All IPs > Analog & Mixed Signal > RF Modules
In the dynamic world of semiconductor IPs, RF Modules play a crucial role in ensuring seamless wireless communication across a wide range of devices. RF, standing for Radio Frequency, refers to the technology that utilizes electromagnetic spectrum frequencies to transmit data wirelessly, thereby eliminating the need for physical connection and enabling greater flexibility and convenience in electronic systems. Our RF Modules category within the Analog & Mixed Signal primary category consists of a diverse collection of products designed to facilitate this wireless interaction by offering effective solutions for complex radio frequency circuits.
The applications of RF Modules semiconductor IPs are vast and versatile, encompassing a multitude of industries including consumer electronics, telecommunications, automotive, and industrial systems. In consumer electronics, RF modules are crucial for developing devices such as smartphones, smartwatches, and wireless earbuds, where they help in managing and optimizing data transmission over wireless networks. Telecommunications heavily rely on these modules for building robust infrastructure, enabling efficient data handling in mobile networks and satellite communications.
Moreover, in the automotive sector, RF modules contribute to the advancement of vehicle connectivity technologies, supporting features like keyless entry, tire pressure monitoring systems, and vehicle-to-everything (V2X) communication. Similarly, in the industrial domain, these modules are fundamental components in systems that require reliable long-distance wireless communication, such as in smart grid applications and remote monitoring systems.
Within the RF Modules category, you will discover a comprehensive selection of semiconductor IPs tailored to meet various design specifications. These include components that support different frequency bands, offer varying levels of integration, and are designed to comply with a range of communication standards and protocols. Whether you need baseband processors, RF transceivers, or complete system-on-chip solutions, our RF Modules in Analog & Mixed Signal provide ample choices for engineers and designers looking to enhance the performance, reliability, and functionality of wireless-enabled products.
Operating at 24GHz, the VCO24G is a Colpitts-type Voltage-Controlled Oscillator developed to bring precision and low-noise performance to RF and broadband applications. Constructed with the TowerJazz 0.18um SiGe process, this VCO emphasizes cost-efficiency without sacrificing quality. Its differential design architecture reduces phase noise, thus enhancing the signal clarity essential for PLLs and broadband test and measurement systems. The frequency range offers the adaptability needed for varied applications, ensuring the VCO24G's capability in handling different RF requirements effectively. With its cost-effective process and high-performance specs, the VCO24G stands as a reliable option for OEMs seeking solid RF solutions. Its deployment spans scenarios that require exact frequency control and operational stability in challenging environments.
The DIV60G is a highly efficient differential frequency divider designed to operate up to 60GHz. Implemented using TowerJazz’s 0.18um SiGe technology, this divider includes an active balun input and I/Q outputs, making it an excellent choice for high-frequency applications such as broadband test and measurement equipment. It stands out with its ultra-high-frequency prescaler capabilities, accommodating both single-ended and differential inputs while providing differential outputs. This feature enhances its adaptability for various RF and mixed-signal applications, particularly in environments demanding precise frequency control. The device undergoes rigorous testing to validate its performance parameters, ensuring reliability in mission-critical applications. Its design encourages usage in systems seeking high stability and minimal phase noise, critical elements in modern communication systems.
The ORC3990 is a sophisticated System on Chip (SoC) solution designed for low-power sensor-to-satellite communication within the LEO satellite spectrum. Utilizing Totum's DMSS technology, it achieves superior doppler performance, facilitating robust connectivity for IoT devices. The integration of an RF transceiver, power amplifiers, ARM CPUs, and memory components makes it a highly versatile module. Leveraging advanced power management technology, this SoC supports a battery life that exceeds ten years, even within industrial temperature ranges from -40 to +85°C. It's optimized for usage with Totum's global LEO satellite network, ensuring substantial indoor signal coverage without the need for additional GNSS components. Efficiency is a key feature, with the chip operating in the 2.4 GHz ISM band, providing unparalleled connectivity regardless of location. Compact in design, comparable in size to a business card, and designed for easy mounting, the ORC3990 offers sought-after versatility for IoT applications. The ability to function with excellent TCO in terms of cost compared to terrestrial IoT solutions makes it a valuable asset for any IoT deployment focused on sustainability and longevity.
