All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
KPIT excels at providing AUTOSAR solutions that streamline software integration and improve vehicle architecture. The company's focus on middleware development ensures efficient application deployment and integration within both classic and adaptive AUTOSAR frameworks. KPIT's solutions enable quick software updates, robust validation processes, and cost-effective production timelines, essential for the evolving landscape of Software-Defined Vehicles (SDVs).
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
The Die-to-Die (D2D) Interconnect solution by SkyeChip is a comprehensive technology facilitating high-speed data transfer between dies. Compliant with the UCIe 2.0 specification, it provides high bandwidth and minimal power overhead making it ideal for chiplet-based architectures. This lightweight interconnect supports diverse protocols such as PCIe and CXL, allowing adaptability to numerous communication requirements. It is designed to support major packaging technologies, ensuring flexibility and robustness in post-package yields and supporting loopback tests for integrity assurance.
The AXI Bridge for PCIe is a versatile Smartlogic solution featuring up to four AXI4 interfaces. This IP core seamlessly translates AXI read and write commands into PCIe Transaction Layer Packets, maintaining continuous parallel operations across all interfaces with zero interference. Unused interfaces can be deactivated to conserve logical resources, highlighting its efficiency-oriented design. The inclusion of a high-performance kernel mode driver enhances its operability on Windows and Linux systems, paving the way for easy software integration. This characteristic allows users to transfer payloads without delving into the complexities of PCIe packet formation. Ideal for various applications, especially in networking, this component provides dependable solutions where high throughput and low-latency data interactions are essential. It stands out for its ability to support dynamic Ethernet applications, ensuring that network environments function optimally at all times.
The Multi-Channel Flex DMA IP Core offers an adaptable solution for handling up to 16 streaming channels, each managed independently to prevent mutual obstruction. Users can customize the data rate for each channel to optimize interfacing simplicity while incorporating prioritized FIFO buffers to ensure crucial data streams maintain supremacy. Designed with streaming and co-processor applications in mind, this IP core reads data from any source, processes it, and disseminates it to designated targets. Additionally, the core includes mechanisms for monitoring CRC errors along PCI Express links, enabling the prompt identification and exclusion of assemblies with subpar signal integrity during production testing. This core is paramount in safety-critical applications, where signal integrity and real-time data management are vital, offering high reliability and responsiveness in demanding environments. Its blend of efficiency and precision makes it a favorite for being able to swiftly adapt to varied processing needs without compromising on performance quality.
The Multi-Channel AXI DMA Engine excels in bridging AXI Stream and AXI Memory mapped operations, managed by a potent DMA engine. Capable of processing data from 16 AXI Stream Slave inputs, it ensures efficient data writing and reading into DDR memories. AXI Stream Masters can extract information, enabling further DSP processing across multiple streams. The inclusion of programmable address generators allows non-linear data storage, simplifying the retrieval process for algorithmic units by categorizing data in easily manageable sections or Regions of Interest (ROI). This functionality greatly aids subsequent data sorting and processing activities. By facilitating compatibility with GStreamer and offering Linux driver support, this IP core is versatile for use in SoC-based environments that demand seamless data handling and processing. Its adaptability extends to non-SoC FPGAs requiring efficient DDR data buffering, making it indispensable for a wide array of data-intensive digital environments.
The UCIe from XtremeSilica delivers an integrated interconnect standard that bridges communication channels within diverse system components. This solution is pivotal for ecosystems that require high throughput and efficient data flow among multifunctional units. By facilitating an open and extensible interconnect, UCIe ensures streamlined data transfers and robust communication pathways, essential for enhancing performance in multi-chip environments. Its design supports consistent data operations and bandwidth allocation while reducing latency, contributing to optimized system functionality. UCIe’s adaptable framework fits various deployment scenarios, offering a future-proof architecture compatible with evolving data processing demands. This integration ease makes it an attractive choice for developers aiming to maintain coherence in complex electronic systems.
