All IPs > Analog & Mixed Signal > Photonics
Photonics semiconductor IPs play a vital role in the ever-growing field of optical technologies and integrated communications. As the demand for faster and more reliable communication networks increases, these IPs provide essential functionalities that help optimize the performance of optical systems. At Silicon Hub, we offer a comprehensive collection of photonics IPs that cater to a variety of applications including data transmission, sensor technology, and integrated photonic circuits. These IPs are designed to meet the rigorous demands of modern communication systems and facilitate the development of advanced technological solutions.
Photonics IPs are crucial for enabling photon management and manipulation, allowing designers to capitalize on the benefits of light as a carrier of information. This category includes a variety of IP cores such as modulators, detectors, and laser drivers, all tailored to improve the efficiency and performance of optical communication links. By leveraging these technologies, developers can create innovative products that deliver higher bandwidth, lower power consumption, and enhanced signal integrity, essential for applications such as data centers, telecommunications, and fiber-optic networks.
Integrated photonic circuits (IPCs) are another key application area for photonics semiconductor IPs. These IPCs combine multiple photonic functionalities into a single chip, offering significant advantages in terms of miniaturization, performance, and cost-effectiveness. Photonics IPs provide the building blocks necessary for the integration of components like waveguides, modulators, and amplifiers, ensuring seamless interconnection and interaction of optical signals on a compact platform. As a result, IPCs are driving innovations in fields such as quantum computing, biosensing, and lidar technologies.
In addition to communications and sensors, photonics semiconductor IPs are used in a diverse range of technologies, from healthcare to automotive industries. They are integral to developing systems that require precise light manipulation and measurement capabilities. Our category at Silicon Hub ensures that you have access to state-of-the-art photonics IPs that help transform your ideas into reality, enhancing productivity and enabling you to keep pace with the rapid technological advancements in the digital age. Explore our offerings today and discover how photonics semiconductor IPs can redefine your next project.
Hermes 3D is crafted for the simulation of arbitrary 3D structures, offering unparalleled insights into electromagnetic performance across a variety of applications. Its core strength lies in providing high-precision FEM simulations that support the evaluation of complex geometrical designs typical in today's advanced electronic circuits. Hermes 3D empowers engineers with the capability to investigate and optimize diverse electromagnetic interactions within detailed 3D structures. This function is particularly essential when working with components that require precise behavior predictions under various operational conditions, ensuring that systems maintain their integrity and performance over time. By facilitating rigorous analysis, Hermes 3D aids in reducing costly design iterations and enhances efficiency in the product development cycle. Its application in arbitrary structural simulations makes it an essential tool for any designer seeking to ensure their systems are both innovative and reliable.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
The MVUM1000 ultrasound sensor array is highly specialized for medical imaging applications, offering a 256-element linear array formation. Employing capacitive micromachined ultrasound transducers (CMUT), it ensures superior sensitivity and integrability with modern interface electronics. This ultrasound sensor caters specifically to medical imaging, facilitating real-time diagnosis with applications in point-of-care and handheld devices. The use of capacitive transduction enables high sensitivity to acoustic pressure while maintaining minimal power consumption, an advantage in power-sensitive applications. Equipped with integrated front-end electronics, the MVUM1000 supports multiple imaging modes. The sensor's compact, yet highly efficient design ensures it meets the stringent needs of modern medical equipment while offering customization opportunities for specific technological demands.
The 3D Imaging Chip from Altek Corporation is engineered to cater to the rising demand for sophisticated depth-sensing technologies. This chip is designed to enhance perception capabilities, making it essential for applications that require precision in spatial awareness such as robotics and security systems. It utilizes years of research in 3D sensing to deliver robust and versatile modules that can be tailored for surveillance drones, transport robots, and other medium to long-range detection needs. Integrating both software and hardware seamlessly, the 3D Imaging Chip offers improved recognition accuracy which is crucial for automated systems operating in dynamic environments. This is achieved by leveraging Altek's proprietary depth-sensing algorithms that enhance image clarity and focus stability across various lighting conditions. Its compact form factor makes it suitable for a broad range of portable devices. The solution is pivotal for industries seeking high-performance imaging solutions that can adapt to varying operational requirements. With its enhanced depth-sensing capabilities, the 3D Imaging Chip not only meets but exceeds the critical demands of rapid recognition and accuracy required in advanced automation and control scenarios. Altek's focus on integration from modules to chips allows for a cohesive system that is easy to implement into existing infrastructures, providing clients with a reliable tool to elevate their imaging challenges.