This versatile frequency divider, known as the DIV50G1, integrates programmable prescaler functions, supporting divisions by 1, 2, 4, 8, and 16. It leverages the advanced 0.18um SiGe SBC18HX process technology from TowerJazz, ensuring high precision and performance in RF applications. The DIV50G1 is specifically crafted for use in PLLs and broadband equipment, where controlling signal frequency is crucial. It handles both single-ended (SE) and differential (DIFF) inputs while delivering differential outputs, which bolsters its flexibility for diverse deployment scenarios. Known for its reliability, the DIV50G1 is subject to detailed testing that verifies both its maximum frequency range and power usage. By maintaining consistency and robust performance across varied conditions, this module meets the stringent requirements of modern communication infrastructures.
The H-Series PHY offers a groundbreaking approach to high bandwidth memory solutions, specifically fine-tuned for applications in AI, ML, graphics, and high-performance computing. This PHY IP core is engineered to deliver top-notch performance, accommodating challenging demands with optimized area and power consumption. It supports HBM2 and HBM2E standards with a robust data rate capability of up to 3200 MB/sec, allowing seamless integration with advanced systems. This PHY leverages a 2.5D interposer level design and supports up to 16 channels, providing substantial bandwidth in competitive environments. Notably, it is compatible with pseudo-channel configurations and manages up to 8 stacked HBM2E memories, delivering exceptional memory performance. The DFI 5.0 interface ensures smooth connectivity, making it ideal for AI, ML, graphics, and networking applications, delivering peak performance in various scenarios. Optimized for areas of low power and high efficiency, the H-Series PHY is crafted to reduce latency intricately. Its structural efficiency is underscored by its ability to balance performance with minimalistic design requirements, setting a benchmark for PHY implementations in demanding settings.
The VCO25G is a Colpitts Voltage-Controlled Oscillator, operating at 25.5GHz, designed to meet the demands of sophisticated RF systems. Utilizing TowerJazz's 0.18um SiGe process, the VCO25G achieves a low-noise, cost-effective solution ideal for PLLs and broadband instrumentation. Its differential architecture minimizes noise, delivering superior signal purity essential for high-fidelity applications. By providing both economy and precision, the VCO25G supports extended frequency tuning, crucial for adaptable RF solutions in diverse fields, including test equipment and telecommunications. Through its rigorous testing procedures, the VCO25G confirms enhanced performance metrics, making it a cornerstone for systems where precision frequency synthesis and stability are paramount. Its scalability further enhances its applicability across various RF design architectures.
The VCOMB12G is an advanced low-noise multi-band differential LC voltage-controlled oscillator, optimized for use in phase-locked loops and clock generation within fiber optic applications. Fabricated using IBM's 65nm 10LPe process, it offers a broad frequency range and high tuning precision. This oscillator provides various clocking modes, catering to protocols such as FEC+G.709, which are essential for modern high-speed communication systems. The VCOMB12G emphasizes energy efficiency, making it suitable for deployments where power consumption is a critical factor. Beyond its integration with fiber optic systems, the VCOMB12G can be utilized across a broad range of signal processing tasks that demand stable and precise clock sources. Its versatility and comprehensive feature set ensure it is a reliable core component in complex technological systems.
This ISM Band RF IP provides a comprehensive solution designed for integration into BLE applications, offering a robust platform with GF 22FDX process node capabilities. Its components include an advanced RF transceiver and digital power amplifier, achieving a peak power output of +23 dBm. The IP optimizes signal strength and minimizes space requirements with an integrated balun and matching network. Designed for versatility, the ISM Band RF IP is adaptable across different process nodes, making it a flexible choice for customers seeking to develop sophisticated RF ICs. The transceiver is in line with modern communication standards and is particularly useful for applications in low-power communication environments. This flexibility allows for the development of cost-effective, high-performing merchant market ICs. Orca Systems ensures that their IP can be efficiently licensed and integrated into various systems, promoting a streamlined and effective path to market for BLE developers. The focus on reduced power consumption and enhanced signal capabilities underscores the value of this IP in expanding and enhancing wireless communication methodologies.
Certus Semiconductor specializes in advanced RF/analog designs that encompass a broad range of solutions, from individual components to complete wireless transceivers. Their expertise extends to developing cutting-edge low-power wireless front-end technologies. They offer silicon-proven RF IP, full-chip RF products, and next-generation wireless IPs that support high-quality communication standards, including LTE, WiFi, and GNSS. Equipped with custom PLLs capable of operating at frequencies up to 6GHz, these solutions ensure low phase noise and minimal jitter for precise applications.