The AXI Bridge with DMA for PCIe from Smartlogic is engineered for high-performance data transfer applications, providing an array of industry-standard AXI interfaces. Designed to handle complex data streaming from FPGA to Host or vice versa, this IP core supports concurrent operations across all interfaces without interference. Its smart design allows for easy access to remote memory locations for shared and peer-to-peer memory applications. This product is notable for its ability to manage continuous data flow effectively, making it ideal for developers crafting sophisticated PCIe endpoints without deep protocol expertise. The inclusion of a kernel mode driver for Windows and Linux ensures smooth software integration, simplifying the deployment in diverse operating systems. Such integration allows developers to focus on transmitting raw data rather than crafting compliant PCIe packets, reducing complexity and development time. The core is especially valuable in network applications, where seamless Ethernet compatibility is crucial. Its robustness makes it well-suited for applications needing reliable data exchange and control over extensive data transactions, particularly in environments demanding high processing throughput and modular expansion capabilities.
The MIPI C-PHY Interface offers a physical channel for the Camera Serial Interface 2 (CSI-2), providing a bandwidth of 5.7 Gbps per lane. By optimizing throughput over channels limited by bandwidth, this technology facilitates increased data transmission without demanding a higher signaling clock rate, making it highly efficient for next-gen applications.
The High-Channel-Count DMA IP Core is specialized for memory-intensive applications demanding high throughput, accommodating up to 64 data streams. It efficiently allocates streams within distinct host memory regions via DMA while facilitating user logic interfacing through up to 8 AXI4 (Full/Lite) masters. In addition to supporting data reading with up to 16 AXI Stream masters, this core simplifies the development of complex PCIe endpoints by enabling users to focus solely on data payloads, eliminating the need for intricate PCIe packet management. This capability makes it ideal for data-intensive operations such as streaming, Ethernet applications, and high-level computations. The IP core is equipped for Ethernet compatibility and comes with a detailed schematic to assist in implementation, ensuring that network congestion or interruptions have minimal impact on its performance. It is designed to support high-performance data handling and fast processing for real-time applications.
Eliyan’s NuLink technology revolutionizes die-to-die connections in the semiconductor landscape by delivering robust performance and energy efficiency using industry-standard packaging. The NuLink PHY is designed to optimize serial high-speed die-to-die links, accommodating custom and standard interconnect schemes like UCIe and BoW. It achieves significant benchmarks in terms of power efficiency, bandwidth, and scalability, providing the same benefits typical of advanced packaging techniques but within a standard packaging framework. This versatility enables broader cost-effective solutions by circumventing the high cost and complexity often associated with silicon interposers. NuLink Die-to-Die PHY stands out for its integration flexibility, supporting both silicon and organic substrate environments while maintaining superior data throughput and minimal latency. This innovation is particularly beneficial for system architects aiming to maximize performance within chiplet-based architectures, allowing the strategic incorporation of elements such as high-bandwidth memory and silicon photonics. NuLink further advances system integration by enabling simultaneous bidirectional signaling (SBD), doubling the effective data bandwidth on the same interface line. This singular feature is pivotal for intensive processing applications like AI and machine learning, where robust and rapid data interchange is critical. Eliyan’s NuLink can be implemented in diverse application scenarios, showcasing its ability to manage large-scale, multi-die integrations without the customary bottlenecks of area and mechanical structure. By leading system designs away from vendor-specific, cost-prohibitive supply chains, Eliyan empowers designers with increased freedom and efficiency, further underpinning its groundbreaking role in die-to-die connectivity and beyond.
The BlueLynx Chiplet Interconnect represents a pivotal development in die-to-die communication, emphasizing versatility through support for both the Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project's Bunch of Wires (BoW) standards. This innovative solution is designed to integrate smoothly with on-die buses and Networks-on-Chip (NoCs), accommodating a variety of protocols such as AMBA, AXI, and ACE. This product is optimized for high-bandwidth applications, addressing the stringent power, performance, and area (PPA) requirements of modern chip designs. By utilizing a dual-mode PHY and offering extensive configurability in data rates and packaging options, the BlueLynx interconnect facilitates rapid, efficient system integration. Silicon-proven across numerous process nodes, including advanced nodes like 3nm and 4nm, BlueLynx is tailored to meet the diverse needs of the semiconductor market. Its customizable architecture ensures that each implementation maximizes bandwidth and minimizes power usage, supporting complex systems with ease.