The aLFA-C is a versatile interfacing ASIC specifically engineered for infrared ROICs typically utilized in space applications. This device significantly replaces traditional front-end electronics infrastructure by incorporating advanced features. Designed to operate with minimal power requirements, it leverages on-chip LDOs and regulators, allowing the device to function on a single unregulated power supply. User-friendly interfaces such as SpaceWire enhance connectivity, while a fully programmable ROIC sequencer with multiple levels of nesting allows dynamic reprogramming.\n\nThe aLFA-C accommodates a wide range of input and output configurations with its 32 programmable digital outputs and 16 digital inputs, supporting differential and single-ended formats in CMOS or LVDS. It integrates a robust SPI interface alongside comprehensive analog acquisition capabilities through its numerous ADC channels. The device ensures precise control and measurement with its programmable gain and offset features, complemented by current biasing adjustments.\n\nThis ASIC is targeted towards critical environments offered by its resilience to radiation and extreme temperatures, facilitating reliable operations from deep cryogenic to high-temperature environments. With features tailored for adaptability, the aLFA-C proves indispensable in mission-critical sensor applications, enabling high precision and integration in space technology systems.
IRIS is a precision-engineered tool tailored for RF and analog IC simulation. Its primary purpose is to provide designers with accurate and fast electromagnetic simulations that are essential for crafting high-performance RF circuits and analog designs. With the growing demand for advanced radio frequency applications, IRIS serves as a vital resource for engineers aiming to push the boundaries of innovation. The tool boasts high fidelity in simulating RF and analog behaviors, catering to the need for precise modeling in frequency-dependent environments. IRIS allows engineers to evaluate various scenarios, ensuring device robustness and reliability when deployed in real-world applications. This foresight is particularly beneficial in rapidly evolving industries where technological superiority is a cornerstone of success. By facilitating comprehensive assessments, IRIS ensures that potential performance issues are identified and rectified early in the design process, thus securing a smoother path to production. The tool's efficient simulations make it indispensable for developers focused on cutting-edge RF and analog designs.
Moonstone is an advanced laser source offering both single and multi-wavelength capabilities. Crafted for high-power applications, this laser source stands out due to its compact structure and cost-effectiveness compared to traditional laser diode packages. It is crafted using a free-space optical assembly technique that integrates off-the-shelf laser chips with customized packaging for enhanced thermal control and coupling efficiency. With a design that allows a range of wavelengths, Moonstone supports various applications such as telecommunications, LIDAR, and data communication systems by providing a reliable and efficient source of laser power. The laser source's state-of-the-art packaging and precision engineering offer a micro-footprint, enabling its use in space-constrained environments with diverse operational specifications. Its role in driving forward optical computing and communication solutions is a testament to its versatility and pioneering design.
XDS offers a specialized platform for the design and simulation of RF and microwave circuits. Its precision-focused tools provide detailed insights into electromagnetic performance critical to the development of modern RF systems. XDS excels in modeling the complex interactions inherent in these high-frequency designs, facilitating optimized circuit performance and reliability. With its robust simulation capabilities, XDS empowers designers to visualize and address potential performance challenges before practical implementation. This foresight in design allows for the crafting of circuits that are not only efficient but also resilient to real-world interferences and stresses. Engineers utilizing XDS benefit from its ability to streamline the design process, reducing development time while enhancing product functionality and performance. The tool is a vital asset for those focused on advancing RF technologies and maintaining best-in-class standards in microwave circuit design.
This system focuses on ensuring proper alignment and compatibility for wireless power transfer. By employing advanced sensing techniques, it identifies and corrects misalignment issues, thus maintaining efficient power transfer and reducing the risk of performance degradation. This technology is particularly valuable in dynamic environments such as automotive systems where precise positioning and stable connections are critical for operational reliability.
This technology involves the transfer of energy without using wires, utilizing resonant magnetic fields. It's a key innovation for wireless charging, offering convenience and efficiency without the usual conductive cables. Ideal for applications where physical connectivity is impractical, this type of energy transfer supports multiple devices and configurations, ensuring adaptability across various platforms.
The Bioptx Biosensing Band and Platform represents a significant leap in non-invasive health monitoring technology. This platform integrates Rockley’s groundbreaking biosensing capabilities into a wearable form, utilizing short-wave infrared (SWIR) laser-based spectroscopy coupled with conventional methods. With the ability to continuously monitor key health metrics such as body temperature, hydration levels, heart rate, and blood oxygen saturation, the Bioptx platform sets new standards in real-time physiological monitoring. Built on Rockley’s photonic integrated circuit (PIC) technology, it allows for precise measurements and diverse application possibilities in both consumer health and professional medical contexts. The combination of SWIR technology with a cloud-based Developer API empowers developers to unlock further potential through seamless data integration and analysis. This innovation facilitates a holistic view of an individual's health, providing real-time insights to enhance personalized medicine approaches. The device is engineered to be wearable comfortably over extended periods, enabling the continuous collection and streaming of vital biometric data. Its portability and accuracy make it an invaluable tool for monitoring both acute and chronic health conditions, supporting wellness in everyday life and in more specialized health management settings.
