All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The Die-to-Die (D2D) Interconnect solution by SkyeChip is a comprehensive technology facilitating high-speed data transfer between dies. Compliant with the UCIe 2.0 specification, it provides high bandwidth and minimal power overhead making it ideal for chiplet-based architectures. This lightweight interconnect supports diverse protocols such as PCIe and CXL, allowing adaptability to numerous communication requirements. It is designed to support major packaging technologies, ensuring flexibility and robustness in post-package yields and supporting loopback tests for integrity assurance.
The Multi-Channel Flex DMA IP Core offers an adaptable solution for handling up to 16 streaming channels, each managed independently to prevent mutual obstruction. Users can customize the data rate for each channel to optimize interfacing simplicity while incorporating prioritized FIFO buffers to ensure crucial data streams maintain supremacy. Designed with streaming and co-processor applications in mind, this IP core reads data from any source, processes it, and disseminates it to designated targets. Additionally, the core includes mechanisms for monitoring CRC errors along PCI Express links, enabling the prompt identification and exclusion of assemblies with subpar signal integrity during production testing. This core is paramount in safety-critical applications, where signal integrity and real-time data management are vital, offering high reliability and responsiveness in demanding environments. Its blend of efficiency and precision makes it a favorite for being able to swiftly adapt to varied processing needs without compromising on performance quality.
The AXI Bridge for PCIe is a versatile Smartlogic solution featuring up to four AXI4 interfaces. This IP core seamlessly translates AXI read and write commands into PCIe Transaction Layer Packets, maintaining continuous parallel operations across all interfaces with zero interference. Unused interfaces can be deactivated to conserve logical resources, highlighting its efficiency-oriented design. The inclusion of a high-performance kernel mode driver enhances its operability on Windows and Linux systems, paving the way for easy software integration. This characteristic allows users to transfer payloads without delving into the complexities of PCIe packet formation. Ideal for various applications, especially in networking, this component provides dependable solutions where high throughput and low-latency data interactions are essential. It stands out for its ability to support dynamic Ethernet applications, ensuring that network environments function optimally at all times.
The Multi-Channel AXI DMA Engine excels in bridging AXI Stream and AXI Memory mapped operations, managed by a potent DMA engine. Capable of processing data from 16 AXI Stream Slave inputs, it ensures efficient data writing and reading into DDR memories. AXI Stream Masters can extract information, enabling further DSP processing across multiple streams. The inclusion of programmable address generators allows non-linear data storage, simplifying the retrieval process for algorithmic units by categorizing data in easily manageable sections or Regions of Interest (ROI). This functionality greatly aids subsequent data sorting and processing activities. By facilitating compatibility with GStreamer and offering Linux driver support, this IP core is versatile for use in SoC-based environments that demand seamless data handling and processing. Its adaptability extends to non-SoC FPGAs requiring efficient DDR data buffering, making it indispensable for a wide array of data-intensive digital environments.
The AXI Bridge with DMA for PCIe from Smartlogic is engineered for high-performance data transfer applications, providing an array of industry-standard AXI interfaces. Designed to handle complex data streaming from FPGA to Host or vice versa, this IP core supports concurrent operations across all interfaces without interference. Its smart design allows for easy access to remote memory locations for shared and peer-to-peer memory applications. This product is notable for its ability to manage continuous data flow effectively, making it ideal for developers crafting sophisticated PCIe endpoints without deep protocol expertise. The inclusion of a kernel mode driver for Windows and Linux ensures smooth software integration, simplifying the deployment in diverse operating systems. Such integration allows developers to focus on transmitting raw data rather than crafting compliant PCIe packets, reducing complexity and development time. The core is especially valuable in network applications, where seamless Ethernet compatibility is crucial. Its robustness makes it well-suited for applications needing reliable data exchange and control over extensive data transactions, particularly in environments demanding high processing throughput and modular expansion capabilities.