The FPGA Pre-Trade Risk Check IP by Algo-Logic is engineered to perform lightning-fast, real-time risk analyses prior to trade execution. This solution is tailored for financial institutions that need to adhere to strict compliance mandates while executing trades at speeds that approach the limits of current technology. By integrating directly into trading systems, the IP enables pre-trade checks without compromising speed, offering a significant advantage in the fast-paced environment of financial trading. Designed for use with FPGA technology, this risk check system provides an infrastructure for reducing the lag associated with traditional software-based risk assessments. It allows firms to verify parameters and assess risks instantly as trades are enqueued, enhancing both the speed and accuracy of trade verifications. The Pre-Trade Risk Check system built on FPGAs benefits from low-latency processing and high-determinism, crucial for maintaining a competitive edge in the trading industry. By leveraging this IP, firms can better manage operational risks and maintain regulatory compliance more efficiently.
KNiulink offers a versatile SerDes solution designed for high-speed data transmission with applications across PCIe, Rapid IO, and SATA/SAS protocols. This solution is engineered with advanced architectures and technologies to meet the demands of low power consumption while maintaining high performance. It features configuration flexibility, enabling seamless integration with user logic or SOC for optimized system performance.
The VITA 17.3 Serial FPDP Gen3 Solution represents an advanced iteration of the Serial FPDP protocols, designed to deliver even faster data transfer rates while supporting more extensive feature sets. This solution addresses the need for higher bandwidth in data-intensive operations and is integral to modern communication infrastructures. It supports a maximum throughput that significantly enhances performance benchmarks, essential for real-time data applications. The IP is particularly beneficial in environments where large volumes of data must be moved swiftly and efficiently, such as in signal intelligence and large-scale data acquisition systems. Moreover, the VITA 17.3 Gen3 protocol offers enhanced error-checking capabilities ensuring data integrity even in challenging operating conditions. Its modular design aids in seamless integration and deployment across different platforms, making it a preferred choice for system architects aiming to leverage cutting-edge communication technologies.
The 56G SerDes Solution from InnoSilicon represents a high-speed, versatile interface supporting a variety of protocols such as PCIe, USB, RapidIO, and Ethernet. It leverages advanced design techniques to deliver exceptional data transmission speeds of up to 56Gbps, tailored for the needs of high-performance computing environments. The SerDes architecture is engineered to minimize signal degradation and optimize power consumption, making it ideal for integration into data-intensive applications such as data centers and cloud computing infrastructures. This solution supports comprehensive testing and verification processes, ensuring robust data integrity and compliance with the latest industry standards. By integrating this SerDes solution, designers can achieve superior connectivity and scale their applications to meet evolving technological demands.
The Universal Chiplet Interconnect Express (UCIe) is Extoll's premier offering designed to facilitate high-speed and efficient interchip communication for chiplet-based systems. UCIe provides an innovative approach to integrating diverse chiplet modules, ensuring seamless data transfer and optimized system performance. This technology stands out for its ability to support heterogeneous integration, making it essential for cutting-edge semiconductor designs that require flexibility and adaptability. Extoll's UCIe is architectured to deliver low-latency, high-bandwidth communication which is critical for modern electronic devices requiring fast processing speeds and efficient power usage. The solution is engineered to work harmoniously within a broad spectrum of technology nodes ranging from 12nm to 28nm, making it suitable for various applications in computing and communications sectors. This IP plays a crucial role in enabling developers to build scalable, sustainable systems, thereby pushing the envelope of what modern semiconductor technologies can achieve. Extoll ensures that the UCIe offers interoperability with other industry standards, enhancing its versatility and making it a preferred choice for companies looking to leverage the full potential of chiplet technology.
