All IPs > Analog & Mixed Signal > Temperature Sensor
The category of Analog & Mixed Signal > Temperature Sensor in the Silicon Hub encompasses a wide range of semiconductor IPs designed to enable precise temperature monitoring within various electronic systems. These IPs are pivotal in ensuring reliable performance of electronic products by providing accurate temperature data, which is essential for maintaining optimal operating conditions and preventing thermal-related failures.
Temperature sensors within this category come in diverse forms, including analog and digital outputs, leveraging innovative mixed signal design techniques to achieve high precision despite varying environmental conditions. Key applications of these semiconductor IPs can be found in sectors such as consumer electronics, automotive, industrial automation, and healthcare devices, where temperature monitoring is critical for operational efficiency and safety.
Integrating temperature sensor IPs into semiconductor designs simplifies system architecture by reducing the need for additional discrete components, thereby saving space and power while enhancing overall functionality. In automotive applications, for example, these sensors are crucial for monitoring engine temperature, battery thermal management, and cabin climate control systems. In consumer electronics, they ensure safe battery operation and efficient thermal management for gadgets like smartphones and laptops.
Overall, temperature sensor semiconductor IPs play a vital role in the development of modern electronic systems by providing the precise temperature measurement capabilities required for various thermal management applications. Silicon Hub offers a comprehensive selection of these IPs, tailored to meet the stringent demands of today’s advanced technology ecosystems, ensuring your products are equipped with the latest in thermal sensing innovation.
eSi-Analog delivers integrated analog solutions that enhance the performance of custom ASICs and SoCs. The IP range includes oscillators, PLLs, and sensor interfaces, critical to developing high-fidelity analog functionalities. Designed for low power consumption, these solutions are adaptable to customers' requirements, ensuring expedited time-to-market. Silicon-proven across multiple process nodes, eSi-Analog enables innovative designs in competitive, dynamic industries. With a focus on reducing integration complexity and costs while maintaining high performance, eSi-Analog serves crucial roles in various applications, such as IoT devices, wearables, and medical systems, benefiting from the reliable analog performance.
The sensors developed by Analog Bits are sophisticated components designed for the precise monitoring and management of chip conditions such as PVT (process, voltage, temperature) variability and power supply levels. These sensors are embedded into semiconductor devices to provide accurate data that aids in optimizing system performance and energy efficiency. Analog Bits offers a comprehensive sensor IP portfolio that includes high-precision temperature sensors and power supply droop detectors. These sensors are particularly adept at detecting voltage fluctuations, ensuring that chips operate within optimal parameters while safeguarding against thermal and power-related failures. Designed with minimal footprint and low power metrics, these sensors are fully integrated into the chip substrate, streamlining the monitoring process. This integration is crucial for maintaining the reliability and longevity of semiconductor products, making them an essential component in industries ranging from consumer electronics to advanced computing systems.
The MVH4000 Series offers a robust solution for measuring humidity and temperature with high accuracy. These sensors utilize a proprietary Silicon Carbide MEMS technology, promising long-term stability and durability. The rapid response time, low power usage, and compact design make this series ideal for demanding applications, providing exceptional precision in data measurement and transmission.
The Aeonic Insight delivers advanced on-die telemetry for SoCs, allowing for actionable insights into power grids, clock health, and silicon security. Suitable for applications ranging from data centers to automotive systems, it features programmability and process portability, ensuring high efficiency and scalability through advanced process technologies. It integrates seamlessly with third-party analytics platforms through industry-standard interfaces.
ISELED, a breakthrough in automotive lighting technology, integrates smart LED control into a simplified digital architecture. This solution revolutionizes the way automotive ambient lighting is deployed and managed, by embedding the RGB LEDs with their driver in a single, compact module. ISELED LEDs offer color calibration at the point of manufacturing rather than in the final system assembly, ensuring more consistent and vibrant lighting across all units. A cornerstone of ISELED is its calibration-free operation that simplifies initial setup and reduces costs by eliminating the need for color binning during production. It uses proprietary communication protocols over a simple two-wire interface, streamlining the installation and control of complex lighting systems. ISELED technology supports daisy chaining of thousands of individual LEDs, with each LED being individually addressable for nuanced lighting schemes. ISELED is not limited to aesthetic improvements but is also pivotal in functional lighting designs, offering extensive diagnostic capabilities combined with internal temperature monitoring to prolong component lifespan and reliability. This innovation helps automotive designers create unique lighting profiles that enhance vehicle appeal and safety, positioning ISELED as a leader in automotive interior lighting solutions.