The EAMD12G is developed as a versatile EA/MZ modulator driver, facilitating data rates up to 11.3Gb/s. It boasts programmable output voltage swing and bias settings, which are essential for fiber optic communications involving EA and MZ modulators. Based on TowerJazz’s 0.18um SiGe technology, it ensures broadband high-output swing capabilities from DC to 12Gb/s. The driver features crossing point control and monitoring, which supports precision in signal modulation, thus enhancing communication fidelity. Its strategic design for cost-efficiency without sacrificing performance makes the EAMD12G a staple in fiber optic systems. Its adaptability and robust output capabilities support a wide range of applications from telecom to data center communications, where high-speed data transfer is essential.
Trimension SR200 is a single IC UWB chip designed for mobile applications, integrating both ranging and radar capabilities to facilitate enhanced device interactions. This chip is essential for mobile devices requiring high precision in location tracking and interaction detection. Benefiting from its compact integration, it supports seamless wireless communications, catering to the advancement of mobile technology through superior UWB features.
Trimension SR100 is focused on the mobile segment, enhancing devices through pre-installed FiRa stacks that provide dependable UWB functionality. Its design supports fundamental UWB tasks like ranging, making it an ideal choice for mobile platforms requiring robust and accurate positioning solutions. Integration into mobile devices allows for seamless communications with other UWB-enabled technologies, making it a staple in the evolution of interconnected consumer electronics.
This innovative chiplet offers a complete transmission solution, integrating a 16-channel 112G modulator and driver. The chip is designed for optimal performance in transmitting optical signals and features advanced digital control for precision tuning and stability. It is built to support systems requiring high bandwidth and efficient modulation, making it ideal for deployment in next-generation telecommunication networks. The combination of integrated modulator and driver ensures reduced power consumption and higher signal integrity, addressing the needs of modern data center applications.
Hermes 3D is crafted for the simulation of arbitrary 3D structures, offering unparalleled insights into electromagnetic performance across a variety of applications. Its core strength lies in providing high-precision FEM simulations that support the evaluation of complex geometrical designs typical in today's advanced electronic circuits. Hermes 3D empowers engineers with the capability to investigate and optimize diverse electromagnetic interactions within detailed 3D structures. This function is particularly essential when working with components that require precise behavior predictions under various operational conditions, ensuring that systems maintain their integrity and performance over time. By facilitating rigorous analysis, Hermes 3D aids in reducing costly design iterations and enhances efficiency in the product development cycle. Its application in arbitrary structural simulations makes it an essential tool for any designer seeking to ensure their systems are both innovative and reliable.
The THOR Toolbox provides a multifaceted platform for NFC and UHF connectivity, tailored for a wide range of IoT applications. It contains high-precision NFC components optionally combined with UHF for diverse data transfer capabilities, allowing for secure identification processes. This adaptability across multiple protocols makes it a valuable tool for capturing data and providing early-stage design validation for emerging technologies. Incorporating a robust temperature sensor, THOR measures environmental conditions with high accuracy, which is critical in industrial settings. It supports external sensor interfacing through analog and digital connections, providing flexibility in data acquisition. The toolbox also includes encryption features to ensure data integrity and security, making it ideal for applications requiring stringent data management, such as medical devices. Tailored for sectors facing rigorous demands like the industrial and medical markets, THOR's efficient memory storage and configurable data logging offer scalable solutions across safety, logistics, and healthcare monitoring domains. By enabling rapid development and deployment demonstrations, it significantly accelerates project timelines from concept to completion.
The 100BASE-T1 Ethernet PHY is an innovative solution for Ethernet connectivity, providing minimal wiring requirements and compact footprint benefits. It enables high-speed communication of 100Mbps over a single unshielded twisted pair (UTP) cable. This PHY is designed to be lightweight and features low power consumption, making it an ideal choice for applications that demand high-speed data transfer in constrained spaces.<br><br>This technology leverages advanced electrical engineering to achieve robust connectivity, ensuring data integrity over extended cable lengths compared to other solutions. Its compatibility with IEEE standards ensures it can be easily integrated into existing systems, enhancing their performance with minimal adjustments.<br><br>Such innovation aligns with evolving connectivity needs, making the 100BASE-T1 Ethernet PHY suitable for a broad range of industries, including automotive, where streamlined wiring can substantially reduce manufacturing costs and complexity.
Trimension SR040 is designed specifically for UWB tagging in both industrial and IoT sectors. It supports FiRa stacks, offering reliable and secure communication across devices. Ideal for tracking systems, the SR040 is engineered to ensure precision in location-based applications and utilizes the secure FiRa protocol to maintain consistent performance.