XtremeSilica's CXL solution provides high-bandwidth connectivity and uniform memory access protocols ideal for servers and data centers. This technology supports workloads that demand quick data-sharing capabilities and cross-platform cooperation, optimizing computing resources and performance. CXL enhances computational speed and precision through a coherent memory interface, facilitating seamless data exchanges between CPUs and accelerators. This is particularly advantageous in dynamic cloud computing environments where data throughput and system efficiency directly impact performance. The flexibility of CXL IP extends to various application domains, ensuring integration across existing infrastructures while boosting overall system agility and processing speed. This positions CXL as an indispensable solution in developing adaptable, high-performance computing architectures.
Genesis is a fully integrated solution aimed at streamlining package and PCB design workflows. With its comprehensive design suite, Genesis enables engineers to create sophisticated electronic packages, ensuring alignment with industry standards for performance and reliability. By leveraging the capabilities of Genesis, design teams can efficiently manage complex projects from conception to final layout. The tool's advanced features allow for seamless integration of various design elements, promoting a cohesive design environment that supports multi-layer designs and intricate interconnection schemes. Genesis's robust design capabilities help cut down on development times while maintaining high standards of accuracy and detail, crucial for performance-critical packages. As an essential tool in a modern designer's toolkit, Genesis stands out for its ability to manage the intricacies of PCB layouts alongside advanced packaging structures, making it invaluable for engineers tasked with delivering top-tier electronic solutions across a range of industries.
Photowave is Lightelligence's contribution to the realm of optical communications, specifically designed for connectivity solutions like PCIe and Compute Express Link (CXL). This optical hardware capitalizes on the inherent low latency and energy-saving attributes of photonics, allowing for extensive scalability across server racks, crucial to modern data centers. Photowave is a trailblazer, marking the first optical interconnect tailored for CXL setups, providing a remarkable latency of less than 1 nanosecond in Active Optical Cables and slightly more in other configurations. It supports advanced CXL standards and PCIe 5.0 speeds, making it a desirable choice for future-proofing data center infrastructures. Additionally, Photowave proves advantageous in AI data centers, demonstrating significant throughput improvements in memory-intensive tasks such as large language model applications. Through its robust construction and innovative use of multi-mode fibers, Photowave assures a 2.4x improved performance in memory offloading tasks, offering constant high performance levels not seen in traditional disk-based architectures.
XPLM is an innovative solution for managing simulation processes and data in the ever-evolving field of electronic design. This tool provides a centralized platform for storing, organizing, and accessing large volumes of data, ensuring that design teams can operate efficiently and effectively. By integrating data management into the design process, XPLM reduces the complexity associated with handling vast amounts of information, thereby streamlining workflows and enhancing productivity. It supports engineers in maintaining version control and collaboration across different projects, helping manage resources and timelines more effectively. XPLM's comprehensive data handling capabilities make it indispensable for organizations committed to maintaining a competitive edge in the semiconductor industry. By simplifying the intricacies of data management, XPLM helps transform simulation insights into actionable strategies, driving design innovation and operational excellence.
The High-Speed SerDes for Chiplets by Extoll offers a robust solution for high-speed data transmission while minimizing power consumption. It is designed to meet the increasing demands of chiplet-based system architectures by facilitating fast and reliable interchip communication. Extoll's SerDes is an essential technology that supports the development of advanced, energy-efficient devices. Its architecture ensures superior signal integrity and scalability, catering to various technology nodes from 12nm to 28nm, making it versatile for a range of applications in the semiconductor industry. The focus on low power consumption makes it a top choice for designs where efficiency is crucial, such as in mobile devices, computing, and communication systems. This SerDes IP forms a critical component for engineers aiming to build powerful yet power-conscious semiconductor solutions. Extoll provides extensive support for integrating this IP into larger, complex systems, ensuring seamless interoperability and performance. In collaborations, such as with Frontgrade Technologies, Extoll's SerDes has proven its capability to work effectively in multi-vendor environments, enhancing its appeal and reliability within the marketplace. Its adaptability and high performance make it an ideal choice for next-generation chiplet technologies, driving the future of semiconductor innovations.