The MVWS4000 Series combines humidity, pressure, and temperature sensing in a single, compact digital unit. Engineered with state-of-the-art Silicon Carbide technology, these sensors promise high reliability and performance with ultra-low power consumption. Especially suitable for battery-powered and demanding original equipment manufacturer (OEM) applications, they offer excellent accuracy and stability over time, catering to a wide array of environmental monitoring needs.
The agileTSENSE_D temperature sensor provides a digital output, extending the capabilities of traditional temperature sensing by incorporating digital signal processing. It retains the core analog sensing mechanism but wraps the output in a digital format for easier integration into modern digital systems, including IoT devices and data centers. This product is designed for environments where digital interfacing is critical. With its adaptable architecture, the agileTSENSE_D delivers precision temperature measurements over a broad operational range, ensuring that systems maintain optimal performance and safety. This functionality is crucial for thermal monitoring and management. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The Chipchain C100 is a sophisticated, single-chip solution designed for Internet of Things (IoT) applications. It is built around a 32-bit RISC-V CPU operating at speeds of up to 1.5GHz, supplemented by embedded RAM and ROM, ensuring exceptional computational efficiency. The C100 integrates several essential features for IoT use, including Wi-Fi capability, multiple data transmission interfaces, and built-in ADCs, LDOs, and temperature sensors. This integration is aimed at simplifying and expediting application development across various domains ranging from security to healthcare.
The Time-Triggered Protocol (TTP) is an advanced communication protocol designed for highly reliable and deterministic networks, primarily utilized in the aerospace and automotive sectors. It provides a framework for the synchronized execution of tasks within a network, facilitating precise timing and coordination. By ensuring that data transmission occurs at predetermined times, TTP enhances the predictiveness and reliability of network operations, making it vital for safety-critical applications. The protocol is engineered to function in environments where reliability and determinism are non-negotiable, offering robust fault-tolerance and scalability. This makes it particularly suited for complex systems such as those found in avionics, where precise timing and synchronization are crucial. The design of TTP allows for easy integration and scalability, providing flexibility that can accommodate evolving system requirements or new technological advancements. Moreover, TTP is characterized by its rigorous adherence to real-time communication standards, enabling seamless integration across various platforms. Its deterministic nature ensures that network communications are predictable and maintain high standards of safety and fault tolerance. These features are crucial in maintaining operational integrity in critical applications like aerospace and automotive systems.
The agileTSENSE_A is a general-purpose temperature sensor that utilizes a ΔVBE sensing mechanism to amplify and transform temperature-related voltages into a single-ended signal. This sensor is designed to work seamlessly with the agileADC to provide digital outputs with impressive accuracy of +/-0.25°C. It's especially significant for modern SoCs, where thermal management is crucial for power optimization and security threat detection. This sensor covers a wide operating range from -20°C to +100°C. It features a rapid startup time and minimal current consumption, making it apt for SoC integrations where efficiency is key. Further customization options allow for ease of incorporation into diverse systems. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Thermal Oxide is a foundational dielectric layer utilized in various semiconductor devices. When properly developed using high purity, low defect silicon substrates, Thermal Oxide serves as an excellent insulator. The application of Thermal Oxide includes its use as a 'field oxide', which can electrically isolate different conductive films such as polysilicon and metal from the silicon substrate. Furthermore, it is integral as a 'gate oxide' within devices, providing the necessary dielectric layer.\n\nManufacturing of Thermal Oxide involves oxidizing silicon wafers in high-temperature furnaces, with standard processes occurring between 800 and 1050 degrees Celsius. This method involves housing the wafers in quartz glass tubes that can withstand the high thermal requirements, ensuring minimal risk of cracking or warping during processing due to its inherent stability.\n\nThe Thermal Oxide process at NanoSILICON involves both wet and dry oxidation methods, utilizing ultra-high purity sources. The process enables the precise control of oxide thickness and uniformity, confirmed by advanced measurement tools such as the Nanometrics 210. This ensures that the resulting layers have uniform thickness across and within wafers, critical for the device's performance and reliability.\n\nNanoSILICON's expertise in Thermal Oxide Processing results in layers ranging from 500 to 100,000 Å, with carefully maintained process controls for thickness variation and uniformity. It is integral to various applications in the semiconductor industry, supported by their highly specialized equipment and meticulous quality assurance processes.
