilities of embedded non-volatile memory solutions to support advanced process nodes ranging from 40nm to 22nm and beyond. Like its predecessor, the TwinBit Gen-2 integrates seamlessly into CMOS logic processes without necessitating additional masks or modifications to existing workflows. This solution is designed with ultra-low-power operations in mind, reducing energy consumption significantly across its applications. The Gen-2 iteration utilizes the Pch Schottky Non-Volatile Memory Cell technology, which optimizes the programming and erasing processes through controlled carrier injection, making it both efficient and reliable. This approach to design ensures that the TwinBit Gen-2 can perform at high efficiency without increasing the complexity or cost of implementation. The technical advancements in this generation make it a suitable option for high-performance applications that demand substantial data security and energy efficiency. Ideal for a variety of uses, the TwinBit Gen-2 caters to needs such as security data storage, system configuration updates, and more sophisticated electronic control mechanisms. The advanced cell design and operation modes position the TwinBit Gen-2 as a leading choice for next-generation semiconductor solutions seeking to balance performance with efficiency and security.
TySOM Boards are a powerful solution in Aldec's line of embedded system prototyping tools, bringing the practicality of high-performance FPGA-based platforms to system design applications. These boards integrate a range of FPGAs like Xilinx’s Zynq UltraScale+, Zynq-7000, and Microchip's PolarFire SoC, catering to a broad spectrum of advanced computational needs. With industry standard interfaces such as FMC and BPX, these boards are not only versatile but also easily expandable with Aldec’s extensive daughter card selection. Thus, they stand out in facilitating the fast development of embedded applications spanning from automotive systems to AI, machine learning, and IoT. TySOM Boards provide a user-friendly platform that enables engineers to bridge the gap between conceptual design and physical implementation, fostering innovation in high-demand sectors like automotive advanced driver assistance systems (ADAS) and industrial automation. Their design supports a multitude of applications where performance and reliability are paramount, thus allowing designers unprecedented flexibility and capability in high-stakes development environments. As embedded system prototyping continues to grow in complexity, TySOM Boards offer a scalable path forward, meeting the challenges of next-generation technology design and deployment.