Glasswing provides a pioneering ultra-short reach SerDes solution, leveraging Chord signaling for enhanced data throughput with low power consumption. This innovation supports scalable connections across diverse devices, facilitating higher bandwidth while reducing the need for excessive pins. The technology optimally uses CNRZ-5 signaling, delivering twice the bandwidth per pin compared to traditional NRZ methods and achieving remarkable power efficiency. This makes it a versatile choice for demanding environments such as high-performance computing and AI, where power savings are crucial. By harnessing the benefits of Chord signaling, Glasswing can expand chip interconnects without sacrificing signal integrity, supporting large multi-chip modules (MCMs) and offering comprehensive diagnostics with built-in tools like EyeScope. This makes it an ideal choice for applications demanding reliability and efficiency at scale.
The Speedster7t FPGAs are designed to handle high-bandwidth workloads, addressing limitations commonly found in traditional FPGAs. Built using TSMC's advanced 7nm FinFET technology, these FPGAs feature an innovative 2D network-on-chip (NoC) that offers a revolutionary approach to data transport across the chip. The NoC architecture connects various interfaces to an extensive number of access points within the FPGA fabric, providing unprecedented ASIC-like performance. The Speedster7t series incorporates machine learning processors, high-bandwidth GDDR6 interfaces, PCI Express Gen5, and 400G Ethernet interfaces, making them ideal for AI and ML workloads. These FPGAs ensure efficient routing of data, significantly reducing congestion compared to traditional methods, and streamlining the design complexity. This capability allows for high-speed interfaces and internal connections that facilitate the handling of massive data volumes, crucial for applications in 5G infrastructure, computational storage, network acceleration, and more. The enhanced performance and bandwidth capabilities are complemented by a robust set of features including multiple high-speed Ethernet lanes, advanced SerDes, and comprehensive memory support, positioning Speedster7t FPGAs as a versatile choice for various high-performance and data-intensive applications.
InnoSilicon's UCIe Chiplet Interconnect offers a cutting-edge solution for advanced chip interconnections, enabling efficient data transfer between dies on a single package. The interconnect supports high bandwidth and low latency communication, thereby facilitating seamless data exchange in complex multi-die systems. Ideal for high-performance computing (HPC) and AI applications, the UCIe Interconnect ensures robust connectivity across chiplets, effectively addressing the growing demands for integrated system designs. This solution's adaptability caters to a wide array of implementations, from datacenters to edge AI operations, promising significant improvements in both power efficiency and system performance. By utilizing the UCIe Chiplet Interconnect, designers can optimize their systems for critical applications, ultimately enhancing throughput and reliability in multi-chip designs.
The VITA 17.1 Serial FPDP Solution offers a high-speed digital communication protocol designed for demanding environments. This product provides robust and efficient data transfer capabilities, ideal for applications in aerospace and defense. Featuring a serial point-to-point link, it enables direct communication between systems, minimizing latency and maximizing data throughput. Engineers favor this solution for its scalability and compatibility with existing and emerging technologies, ensuring a secure investment in future-proofing their systems. The VITA 17.1 standard's interoperability with various platforms highlights its versatility, making it suitable for a broad array of mission-critical applications. With support for different data transfer speeds and modes, this solution can be tailored to fit specific requirements, guaranteeing optimal performance under varying operational conditions.
The CXL 3.0 IP by Rapid Silicon is a cutting-edge controller designed to optimize advanced hardware configurations with superior speed and efficiency. This IP supports the latest Compute Express Link (CXL) 3.0 specification, ensuring seamless integration with contemporary FPGA designs. The standout feature of this controller is its backward compatibility, supporting previous iterations such as CXL 1.1, 2.0, and related PCIe standards from 1.1 up to the recent 6.0. The CXL 3.0 IP provides a highly configurable architecture that can be tailored to various design needs. Users can adjust parameters such as the number of lanes and datapath width to suit specific project requirements, enhancing performance on both speed and scale. Furthermore, the controller integrates features like lane bonding and multicast, alongside error correction capabilities, thereby enhancing robustness and reliability. Adding to its flexibility, CXL 3.0 IP incorporates advanced scalability, which ensures it can adapt to evolving technological landscapes. Its compatibility across multiple generations of CXL and PCIe standards ensures that it remains a future-proof component, enabling seamless upgrades and integration into next-gen systems.