Microdul's innovative Human Body Detector for Ultra-Low-Power is engineered to ensure minimal energy consumption, making it ideal for battery-operated wearable devices. Utilizing capacitive sensing technology, it efficiently detects the presence of a human body, triggering power-saving modes when the device is not worn. This feature significantly enhances the battery life of the device, making it particularly useful for portable applications. The Human Body Detector is designed for both dynamic and static detection, ensuring versatility in a variety of scenarios. When not in active use, it can reduce the power draw of the device, contributing to overall energy efficiency. Its seamless integration into existing systems makes it a valuable component for manufacturers focusing on enhancing product longevity without compromising performance. This detector is part of Microdul's suite of Ultra-Low-Power solutions, reflecting the company's commitment to providing efficient, reliable, and innovative components for the IoT and wearable technology markets.
The Ultra-Low-Power Temperature Sensor from Microdul is a tailored solution for IoT applications, incorporating precision sensing within a compact form factor. Designed to monitor temperature changes with minimal energy use, it supports IoT devices that demand long-lasting, battery-efficient performance. This sensor is ideal for applications in energy harvesting systems where continuous power supply is not guaranteed. The sensor's design ensures reliable performance, even in challenging environments, making it suitable for a wide range of industrial and consumer uses. Its capacity for precise temperature measurements enables accurate monitoring and control, critical for maintaining system stability and efficiency. As part of Microdul's focus on low-power solutions, this sensor exemplifies their approach to sustainable technology, reducing the carbon footprint and enhancing the operational lifespan of IoT devices. Whether used in smart home systems, environmental monitors, or industrial controls, this sensor's adaptability and efficiency make it a valuable addition to the modern IoT landscape.
The Capital E/E Systems Development Solutions by Siemens Digital Industries Software is a comprehensive suite designed for the intricate demands of electrical and electronic systems in modern devices. The solution spans system and software architectures, network communications, and embedded software development, providing a robust platform for creating detailed E/E integrations. It's particularly valuable in complex applications such as automotive, aerospace, and other sectors where reliable electronic systems are critical. With Capital, users can develop advanced electrical systems that enhance communication networks while embedding sophisticated software capabilities within hardware architectures. This tool aids in optimizing both the development and lifecycle management of electrical systems, leading to superior performance and reduced time-to-market. The platform focuses on offering intuitive design environments that facilitate seamless integration across various engineering domains. Features like automated processes, simulation, and validation support ensure that designs comply with relevant industry standards while also allowing engineers to innovate swiftly. Capital's role in streamlining processes and enhancing product reliability makes it a favored choice for industries aiming to boost efficiency and reduce operational costs. It's engineered to enable collaboration and connectivity at scales that align with the increasing demands of today's complex systems.
The Linear Temperature Sensor from TES is designed to generate a voltage signal that changes linearly with temperature, providing real-time monitoring capabilities vital for various applications. It delivers an output voltage that scales linearly with the junction temperature and is customizable to deliver 2V output at 60°C. This sensor is optimized for integration into electronic systems, ensuring precise environmental control within devices. It operates with a single 4V supply voltage and is fully silicon-proven within XFAB's XT018 technology but can be transferred to other platforms upon request. This makes it an invaluable addition to temperature-sensitive applications within industrial, automotive, and electronic devices, where accurate thermal monitoring is paramount.
Designed for secure in-vehicle networking, the CANsec Controller Core is a cutting-edge solution for enhancing the security aspects of Controller Area Network (CAN) communications. This core integrates cryptographic protocols to safeguard automotive data transmissions from potential cyber threats, ensuring privacy and data integrity. Apart from boosting security, it also maintains the legacy CAN protocol’s simplicity and robustness, making it suitable for a wide range of automotive applications. This flexibility allows automotive manufacturers to upgrade existing systems with state-of-the-art security without necessitating a complete redesign. The CANsec Controller Core exemplifies Fraunhofer IPMS’s innovative approach to intertwining security with traditional automotive frameworks, ultimately leading to more secure and trustworthy in-vehicle communication systems.
The RRH62000 Air Quality Sensor Module is crafted to monitor and report on air quality metrics with high fidelity. This sensor module utilizes sophisticated algorithms to measure various air quality indices, providing accurate and actionable data for environmental monitoring systems. Its compact design and low power consumption make it a suitable choice for both portable and fixed monitoring solutions.