The FCM1401 is a high-performance Dual-Drive™ power amplifier operating at a center frequency of 14.5 GHz. This amplifier is designed to deliver outstanding efficiency and performance, surpassing conventional solutions. Its innovative architecture reduces silicon area by half, achieving a 62% core drain efficiency and a remarkable 70% efficiency at the device output. This device is optimized for modern telecommunication needs, ensuring robust signal integrity and reduced power consumption, pivotal for both space communications and wireless connectivity. The amplifier is crafted to meet future telecommunication demands effortlessly, offering superior gain and efficiency across a range of applications. Its versatility extends across various platforms, including CMOS, GaAs, GaN, and SiGe, ensuring compatibility with a wide range of semiconductor processes. Designed with a focus on minimizing power loss and enhancing output signal, it is an ideal choice for devices requiring compact yet powerful amplifier solutions. The FCM1401 ensures that wearable technology and telecommunication devices benefit from extended battery life and improved performance. Designed with precision engineering, the FCM1401 can accommodate supply voltages from 1.6V to 2.0V without sacrificing operational efficiency. This flexibility allows for seamless integration into existing systems while also paving the way for advancements in wireless communication technology.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
These optical components serve as foundational elements for building advanced optical systems. Designed to offer flexibility and customization, the building blocks cover a spectrum of applications from simple optical connections to intricate network configurations. They are integral in streamlining the optical design process, providing reliable, high-performance solutions that are pre-tested to meet industry standards. Their adaptability makes them suitable for diverse application scenarios, pushing the boundaries of optical communication technologies.
Trimension SR250 is an innovative ultra-wideband solution designed for applications in industrial and IoT settings. It offers precise ranging capabilities and is an integral component in creating ultra-wideband-enabled devices and anchors. With the integration of both UWB ranging and radar technologies in a single chipset, the SR250 serves as a versatile tool in environments where precise location tracking and secure communications are necessary.
The ADQ7DC sets a high standard in digitization technologies, offering a sophisticated solution with a sampling rate of up to 10 GSPS and a 14-bit vertical resolution. This high-resolution mode can be adjusted between single-channel (10 GSPS) or dual-channel (5 GSPS) configurations, accommodating a wide variety of high-speed data acquisition requirements. Designed for flexibility and performance, the ADQ7DC features a DC-coupled front end with a 3 GHz input bandwidth, coupled with a programmable digital noise-reduction filter that enhances signal clarity and precision. Its comprehensive firmware options simplify setup and drastically shorten time-to-operation, delivering real-time features without needing significant FPGA programming expertise. Ideal for advanced scientific applications, including imaging flow cytometry and particle physics, the ADQ7DC excels in environments requiring meticulous data capture and analyses. Additionally, it offers robust connectivity through multiple form factors, such as PCIe and USB3.0, ensuring compatibility with a broad range of systems.
Hermes Layered is a sophisticated tool dedicated to 3D finite element method (FEM) simulation, aimed at IC, package, and PCB applications. This tool enhances the designer's ability to analyze complex electromagnetic interactions within layered structures. Its advanced simulation capabilities ensure that critical design metrics such as signal integrity and electromagnetic compatibility are thoroughly evaluated. The power of Hermes Layered lies in its ability to manage detailed simulations of multiple layers, essential in the design of high-performance ICs and advanced packaging systems. By providing designers with a thorough analysis of electromagnetic effects, Hermes Layered helps optimize designs to ensure both reliability and functionality. This tool is indispensable for those engaged in cutting-edge IC and PCB design, where the ability to predict and mitigate potential EM challenges can significantly impact the success of the final product. Hermes Layered offers precision and quality insights needed to meet the high demands of today's electronic systems.
InPsytech's ADC solutions include SAR, Pipeline, and SigmaDelta converters, catering to a variety of precision and high-speed conversion needs. These converters are integral in converting analog signals to digital form in a range of applications, from consumer electronics to high-precision instruments. The ADC solutions are designed to deliver accurate, fast results, essential for detailed signal processing tasks.
IRIS is a precision-engineered tool tailored for RF and analog IC simulation. Its primary purpose is to provide designers with accurate and fast electromagnetic simulations that are essential for crafting high-performance RF circuits and analog designs. With the growing demand for advanced radio frequency applications, IRIS serves as a vital resource for engineers aiming to push the boundaries of innovation. The tool boasts high fidelity in simulating RF and analog behaviors, catering to the need for precise modeling in frequency-dependent environments. IRIS allows engineers to evaluate various scenarios, ensuring device robustness and reliability when deployed in real-world applications. This foresight is particularly beneficial in rapidly evolving industries where technological superiority is a cornerstone of success. By facilitating comprehensive assessments, IRIS ensures that potential performance issues are identified and rectified early in the design process, thus securing a smoother path to production. The tool's efficient simulations make it indispensable for developers focused on cutting-edge RF and analog designs.