SnpExpert is a dedicated platform designed for in-depth S-parameter analysis, which is vital in understanding the behavior of RF and high-speed digital circuits. By providing an unparalleled view of network parameters, this tool helps engineers ensure that designs will perform as expected across different frequencies and scenarios. The precision and clarity offered by SnpExpert simplify the analysis of complex interactions within electronic systems, allowing for efficient troubleshooting and optimization. This feature is particularly valuable when modifications are needed to enhance circuit performance, enabling refined design choices that foster innovation and reliability. SnpExpert's robust analytical capabilities make it an essential tool for tackling the intricate challenges associated with RF design and testing. Its insights into S-parameter metrics enable designers to achieve the optimal performance required in today's demanding technological landscape.
Yuzhen 600 is an advanced RFID chip designed to enhance logistics and inventory management with its high precision and efficiency. T-Head's Yuzhen 600 features cutting-edge RFID technology that allows accurate tracking and communication over extended ranges while maintaining low power consumption. This RFID chip is built to operate efficiently within complex industrial environments, offering reliable data transmission and storage capabilities. Ideal for real-time inventory tracking, the Yuzhen 600 provides robust support for supply chain management, significantly streamlining operations. Enhanced with T-Head's proprietary technology, the Yuzhen 600 outperforms typical RFID solutions in terms of signal strength and durability, thus ensuring precise operation even in challenging conditions. Its integration capacity with existing systems enables seamless adoption and optimization of logistics operations.
DigiLens offers advanced waveguide optics tailored for extended reality (XR) and augmented reality (AR) applications. Leveraging state-of-the-art materials and manufacturing processes, these waveguides provide high transmission rates exceeding 90% while maintaining a thin profile of less than 1.2 mm. Designed for both consumer and enterprise use, they exhibit superior brightness and resolution without compromising on eye comfort or social acceptability. Innovation is a hallmark of DigiLens's waveguides, marked by minimal eye glow, which ensures that the user's eyes are visible while minimizing distractions in various lighting conditions. The company's proprietary photopolymer material combined with precise inkjet printing techniques enables scalable production, making these waveguides suitable for a wide range of applications from gaming to professional use. The optical efficiency, averaging over 350 nits/lumen across the full field of view, makes these waveguides ideal for high-performance scenarios. Their adaptability and lightweight nature bring unprecedented flexibility to AR smartglasses, heralding a future where wearable tech seamlessly integrates with daily life. By focusing on the intersection of technology and design, DigiLens's waveguides represent a significant leap forward in reducing manufacturing costs while delivering premium AR experiences.
The Multi-Channel Silicon Photonic Chipset is an advanced solution designed for high-speed data transmission with enhanced performance characteristics. This chipset employs a unique hybrid integration of III-V Distributed Feedback (DFB) lasers and electro-absorption modulators, tailored to meet the stringent demands of modern communication standards, especially for data rates up to 400 Gbps. Each channel within the chipset achieves high extinction ratios and optimal optical modulation amplitude (OMA), ensuring low Transmission Dispersion Eye Closure Quotation (TDECQ) penalties. Adhering fully to IEEE standards, it supports extensive data transmission over vast networks, demonstrating the robustness and flexibility needed for both telecommunication and data center applications. This chipset is notable not only for its high data throughput capabilities but also for its ability to maintain performance consistency across multiple channels simultaneously. Deployed within systems requiring efficient and reliable optical communications, the Multi-Channel Silicon Photonic Chipset supports the growing needs of high-bandwidth applications, playing a crucial role in evolving network architectures.
Polar ID is a revolutionary face authentication system that leverages advanced meta-optic technology. Designed for smartphone integration, this system captures the polarization signature of a human face, providing a new layer of biometric security. The system's high resolution surpasses conventional methods, ensuring robust performance even with partial obstructions like sunglasses or masks. By operating within the near-infrared spectrum, Polar ID maintains accuracy across diverse lighting conditions, presenting a versatile solution for secure digital interactions. This system eliminates the need for complex optical modules traditionally used in face authentication, such as structured light systems. Polar ID provides substantial reductions in the component size and cost, enabling widespread implementation even in modestly priced devices. This bio-authentication technology is powered by a near-infrared polarization camera and an active illuminator, ensuring secure user identification. The Polar ID's integration with advanced Snapdragon platforms further enhances its capabilities, delivering a seamless experience for manufacturers and end users. By offering superior security at a lower price point, Polar ID paves the way for comprehensive facial recognition capabilities across a wide range of devices, pushing the boundaries of user convenience and security.
This technology utilizes enhancements to manage interference, ensuring efficient energy transfer even in environments with potential electromagnetic disturbances. By refining the way energy is transferred, this solution maximizes efficiency while maintaining high levels of safety and performance. It is particularly beneficial in complex settings where multiple devices or systems could potentially interfere with each other.