The High-Channel-Count DMA IP Core is specialized for memory-intensive applications demanding high throughput, accommodating up to 64 data streams. It efficiently allocates streams within distinct host memory regions via DMA while facilitating user logic interfacing through up to 8 AXI4 (Full/Lite) masters. In addition to supporting data reading with up to 16 AXI Stream masters, this core simplifies the development of complex PCIe endpoints by enabling users to focus solely on data payloads, eliminating the need for intricate PCIe packet management. This capability makes it ideal for data-intensive operations such as streaming, Ethernet applications, and high-level computations. The IP core is equipped for Ethernet compatibility and comes with a detailed schematic to assist in implementation, ensuring that network congestion or interruptions have minimal impact on its performance. It is designed to support high-performance data handling and fast processing for real-time applications.
The BlueLynx Chiplet Interconnect is an adaptive interconnect solution, offering both physical (PHY) and link layer interfaces that support industry standards such as Universal Chiplet Interconnect Express (UCIe) and Open Compute Project Bunch of Wires (BoW). This IP is engineered for seamless integration with network-on-chip systems, leveraging various established standards like AMBA CHI, AXI, and ACE to provide efficient die-to-die subsystem solutions. The advanced customizable architecture of BlueLynx ensures that users can tailor the IP to specific bandwidth and physical requirements, optimizing power-performance-area (PPA) metrics across applications. With compatibility spanning nodes from 16nm, 12nm, 7nm, to as advanced as 3nm and multi-foundry support, this IP is highly adaptable to various packaging needs, whether low-cost or advanced. Incorporating high data rates from 2 Gb/s to above 24 Gb/s, the BlueLynx boasts very low power consumption and latency, achieved through < 0.375 pJ/bit energy efficiency and < 2 ns latency. It includes innovative features like staggered bump pitch options, integrated DLL with duty-cycle correction, and built-in self-test mechanisms, making it a robust choice for high-performance computing, AI, and mobile applications.
The Universal Chiplet Interconnect Express, or UCIe, represents a breakthrough in facilitating communication among chiplets in advanced computing systems. This product aligns with the latest trends in semiconductor manufacturing, focusing on creating a robust interconnect standard that assures compatibility and interoperability between diverse chiplets, revolutionizing modular design methodologies. UCIe's primary strength lies in its architecture, designed to seamlessly integrate into various system configurations. It significantly reduces power consumption while maintaining high throughput, crucial for applications demanding rapid data exchange without sacrificing efficiency. This makes UCIe particularly appealing for industries prioritizing sustainability alongside performance. Engineered for flexibility, UCIe supports tech nodes within the 12nm to 28nm range, thus accommodating cutting-edge semiconductor platforms. By fostering universal chip integration, UCIe sets the stage for enhanced scalability, facilitating developers to explore new horizons in data processing and integration. It's a pivotal tool for engineering teams looking to future-proof their systems with scalable, high-performance chiplet-based architectures.
Genesis is a fully integrated solution aimed at streamlining package and PCB design workflows. With its comprehensive design suite, Genesis enables engineers to create sophisticated electronic packages, ensuring alignment with industry standards for performance and reliability. By leveraging the capabilities of Genesis, design teams can efficiently manage complex projects from conception to final layout. The tool's advanced features allow for seamless integration of various design elements, promoting a cohesive design environment that supports multi-layer designs and intricate interconnection schemes. Genesis's robust design capabilities help cut down on development times while maintaining high standards of accuracy and detail, crucial for performance-critical packages. As an essential tool in a modern designer's toolkit, Genesis stands out for its ability to manage the intricacies of PCB layouts alongside advanced packaging structures, making it invaluable for engineers tasked with delivering top-tier electronic solutions across a range of industries.
The SerDes product from KNiulink Semiconductor is designed with state-of-the-art architecture and technology, optimized for low energy consumption and exceptional performance applications. It features a high degree of configurability, allowing seamless integration with user logic or SOCs. This versatile IP supports a variety of protocols including PCIE, RapidIO, SATA, SAS, JESD204, USB3.1, LVDS, and MIPI, making it a crucial component for high-speed data transfer solutions.