ViaExpert is tailored for intricate via modeling and simulation, offering precise analysis for systems requiring high-fidelity interconnects. As high-speed digital designs become increasingly prevalent, the accurate modeling of vias - essential pathways in an electronic design - becomes critical. ViaExpert provides the tools necessary to evaluate vias' electrical characteristics comprehensively, ensuring designs can accommodate desired performance levels. This tool addresses challenges in high-frequency environments by offering detailed simulations of via structures, facilitating seamless integration with overall circuit designs. The emphasis on accuracy helps designers mitigate potential signal integrity issues, such as reflection and crosstalk, which can arise in complex electronic systems. ViaExpert is particularly suited for engineers seeking precise interconnect modeling to ensure reliability and efficiency in design outcomes. Its advanced simulation capabilities support the creation of resilient and effective electronic systems, valuable for industries where performance cannot be compromised.
Moonstone is an advanced laser source offering both single and multi-wavelength capabilities. Crafted for high-power applications, this laser source stands out due to its compact structure and cost-effectiveness compared to traditional laser diode packages. It is crafted using a free-space optical assembly technique that integrates off-the-shelf laser chips with customized packaging for enhanced thermal control and coupling efficiency. With a design that allows a range of wavelengths, Moonstone supports various applications such as telecommunications, LIDAR, and data communication systems by providing a reliable and efficient source of laser power. The laser source's state-of-the-art packaging and precision engineering offer a micro-footprint, enabling its use in space-constrained environments with diverse operational specifications. Its role in driving forward optical computing and communication solutions is a testament to its versatility and pioneering design.
Trimension OL23D0 is tailored for UWB tag applications within industrial environments. The product is customizable with user-specific protocol stacks, enabling detailed and secure operations tailored to the specific needs of the deployment. The OL23D0 is exceptionally suited for environments that require scalable and reliable communication solutions, enhancing tracking capabilities and operational efficiency.
XDS offers a specialized platform for the design and simulation of RF and microwave circuits. Its precision-focused tools provide detailed insights into electromagnetic performance critical to the development of modern RF systems. XDS excels in modeling the complex interactions inherent in these high-frequency designs, facilitating optimized circuit performance and reliability. With its robust simulation capabilities, XDS empowers designers to visualize and address potential performance challenges before practical implementation. This foresight in design allows for the crafting of circuits that are not only efficient but also resilient to real-world interferences and stresses. Engineers utilizing XDS benefit from its ability to streamline the design process, reducing development time while enhancing product functionality and performance. The tool is a vital asset for those focused on advancing RF technologies and maintaining best-in-class standards in microwave circuit design.
Engineered for ultra-high-frequency performances, the FCM3801-BD amplifier offers unparalleled efficiency and gain at 38 GHz, marking it as a crucial component for future space and telecommunication advancements. This device capitalizes on the benefits of dual-drive architecture, offering a remarkable enhancement in performance metrics such as power-added efficiency (PAE) and overall output power. Bridging the gap between cutting-edge technology and practical application, this power amplifier facilitates reduced power demands, translating into lower operational costs for service operators and prolonged battery life for end devices. This commitment to energy efficiency helps reduce carbon emissions, aligning with global sustainability goals. Utilizing advanced semiconductor materials like GaN and GaAs among others, the FCM3801-BD is heralded for its toughness and adaptability to various environmental challenges, making it the ideal choice for rugged and demanding operational scenarios. Those in need of robust yet efficient solutions will find the FCM3801-BD to meet and exceed requirements with its groundbreaking design. Its reduced silicon footprint contributes significantly to scalability in various configurations.
Notus provides a comprehensive platform for SI/PI, thermal, and stress analysis, crucial for engineers striving to optimize electronic circuit performance under various environmental conditions. Integrating signal integrity, power integrity, and multi-physics simulation within a single tool, Notus offers unmatched analytical capabilities that ensure designs meet rigorous operational standards. Designed to tackle complex simulations, Notus helps in identifying potential problems before they become costly failures. Its detailed analyses encompass a range of scenarios, aiding in the prediction and enhancement of circuit reliability and longevity. This integrated approach supports forward-thinking design strategies that are essential in today's competitive electronics marketplace. Notus enhances productivity by simplifying the design process and reducing the need for multiple software tools, thereby accelerating time-to-market. The powerful simulations it provides are indispensable for engineers working on high-stakes projects where precision and reliability are non-negotiable.