This JESD204B multi-channel PHY core is designed to facilitate high speed data transfer with maximum throughput up to 12.5Gbps. Supporting the JESD204B standards, it comes with enhanced functionalities like SYSREF for deterministic latency and 8b/10b encoding and decoding. The IP core offers independent transmit and receive designs, catering to a variety of high-speed applications requiring precise synchronization and data flow management. Advanced design techniques ensure stable and reliable performance even in complex environments. The JESD204B solution targets applications where multi-channel high-speed data conversion is essential, such as in telecommunications and advanced digital signal processing. Its support for different process nodes ensures compatibility across manufacturing platforms. Consequently, this PHY reduces time-to-market and increases design efficiency in implementing JESD204B-based solutions in sophisticated systems. Offering compatibility with 65nm, 55nm, 40nm, and 28nm technologies, the PHY covers a broad spectrum of fabrication processes. This flexibility supports a variety of foundry choices, enabling designers to optimize for various cost, performance, and power metrics. As a high-speed PHY solution, it serves as an integral component in lowering overall system cost while ensuring high performance.
Eliyan’s NuLink technology extends its innovation to die-to-memory connections, providing unmatched bidirectional signaling, which maximizes bandwidth efficiency and system performance on standard and advanced packaging platforms. The NuLink die-to-memory PHY supports advanced communication for memory-intensive applications, utilizing transceivers that operate in bidirectional mode, adapting based on the memory activity, either as sender or receiver. The technology caters to memory connections that require quick switching between operations, such as read and write, and dramatically enhances memory integration capabilities using the Universal Memory Interface (UMI) proposals. This supports seamless pairing of an ASIC with a variety of memory chip configurations, including DDR and HBM, leveraging the versatility of dynamic half-duplex transceivers. This capability significantly augments memory traffic handling, doubling the bandwidth potential on memory lanes, even when using cost-efficient standard packaging substrates. Moreover, Eliyan's proposition for broader adoption within industry standards suggests replacing traditional DRAM PHYs and controllers with more efficient configurations using NuLink PHYs. Consequently, this not only optimizes the ASIC design by saving power and space but also positions Eliyan’s solutions as a pillar for advancing chiplet-based architectures, particularly in high-demand applications like AI, automotive, and telecommunication markets.
The Interconnect Generator from Dyumnin offers a versatile, protocol-agnostic interconnect solution that supports both AXI and OCP master/slaves. It produces interconnect structures in various forms, including simple, pipelined, and crossbar configurations. This flexibility allows the interconnect to adapt to atomic request-response behaviors to more intricate split transactions with independent address and data phases.\n\nThe built-in reorder buffer, featuring customizable depth, ensures efficient data delivery handling multiple outstanding requests and maintaining order. This robust design is vital for system architects looking to build high-performance systems that require reliable interconnect solutions with minimal latency and high data throughput.\n\nThrough its adaptable nature, the Interconnect Generator is well-suited for a variety of applications across different industries, offering a high degree of customization to meet specific design challenges and performance requirements.
This core facilitates precise and fault-tolerant networking, essential for environments requiring consistent timing and reliability, such as automotive and industrial applications. It supports scalable network speeds from 1Gbps to 10Gbps and includes features like babbling protection and anti-masquerading functionalities. The AXI standard interface simplifies integration, ensuring this core remains user-friendly and versatile.
The Zetti switch represents a groundbreaking step in small-scale PCIe Gen 5 designs, offering multi-peripheral support with high efficiency. It sets new benchmarks with backward compatibility across Gen 1-4, bringing the latest high-speed connectivity to applications ranging from IoT to telecoms. Zetti is remarkable for its built-in features like Hot Plug and Peer to Peer support, reducing CPU workload and aiding in low-latency access and power efficiency. Its on-chip diagnostic tools ensure swift issue resolution, making it applicable for high-performance needs. Designed for scalability and diverse applications, Zetti facilitates seamless integration of CPUs and GPUs operating multiple peripherals with varied performance requirements. Its comprehensive set of functionalities enables accelerated operations in environments that demand reliability and swift data handling.