The Universal Chiplet Interconnect Express (UCIe) represents a leap in interfacing efficiency for chiplets within system designs. Emphasizing modular integration, UCIe supports diverse configurations, promoting both single and multi-module chiplet communications across different application frameworks. Building on established protocols like PCIe 6.0 and CXL 3.0, UCIe's architecture facilitates streamlined support, leveraging flit models for data transfer across the Universal Physical layer. This ensures scalability and high-speed operations necessary for modern, high-performance computing applications. UCIe’s capability in managing power states and supporting multiple stacks permits adaptable performance tuning, meeting the specific needs of complex, data-heavy environments. It tackles contemporary challenges in chiplet design by enhancing interoperability and operational efficiency. Incorporating UCIe into SoCs enhances system flexibility, enabling efficient, high-throughput processing, essential for AI, ML, and computing-intensive applications, thus forging a path toward next-generation semiconductor innovation.
The VITA 17.3 Serial FPDP Gen3 Solution represents an advanced iteration of the Serial FPDP protocols, designed to deliver even faster data transfer rates while supporting more extensive feature sets. This solution addresses the need for higher bandwidth in data-intensive operations and is integral to modern communication infrastructures. It supports a maximum throughput that significantly enhances performance benchmarks, essential for real-time data applications. The IP is particularly beneficial in environments where large volumes of data must be moved swiftly and efficiently, such as in signal intelligence and large-scale data acquisition systems. Moreover, the VITA 17.3 Gen3 protocol offers enhanced error-checking capabilities ensuring data integrity even in challenging operating conditions. Its modular design aids in seamless integration and deployment across different platforms, making it a preferred choice for system architects aiming to leverage cutting-edge communication technologies.
Photowave provides cutting-edge optical communications solutions specifically designed to cater to PCIe and Compute Express Link (CXL) connectivity needs. This innovative communications hardware capitalizes on the inherent latency and energy efficiency advantages of photonics, facilitating scalable data center resource management across server racks. This optical interconnect solution introduces a new paradigm in composable data center architectures. With support for the latest PCIe Generation 5.0 standards, Photowave achieves remarkable data transfer rates while keeping power consumption and latency within operationally efficient thresholds. The specialized optical hardware is versatile, supporting active optical cables with bifurcation capabilities for single, dual, and quad-channel configurations. It’s ideally suited for enhancing memory expansion, significantly boosting workload performance for AI models through its integration with advanced servers and memory modules.
XPLM is an innovative solution for managing simulation processes and data in the ever-evolving field of electronic design. This tool provides a centralized platform for storing, organizing, and accessing large volumes of data, ensuring that design teams can operate efficiently and effectively. By integrating data management into the design process, XPLM reduces the complexity associated with handling vast amounts of information, thereby streamlining workflows and enhancing productivity. It supports engineers in maintaining version control and collaboration across different projects, helping manage resources and timelines more effectively. XPLM's comprehensive data handling capabilities make it indispensable for organizations committed to maintaining a competitive edge in the semiconductor industry. By simplifying the intricacies of data management, XPLM helps transform simulation insights into actionable strategies, driving design innovation and operational excellence.
Glasswing is a state-of-the-art ultra-short reach SerDes, designed to take advantage of the innovative CNRZ-5 Chord™ Signaling. By offering more data transmission with lower power and fewer pins, Glasswing optimizes chip-to-chip communication, making it ideal for advanced computational tasks like deep learning. Its configuration versatility supports bespoke chiplet ecosystems, allowing high connectivity and performance. By handling up to 500 Gbits/s per pin with power efficiency, it presents a significant advantage over traditional methods like NRZ and PAM-4. The ease of integration and power savings make Glasswing a preferred choice for high-performance computing, AI, and networking applications. It's not only the premier solution for complex multichip modules (MCMs) due to its resilience against signal loss but also offers the flexibility required for cutting-edge system designs. Built-in diagnostic features such as EyeScope enhance its reliability, enabling real-time signal analysis critical for maintaining connectivity integrity. Glasswing's potential application is vast, spanning hyperscale data centers to satellite communications. Its remarkable bandwidth capability allows seamless data transfer, supporting extensive network and computing infrastructure needs. The absence of a silicon interposer further reduces cost, making it an economically viable solution for industries aiming at scaling up their operations without compromising on performance.
The MIPI C-PHY Interface offers a physical channel for the Camera Serial Interface 2 (CSI-2), providing a bandwidth of 5.7 Gbps per lane. By optimizing throughput over channels limited by bandwidth, this technology facilitates increased data transmission without demanding a higher signaling clock rate, making it highly efficient for next-gen applications.