ChannelExpert is a high-speed system simulation platform specifically designed for assessing signal integrity and power integrity in complex electronic architectures. It stands out for its capacity to simulate entire systems, providing comprehensive insights that are invaluable during the design phase of high-frequency, high-speed circuits. This platform caters to the challenges of modern electronic environments where data throughput and speed are critical success factors. By enabling the simulation of various operational scenarios, ChannelExpert assists designers in predicting system behavior accurately, ensuring robust performance and integrity under demanding conditions. ChannelExpert's advanced features include detailed analytical tools that support system optimization, fostering the development of products that can thrive in today's fast-paced technological landscape. It is an essential tool for engineers dedicated to creating high-performance electronic systems with minimal signal interference and maximum throughput.
The EVIYOS HD 25 gen1 represents a groundbreaking approach to smart headlamp design, offering an impressive 25,600 individually controllable pixels for finely-tuned illumination control. This technology caters to high-resolution adaptive driving beam systems and road signal projection, promoting both driver safety and enhanced visual communication. The EVIYOS system is delivered as a full set with a companion ASIC, ensuring optimized integration and functionality.
Metis stands as a powerful solution designed for tackling the complexities of 2.5D/3D IC packaging. Tailored to support the analysis of multi-die integration, Metis provides comprehensive simulation capabilities essential for modern IC design requirements. As the industry moves towards more compact and complex packaging, Metis plays a pivotal role in ensuring that these designs meet the necessary criteria for SI/PI performance and thermal management. What sets Metis apart is its extensive capacity to handle large-scale simulations, enabling designers to model and evaluate the electromagnetic interactions within densely packed IC assemblies. This capability is crucial in maintaining signal integrity and power integrity, which are often the bedrock of functional and reliable electronic systems. Metis supports the development of advanced IC packaging solutions by offering detailed visualizations and simulation insights, empowering engineers to address critical design challenges proactively. Its role in optimizing packaging solutions ensures that products not only meet but exceed industry standards for performance and reliability.
The RF-SOI and RF-CMOS platforms offered by Tower Semiconductor are engineered to deliver exceptional performance for wireless communication applications. This platform is designed to address the needs of high-frequency and low-power RF applications essential for modern telecommunications, including 5G, IoT devices, and other consumer electronics requiring seamless connectivity. By leveraging RF-SOI technology, the platform achieves lower power consumption and improved integration of RF components, thereby enhancing system performance and reducing overall product costs. RF-CMOS adds to this by providing flexibility in designing integrated circuits that need both analog and digital components on a single chip, useful for space-constrained applications without sacrificing performance. These platforms support a wide bandwidth spectrum and high dynamic range, making them ideal for high-speed data transfer applications. With advanced design enablement support such as comprehensive PDKs and simulation tools, the RF-SOI and RF-CMOS platforms facilitate quick adaptation and integration into existing product lines, accelerating the development process of cutting-edge wireless solutions.
Trimension SR150 is crafted for the industrial and IoT sectors, providing a UWB solution enhanced with FiRa protocol technologies. This product is pre-installed with various stacks, making it ideal for supporting UWB devices and anchors. Key applications include secure indoor positioning and device-to-device communication, benefiting from its high accuracy and reliability in dense environments.
Vantablack S-VIS is a state-of-the-art material specifically engineered for use in space applications. It is distinguished by its ability to significantly reduce stray light in optical instruments, enhancing the calibration of IR camera systems. Vantablack S-VIS coatings provide a high-performance solution with spectrally flat absorption capabilities that range from the ultraviolet to near-millimeter spectral areas. In the challenging environment of space, these coatings help streamline instrument design by reducing size and weight while maintaining exceptional light absorption and high emissivity.
The VibroSense AI Chip is tailored for vibration analysis applications, providing ultra-low power neuromorphic processing capabilities to industrial IoT systems. This chip excels in converting complex vibration data into manageable patterns, facilitating efficient local processing and dramatically reducing data transfer volumes. It is especially valuable in applications such as tire and machine health monitoring, where real-time data analysis can significantly enhance safety and maintenance efficiency. VibroSense enables direct on-sensor preprocessing, transforming high-frequency vibration signals into concise data sets for further evaluation. This not only diminishes the data load on network systems but also supports long-distance, low-bandwidth communications crucial for remote monitoring tasks. Implementing VibroSense in road condition monitoring for automotive applications ensures quick and precise feedback to advanced driver assistance systems, contributing to improved vehicular safety. The chip's ability to predict maintenance needs through vibration-based monitoring makes it a powerful tool in industrial applications. By analyzing vibrations, it can detect potential machinery issues, thus optimizing operational uptime and reducing maintenance costs. The VibroSense chip's integration encourages the development of energy-efficient, reliable predictive maintenance solutions in complex industrial settings.
