All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
SkyeChip's Die-to-Die (D2D) Interconnect is a lightweight solution crafted to deliver superior performance with minimal power and area overhead. Adaptable to any communication protocol, this interconnect extends the capabilities of both non-coherent and coherent NOC configurations across multiple dies. It significantly reduces wiring across dies, supporting transfer rates up to 6.4GT/s. This interconnect is compatible with major 2.5D and 3D IC packaging technologies, providing a robust solution for advanced chipset applications and ensuring optimal cross-die communication with minimal resource consumption.
The BlueLynx Chiplet Interconnect is designed for advanced and standard packaging applications, providing a versatile solution that supports high bandwidth requirements while adhering to industry standards. Its architecture simplifies the transition from System on Chips (SoCs) to chiplets by connecting effectively to various on-die Network-on-Chip (NoCs) standards. With the ability to customize bandwidth and process selections, BlueLynx IP is silicon-proven in several process nodes and foundries, ensuring both rapid silicon bring-up and first-pass success. The IP's design allows it to deliver low latency, high bandwidth, and energy efficiency, making it a cost-effective choice for modern semiconductor applications.
Mobiveil’s RapidIO-AXI Bridge is a versatile and configurable IP component designed to interface between RIO and AXI systems. This bridge facilitates integration with a RapidIO controller acting as either a host or a device, using high-speed multi-channel DMA and message controllers to meet the bandwidth requisites of RapidIO frameworks. This advanced bridge solution optimizes data throughput and system communication efficiency, catering to robust data handling requirements.