Compute Express Link (CXL) is an innovative high-speed interconnect standard, facilitating seamless communication among CPUs, GPUs, and memory, vital for modern data centers and AI applications. Designed to reduce latency while improving data processing efficiency, CXL integrates multiple protocols like CXL.io, CXL.cache, and CXL.memory, ensuring data coherency between high-performance processors and accelerators. CXL is built atop the PCIe physical layer, maintaining compatibility and leveraging advanced signaling techniques. This adaptability allows for higher bandwidth and lower latency, crucial for the high-demand workflows in AI and Machine Learning. The CXL standard permits direct memory access across devices, fostering efficient sharing and expanding the potential for scalable computing infrastructures. It supports both conventional data processing and emerging applications that demand intensive parallel computing. By revolutionizing data center architectures, CXL paves the way for cutting-edge, high-speed data processing capabilities, optimizing performance for complex computing environments and next-gen applications.
The CXL 3.0 IP by Rapid Silicon is a cutting-edge controller designed to optimize advanced hardware configurations with superior speed and efficiency. This IP supports the latest Compute Express Link (CXL) 3.0 specification, ensuring seamless integration with contemporary FPGA designs. The standout feature of this controller is its backward compatibility, supporting previous iterations such as CXL 1.1, 2.0, and related PCIe standards from 1.1 up to the recent 6.0. The CXL 3.0 IP provides a highly configurable architecture that can be tailored to various design needs. Users can adjust parameters such as the number of lanes and datapath width to suit specific project requirements, enhancing performance on both speed and scale. Furthermore, the controller integrates features like lane bonding and multicast, alongside error correction capabilities, thereby enhancing robustness and reliability. Adding to its flexibility, CXL 3.0 IP incorporates advanced scalability, which ensures it can adapt to evolving technological landscapes. Its compatibility across multiple generations of CXL and PCIe standards ensures that it remains a future-proof component, enabling seamless upgrades and integration into next-gen systems.
The High-Speed SerDes technology offered recognizes the growing demand for efficient chiplet-based interconnects. This product is tailored for high-performance computing and communication systems, providing unmatched signal integrity and minimizing latency. Designed to operate at ultra-high speeds, this SerDes solution supports heterogeneous integration, enabling seamless communication between chiplets. Through its innovative digital-centric architecture, the High-Speed SerDes promises low power consumption, making it ideal for energy-conscious applications. It integrates cutting-edge signal processing techniques that enhance data transmission stability, even at extreme speeds. This focus ensures high performance and reliability, vital for mission-critical applications where flawless data exchange between components is non-negotiable. The technology is compatible with mainstream tech nodes ranging from 12nm to 28nm, offering a broad spectrum of versatility and scalability for customers. Its adoption in chiplet ecosystems supports the evolution towards modular, scalable multi-chip packages, laying the foundation for future-proof high-performance interconnect solutions.
The VITA 17.1 Serial FPDP Solution offers a high-speed digital communication protocol designed for demanding environments. This product provides robust and efficient data transfer capabilities, ideal for applications in aerospace and defense. Featuring a serial point-to-point link, it enables direct communication between systems, minimizing latency and maximizing data throughput. Engineers favor this solution for its scalability and compatibility with existing and emerging technologies, ensuring a secure investment in future-proofing their systems. The VITA 17.1 standard's interoperability with various platforms highlights its versatility, making it suitable for a broad array of mission-critical applications. With support for different data transfer speeds and modes, this solution can be tailored to fit specific requirements, guaranteeing optimal performance under varying operational conditions.