The WiFi6, LTE, and 5G Front-End Module is an advanced integrated solution for modern telecommunications, covering frequency bands at 2.4 GHz and 5-7 GHz. This module incorporates key features such as switches, low-noise amplifiers (LNAs), and power amplifiers (PAs) to deliver high performance for wireless connectivity systems. Designed to enhance the data throughput and range of devices, it plays a crucial role in enabling seamless connectivity for smartphones, tablets, and other IoT devices. Its robust construction ensures high linearity and low distortion across a wide frequency range, making it ideal for high-speed communication and data-intensive applications. Supporting WiFi6, LTE, and emerging 5G technologies, this module is critical for next-generation wireless infrastructure, providing reliable and efficient signal amplification and processing.
The 28GHz Pin Diode SP4T Switch serves as a critical component for systems requiring reliable switching capabilities at high frequencies. Operating between 24 to 32GHz, this switch provides low insertion loss of approximately 0.8dB while maintaining an isolation greater than 23dB. Such characteristics make it ideal for use in applications like phased array antennas and frequency routing within RF signal chains. The efficiency of design ensures minimal signal degradation across the frequency band, supporting high-performance outcomes in commercial and defense communication systems.
The CC-205 Wideband CMOS Rectifier is designed for seamless integration with antennas, required for full or half-wave rectification. Its engineering ensures minimal signal reflection with an impressive low S11 return loss of -40dB, allowing efficient power transfer and utilization. This component excels in reducing the complexity of RF designs by eliminating the need for additional matching networks, thus streamlining the signal management process. It's crafted for applications demanding highly efficient power handling from RF inputs, marking its place in advanced communication systems searching for top-tier performance.
Specializing in high-frequency amplification, the Dual-Drive™ Power Amplifier FCM2801-BD operates at 28 GHz and offers state-of-the-art signal amplification. It brings unprecedented efficiency to mmWave applications, perfect for 5G networks and other advanced wireless technologies. With its dual-drive architecture, this amplifier achieves a groundbreaking efficiency of 70% at the device output, solidifying its place as a leader in next-generation communication infrastructure. With a focus on delivering high output while maintaining energy efficiency, the FCM2801-BD amplifier significantly reduces both operational costs and environmental impact by minimizing energy usage. This amplifier's ability to maintain robust performance with reduced silicon area—nearly halving traditional layouts—underscores its innovative design. The high efficiency allows for extended device operation, particularly benefiting telecommunications devices that require longer battery life. Its compatibility with multiple semiconductor platforms, including GaN, GaAs, CMOS, and SiGe, further extends its versatility and application scope. This power amplifier is ideally suited for telecommunication and space communication fields, where enhancing signal range and reducing power consumption remain paramount.
SnpExpert is a dedicated platform designed for in-depth S-parameter analysis, which is vital in understanding the behavior of RF and high-speed digital circuits. By providing an unparalleled view of network parameters, this tool helps engineers ensure that designs will perform as expected across different frequencies and scenarios. The precision and clarity offered by SnpExpert simplify the analysis of complex interactions within electronic systems, allowing for efficient troubleshooting and optimization. This feature is particularly valuable when modifications are needed to enhance circuit performance, enabling refined design choices that foster innovation and reliability. SnpExpert's robust analytical capabilities make it an essential tool for tackling the intricate challenges associated with RF design and testing. Its insights into S-parameter metrics enable designers to achieve the optimal performance required in today's demanding technological landscape.
Trimension NCJ29D6 is a UWB technology solution particularly used in the automotive field, serving applications such as secure car access and presence detection. It is compliant with CCC and FiRa standards, ensuring compatibility with industry protocols. The NCJ29D6 supports a wide range of automotive systems, facilitating advanced functionalities like gesture detection and seamless entry experiences.
Yuzhen 600 is an advanced RFID chip designed to enhance logistics and inventory management with its high precision and efficiency. T-Head's Yuzhen 600 features cutting-edge RFID technology that allows accurate tracking and communication over extended ranges while maintaining low power consumption. This RFID chip is built to operate efficiently within complex industrial environments, offering reliable data transmission and storage capabilities. Ideal for real-time inventory tracking, the Yuzhen 600 provides robust support for supply chain management, significantly streamlining operations. Enhanced with T-Head's proprietary technology, the Yuzhen 600 outperforms typical RFID solutions in terms of signal strength and durability, thus ensuring precise operation even in challenging conditions. Its integration capacity with existing systems enables seamless adoption and optimization of logistics operations.