The Prodigy FPGA-Based Emulator from Tachyum is a sophisticated tool designed to facilitate the evaluation and development of the Prodigy Universal Processor. This emulator allows stakeholders such as OEMs and ODMs to conduct exhaustive testing and performance measurements, ensuring compatibility and functionality for new designs. The system is equipped with multiple FPGAs that simulate entire processor cores, enabling precise emulation of various tasks, including both vector and matrix operations. Tachyum’s FPGA emulator stands out for its ability to assist in software development and debugging, making it indispensable for developers transitioning or optimizing applications on the Prodigy architecture. The emulator bridges the gap between theoretical design and practical implementation, offering a platform where new applications can be rigorously assessed before physical deployment. This process helps in addressing potential challenges, ensuring that when the Prodigy chips are utilized in real-world scenarios, they meet expected performance benchmarks and reliability standards. Maximizing flexibility, this emulator provides support for multiple applications including AI training and high-performance computing tasks. Its use of FPGAs allows for an in-depth analysis of how the Prodigy processor would perform in a controlled environment, providing valuable insights into the capabilities and limits of the processor under various scenarios.
The Regli PCIe retimer is purpose-built to deliver top-tier signal integrity and minimal latency in PCIe and CXL environments. It operates with exceptional precision at a latency of below ten nanoseconds, maintaining an ultra-low error rate of up to 1E-12, making it one of the most reliable retimers available. This innovative retimer supports PCIe 5.0 functions at speeds reaching 32 GT/s over bidirectional lanes, ensuring superior communication between components. It further enhances system performance with improved signal integrity, making it particularly suited for storage solutions, 5G infrastructure, and data-intensive applications in hyperscaler scenarios. The Regli retimer also stands out with features such as secure boot processes, flexible clock modes, and multiple control interfaces, allowing for straightforward system integration. Its capabilities extend to on-chip diagnostics, ensuring easy maintenance and optimal performance across its lifespan.
ALSE's Aurora 8B/10B IP Core is designed for efficient serial communication, employing the 8B/10B encoding method to support data rates conducive to medium to high-bandwidth applications. This IP Core facilitates the reliable transmission of data between multiple FPGAs, ensuring a low-error rate and maintaining high data integrity throughout the process. The IP Core's design focuses on optimizing the trade-off between bandwidth efficiency and data integrity, making it suitable for applications that require robust communication links between hardware components. It is frequently employed in environments demanding quick data exchange, such as embedded systems and telecommunications infrastructure. Engineered to provide streamlined integration across varying FPGA platforms, the Aurora 8B/10B IP Core supports simplified implementation processes. ALSE provides continuous development and support to ensure the IP Core remains current with industry advancements, offering a scalable and flexible solution for developers in need of dependable serial connectivity options.
The Aurora 64B/66B IP Core from ALSE is a high-performance communication protocol designed to facilitate large-scale data transfers over serial connections. It supports up to 100G data rates, making it ideal for high-bandwidth applications requiring reliable serial communication between FPGAs. This IP is essential for applications such as advanced digital signal processing and high-speed data channels, where substantial data throughput and low-latency communication are paramount. ALSE's IP Core employs the innovative 64B/66B encoding scheme, which minimizes transmission overhead and enhances signal integrity across lengthy transmission lines. By offering a mature and proven technology, the Aurora 64B/66B IP Core ensures stability and efficiency in data transfers, suited for high-speed interconnect requirements in complex systems. This IP's adaptability across multiple FPGA platforms allows for flexible project inclusion while optimizing use cases like high-performance computing and data acquisition systems. Developers will appreciate its ability to maintain consistent performance across varying environmental conditions, backed by ALSE’s comprehensive customer support framework.