Eliyan’s NuLink Die-to-Die (D2D) PHY technology is designed to revolutionize the interconnection of chiplets using industry-standard packaging techniques. This technology offers low power consumption while maintaining high-performance metrics, seamlessly integrating into both standard and advanced packaging options. Eliyan's D2D IP allows for significant flexibility in application design and reduces the dependency on complex silicon interposer technologies. By using standard organic/laminate packages, the NuLink technology enhances system-level design optimizations, cost savings, and thermal performance. Support for numerous industry standards, including UCIe and BoW, ensures a versatile application in a wide array of semiconductor designs. The tailored PHY IP cores facilitate the incorporation of high-bandwidth interconnected systems within ASICs without the necessity of proprietary packaging methods. With up to 64 data lanes and bump map layouts adaptable to specific protocols, the NuLink D2D PHY exemplifies adaptable technology suitable for various semiconductor applications. This unique approach allows for greater design flexibility, mixing and matching chiplets with different dimensions, which is particularly beneficial in applications involving high bandwidth and low latency requirements. The ability of the NuLink D2D technology to deliver interposer-like bandwidth and power without high-cost advanced packaging makes it a remarkable solution in cutting-edge chip design.
The Interconnect Generator from Dyumnin offers a versatile, protocol-agnostic interconnect solution that supports both AXI and OCP master/slaves. It produces interconnect structures in various forms, including simple, pipelined, and crossbar configurations. This flexibility allows the interconnect to adapt to atomic request-response behaviors to more intricate split transactions with independent address and data phases.\n\nThe built-in reorder buffer, featuring customizable depth, ensures efficient data delivery handling multiple outstanding requests and maintaining order. This robust design is vital for system architects looking to build high-performance systems that require reliable interconnect solutions with minimal latency and high data throughput.\n\nThrough its adaptable nature, the Interconnect Generator is well-suited for a variety of applications across different industries, offering a high degree of customization to meet specific design challenges and performance requirements.
The JESD204B Multi-Channel PHY is a sophisticated high-speed interface that supports data rates up to 12.5Gbps. Designed for compatibility with the JESD204B standard, it incorporates specialized features such as deterministic latency, SYSREF support, and 8b/10b encoding/decoding. Its architecture provides for independent transmitter and receiver configuration, making it versatile for various designs. This PHY core is well-suited for applications that demand efficient data packet handling and robust data integrity. It supports numerous packaging and channel configurations, allowing designers to customize based on specific application needs. The multi-channel capability enhances its utility in complex systems requiring simultaneous data processing across multiple lanes. In terms of process compatibility, the JESD204B PHY supports advanced semiconductor technologies, ensuring optimal performance across 65nm, 55nm, 40nm, and 28nm process nodes. This adaptability highlights its suitability for cutting-edge applications in communication and signal processing.
Eliyan's NuLink Die-to-Memory (D2M) PHY technology enables robust communication between logic dies and memory dies using standard packaging solutions. By offering high-speed data transfer rates and low latency operations, this technology is critical in overcoming traditional memory wall challenges in advanced computing systems. The technology supports seamless, high-efficiency interconnects creating a perfect synergy between computational and memory components within a single package. As opposed to conventional unidirectional solutions, the D2M technology from Eliyan provides a bidirectional data flow in a low-power, high-performance framework. This increases the throughput efficiency enabling intensive data-driven applications to optimize their processing cycles effectively. Additionally, the NuLink D2M PHY supports configurable bump map layouts, facilitating seamless integration into various industry-standard protocols and enhancing its adaptability for different design architectures. This solution is engineered for situations where separation between high-temperature processors and heat-sensitive memory components is crucial. It achieves interposer-like performance levels without the cost implications of advanced silicon interposer technologies, making it ideal for scalable high performance applications demanding extensive memory interaction.
Tachyum’s Prodigy FPGA-Based Emulator offers a sophisticated platform for developers and system architects aiming to evaluate and optimize performance metrics of upcoming products. This emulator stands as a crucial step within the development lifecycle, providing hardware emulation through a comprehensive system of interconnected FPGA and IO boards designed to replicate full processor capabilities. The design encompasses multiple FPGAs on a single board, each capable of emulating complete processor cores including vector and matrix operations. This setup is paramount for conducting accurate and reliable product evaluations, software debugging, and ensuring compatibility with anticipated operational environments. Customers and partners have the ability to leverage Tachyum’s FPGA-based emulation system for a wide range of scenarios, from performance testing to advanced software development. The emulator supports an extensive list of applications and configurations, allowing developers to closely mirror potential real-world use cases in a secure, controlled setting.