ArrayNav is an innovative GNSS solution that applies multiple antennas to significantly improve signal sensitivity and accuracy. This advanced technology is an adaptation from the communication sector’s use of MIMO, tailored to address GNSS challenges like multipath errors and potential signal jamming. By employing a diversified antenna setup, ArrayNav enhances signal gain and diversity, achieving higher accuracy, especially in environments prone to signal degradation such as urban canyons. The multi-antenna approach allows for distinct identification and suppression of interfering signals, including those used for spoofing or jamming, by analyzing their unique signatures. The system effectively places null signals in the direction of such disturbances, maintaining the reliability and precision of positioning data. This makes ArrayNav particularly beneficial for applications reliant on sub-meter accuracy and quick acquisition. ArrayNav’s patented capabilities ensure robust GNSS performance, even in constrained environments, by boosting channel gain by 6 to 18 dB. This gain significantly improves operational efficacy in various applications, from automotive advanced driver-assist systems (ADAS) to personal navigation devices, ensuring dependable operation no matter the surroundings.
D2D®, or Direct-to-Data, is a patented RF conversion technology that redefined RF downconversion processes, a staple in RF signal processing for nearly a century. By spearheading the RF energy transfer sampling approach, ParkerVision has developed an RF downconverter replacing traditional methods, thus reshaping RF device efficiency and performance. The technology enables today's smartphones and other wireless devices to achieve unprecedented data speeds, enhancing user experience significantly. The D2D technology guarantees low-cost chip manufacturing with minimal power usage, covering worldwide radio frequency bands and processing high data rates, crucial for video streaming and data-intensive tasks. By reducing redundancy, the technology allows for silicon footprint reduction and improved dynamic range, translating to fewer additional components like resonant structures. ParkerVision's D2D® serves as a linchpin in modern RF receivers, supporting seamless integration with other essential smartphone technologies, thereby driving the evolution and success of smartphones. This innovation integrates advanced RF capabilities, ensuring robust and reliable connectivity in diverse scenarios, reinforcing the synergy of mobile computing technologies.
The L1 Band GNSS Transceiver Core is specially adapted for precision location and navigation applications. It supports a wide array of GNSS signals, including the GPS and GLONASS systems. This core is designed to deliver exceptional performance in real-time positioning and tracking, making it ideal for use in various commercial and military applications that require dependable GNSS solutions. It is optimized to provide robust performance in challenging environments such as urban canyons, enhancing its utility in dense metropolitan areas. Furthermore, the transceiver core integrates sophisticated signal processing capabilities, ensuring it can handle multiple signal reception and processing with high efficiency. Users benefit from its versatility and capability to quickly adapt to different GNSS bands, including L1, L2, and L5, enhancing the system's overall accuracy and reliability in delivering precise time and location data. The core's design leverages advanced semiconductor technologies to minimize power consumption and support prolonged operation in mobile devices or field applications. The compact nature of the design allows for seamless integration into existing systems, providing a significant competitive advantage in delivering state-of-the-art GNSS functionalities.
The PCS1100 is an advanced Wi-Fi 6E transceiver chip by Palma Ceia SemiDesign. Engineered for use in Wi-Fi 6 networks, it supports the IEEE 802.11ax standard, facilitating high-speed wireless communication in both Access Point (AP) and Station (STA) configurations. Its robust RF architecture is optimized for tri-band operation, covering 2.4 GHz, 5 GHz, and 6 GHz frequency bands, which is essential for modern, high-density environments. This transceiver supports multiple spatial streams up to 4x4 and employs advanced features like MU-MIMO and OFDMA, providing increased throughput and efficiency across congested networks. With capabilities such as dual-band concurrent operation and 1024-QAM modulation, the PCS1100 ensures high performance and reliability, making it ideal for environments ranging from smart homes to large public venues. The PCS1100 also features a compact design suitable for integration into various systems, including ASICs and ASSPs, enhancing its versatility in different technological setups. It offers connectivity and ease of integration with its analog I/Q interface and chip-to-chip communication via SerDes link.
Enosemi's photonic subsystems offer a comprehensive platform for deploying optical circuits in various high-tech applications. Designed for integration into larger systems, these subsystems enhance the overall functionality and performance of photonic infrastructures. They incorporate high-efficiency components that deliver precision and stability required for demanding environments, such as telecommunications and data centers. The subsystems are built with a keen focus on reducing the time-to-market while improving system reliability and operational efficiency.