The Linear Regulators & Bandgap Reference IP offered by Omni Design is tailored to support next-generation semiconductor applications, providing efficient power management solutions that sustain complex electronic systems. This IP suite includes low dropout (LDO) regulators and reference current/voltage generators that are essential for maintaining stability and performance across various technologies. Designed to perform within advanced process nodes ranging from FinFET to 28nm, these regulators are noted for their excellent transient response, low noise, and high power supply rejection ratio (PSRR). They utilize innovative control techniques to deliver both internally and externally compensated LDO solutions, catering to different system requirements. Omni Design’s bandgap reference solutions are capable of broad integration with other semiconductor IPs, simplifying design processes in data conversion applications. They ensure robust performance without necessitating calibration or additional programming efforts, although flexible customization options are available for specific needs.
The SAR ADC and Temperature Sensor IP by M31 is architected to provide high precision and flexibility for a variety of applications. With resolutions up to 12-bit and support for speeds up to 2.5 MSPS, these components are tailor-made for low-power, high-performance environments. Designed with innovative circuit techniques, the ADC simplifies system clocking, thus reducing power requirements and design complexity in SOC/ASIC integrations. The sensor capabilities extend the IP's use to applications demanding precise environmental monitoring and control. This ultra-low power IP is especially suited to battery-powered and IoT products, offering exceptional performance in compact form factors, ideal for modern electronic devices needing accurate conversion and monitoring capabilities.
The CM6216ea is a high-precision temperature sensor offering unparalleled accuracy of 0.1°C over a wide temperature range. Its ultra-low power consumption makes it ideal for battery-operated devices, significantly extending their operational time. With a foundation in 0.25μm CMOS technology, this sensor stands as a testament to sophisticated design tailored for demanding temperature monitoring tasks. Designed to offer exceptional performance within compact forms, the CM6216ea sensor excels in applications where space and power efficiency are primary constraints. Its precision lends itself to critical applications where exact temperature readings are essential for system stability and efficiency, such as in environmental sensing and portable health tech. With an emphasis on reliability and performance, the CM6216ea is still under development, representing Chipus’s commitment to pushing the boundaries of sensor technology. This sensor's detailed engineering ensures it remains on the forefront of innovation, delivering solutions that meet high accuracy and low power demands.
The ZSSC3286 Sensor Signal Conditioner is designed to offer precision and efficiency in sensor signal conditioning tasks. This versatile component supports various sensor types, enhancing the accuracy and reliability of sensor data while maintaining low power consumption. Ideal for applications requiring high-frequency signal processing, it integrates seamlessly into a broad array of systems, offering robust performance in diverse conditions.
The SAR ADC with Temperature Sensor is designed to excel in environments requiring precise voltage and temperature monitoring. This 12-bit, 20 kSPS ADC integrates a temperature sensor, providing seamless monitoring of environmental variables critical to various industrial applications. Engineered for low-frequency settings, it assures accurate DC measurements essential in monitoring applications. Its design ensures ease of integration by providing a comprehensive on-chip solution housed within an efficient high-voltage 180 nm process. With temperature measurements ranging from -40°C to +125°C, the ADC's INL and DNL performance at 0.65 LSB and 0.6 LSB respectively underscore its precision. This ADC facilitates easy system integration through optional built-in bandgap reference voltage. It's well-suited for designs needing robust temperature calibration at room temperature. Whether you're developing solutions for healthcare, industrial sensor applications, or smart grid technologies, this ADC offers the reliability and accuracy you require.
This advanced acquisition chain is specifically tailored for intracardiac pacemaker systems, offering nanopower operation for extended battery life. It specializes in processing unipolar ECG and EGM signals with high precision and minimal power usage. The system’s design emphasizes compactness and efficiency, ensuring it seamlessly integrates into miniaturized medical devices while maintaining the high levels of accuracy required for effective cardiac monitoring.
The TS5111 and TS5110 device incorporate thermal sensing capability which is controlled and read over two wire bus. These device operate on I2C and I3C two wire serial bus interface. The TS5 designed for Memory Module Applications. The TS5 device intended to operate up to 12.5 MHz on a I3C Basic Bus or up to 1 MHz on a I2C Bus. All TS5 devices respond to specific pre-defined device select code on the I2C/I3C Bus.
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