This core facilitates precise and fault-tolerant networking, essential for environments requiring consistent timing and reliability, such as automotive and industrial applications. It supports scalable network speeds from 1Gbps to 10Gbps and includes features like babbling protection and anti-masquerading functionalities. The AXI standard interface simplifies integration, ensuring this core remains user-friendly and versatile.
The FPGA Pre-Trade Risk Check provides an immediate analysis of trade conditions before they are executed, ensuring adherence to regulatory and financial constraints. This product utilizes the high-speed processing capabilities of FPGAs to swiftly assess trade parameters, offering banks and financial institutions a reliable method to mitigate operational risk. The risk check process is executed in real-time, thus reducing the potential for slippage and ensuring trade compliance.
The Speedster7t FPGA family is engineered for high-bandwidth applications, offering a significant boost over traditional FPGA designs. Built using TSMC's advanced 7nm FinFET technology, these FPGAs incorporate a revolutionary 2D Network-on-Chip (NoC) that dramatically reduces routing congestion compared to conventional architectures. This FPGA integrates an array of machine learning processors, high-speed GDDR6 interfaces, and supports 400G Ethernet as well as PCIe Gen5, designed to facilitate the most demanding AI/ML and data acceleration applications. What sets the Speedster7t apart is its innovative architecture, which provides over 80 access points within the FPGA fabric. This extensive connectivity ensures ASIC-level performance while maintaining the inherent flexibility of FPGAs. By harnessing the power of its 2D NoC, Speedster7t FPGAs deliver industrial-leading bandwidth, making them ideal for next-generation infrastructure, including 5G networks, computational storage, and AI-enhanced processing. In addition to its impressive technical specifications, Speedster7t FPGAs are optimized for applications requiring extensive data handling capabilities. These include computational-intensive environments such as test and measurement, high-frequency trading, and defense systems. Moreover, the inclusive Achronix toolset facilitates efficient design and programming, offering a substantial advantage for developers looking to push the boundaries of speed and performance.
The 56G SerDes Solution is engineered to support high-speed data communication needs, featuring both NRZ and PAM4 modulation techniques to achieve rates up to 56Gbps per lane. It is compliant with varied communication protocols and incorporates advanced error correction and built-in self-test (BIST) capabilities. This solution is well-suited for optical and copper-based technologies, proving instrumental in applications requiring robust data integrity and signal optimization over large distances. Developed with advanced FinFET technology, it integrates seamlessly into high-performance computing platforms.
The Aurora 64B/66B core from ALSE delivers a highly efficient protocol for chip-to-chip and board-to-board communications, leveraging high-speed transceivers. This implementation is minimalistic yet robust, ensuring compatibility across various FPGA platforms, including Intel, Xilinx, Lattice, and Microchip. The protocol's architecture supports full duplex operations and includes features such as native flow control and additional CRC for data integrity. With its capability to handle up to 16 transceiver lanes per instance, the Aurora 64B/66B core provides substantial throughput with a bandwidth efficiency of up to 97%, addressing the demands for fast, reliable data interchange in modern electronic systems.
ALSE's Aurora 8B/10B IP Core offers a streamlined, high-speed protocol designed for efficient serial communication in complex electronic systems. Ideal for chip-to-chip configurations, this core supports both full duplex and simplex operations up to 6.6 Gbps per transceiver lane, making it suitable for a myriad of applications requiring rapid data transfer. This IP is notable for its minimal resource utilization and compatibility across various FPGA platforms such as Intel, Lattice, and Microchip. It also integrates native flow control, additional CRC for error checking, and efficient clock compensation, ensuring reliable data transmission in demanding electronic environments.
JESD204 is a vital serial interface IP aiming to streamline high-speed data conversion processes within electronic systems, facilitating reliable, high-frequency data transfers. Originating from a collaborative industrial standard, this IP handles the formidable demands of ADC/DAC projects by utilizing high-speed serial links and ensuring precise synchronization of samples across multiple channels. ALSE's implementation of JESD204 offers compatibility with a range of FPGA families and supports versions from JESD204B to the emerging JESD204C, focusing on reducing latency and enhancing signal fidelity. The IP's ability to transfer data utilizing minimal wiring while maintaining high precision is invaluable for sophisticated data acquisition and processing applications.