The Orion Family of Pattern Projectors represents Metalenz's cutting-edge solutions for 3D depth sensing in various applications, including smartphones, AR/VR devices, and industrial robotics. These projectors are renowned for their compact size and high performance, utilizing an ultra-wide field of illumination to generate accurate dot and line patterns. With Metalenz's patented meta-optic technology, the projectors convert light emitted from laser arrays into high-contrast patterns, maximizing light efficiency and reliability across conditions. Orion Pattern Projectors stand out due to their ability to replace traditional multi-lens assemblies with a single meta-optic surface, significantly reducing optical module complexity and assembly costs. This innovation not only enhances performance but also streamlines the integration process into diverse platforms — from mobile to automotive. The projectors boast industry-leading characteristics such as the Orion 18K, which offers extensive dot patterns at low power consumption and high precision, ideal for structured light applications needing stability under varying climates and environments. Additionally, the compact design facilitates applications where space constraints are critical, making these projectors highly adaptable in emerging technological landscapes.
CML Microsystems' SµRF MMICs are cutting-edge high-frequency, high-bandwidth semiconductor products designed for RF and mmWave applications. These devices are tailored to support burgeoning markets like 5G, satellite communications, and the Internet of Things (IoT). They offer superior performance in operation frequency ranges that meet the exacting demands of modern communication infrastructures. The MMICs are engineered to drive advancements in wireless communication by providing highly efficient signal processing capabilities. This suite of products ensures seamless integration into network architectures, facilitating enhanced data transmission and reception. As such, they play a critical role in supporting the reliable and efficient functioning of complex communication systems. Highly suitable for applications requiring robust and dynamic RF solutions, these MMICs address the significant technological demands of network providers and manufacturers. Through leveraging their high-frequency processing capabilities, CML Microsystems enables its customers to build next-generation communication solutions that are pivotal for future connectivity.
The High-Performance Photonic Interconnect is designed to facilitate rapid data transfer across optical interconnections. This makes it ideal for high-speed networking environments where low latency and high bandwidth are critical. By utilizing advanced photonic technologies, the interconnect achieves exceptional data rates while maintaining energy efficiency, essential for data centers and telecommunication networks. It aims to optimize optical data links, providing improved performance over traditional electronic interconnects. Its integration into systems is seamless, offering compatibility with existing infrastructure. Adaptable to varying requirements, it supports a range of configurations to suit specific needs in data-intensive applications. The interconnect’s design emphasizes modularity and scalability, making it a future-proof solution capable of evolving alongside emerging technologies. Whether in cloud computing, enterprise environments, or telecommunication applications, the High-Performance Photonic Interconnect offers an unmatched blend of speed, reliability, and efficiency.
The ARINC 818-2 IP Core by iWave is designed to facilitate high-speed, low latency video transmission, compliant with the ARINC 818-2 specifications. This IP core is suitable for both transmitting and receiving high-definition video over transceiver-based FPGA devices. Not limited to video data, it can handle audio and other data transmissions, especially during video blanking periods. Utilizing a simple streaming interface, it seamlessly integrates with various video and image processing IPs from major FPGA vendors.\n\nThis IP core supports a range of configurable Advanced Data Video Bus (ADVB) formats, allowing it to adapt to different video processing needs. It can handle various link rates ranging from 1x to 12x, and supports resolutions up to 4K at 60 frames per second in both progressive and interlaced scan formats. Thus, it is tailored to meet a wide array of high-resolution application requirements.\n\nThe core's flexibility also extends to its support for multiple pixel formats including monochrome, RGB, and YCbCr, as well as its ability to adapt to different video aspect ratios. Furthermore, its customizable parameters enable alignment with specific interface control documents (ICDs), ensuring it can be delivered swiftly – typically within a three to four week timeframe. These attributes make it an invaluable asset for avionics video applications.
The ARINC 818-3 IP Core offers significant upgrades over its predecessor, primarily aimed at enhancing data transmission rates and video encoding capabilities. Designed for high-resolution real-time video applications in avionics, it supports data rates up to 28Gbps, employing 64B/66B encoding schemes. This IP core also addresses previous revisions by introducing low latency video processing guidelines and enhanced error correction features.\n\nConforming to the ARINC 818-3 specification, this core accommodates a simple streaming interface for both transmission and reception of video, and supports progressive as well as interlaced video types. Its flexibility allows customization of pixel formats and frame rates to cater to various high-speed ARINC video applications. Supported video resolution scales up to 4K at 60fps, providing crystal-clear video output suitable for critical avionics needs.\n\nThe ARINC 818-3 IP Core integrates well with optical transmission mediums, offering reliable data transmission over fiber channels. Additionally, it incorporates features for pixel aspect ratio configuration, further demonstrating its capability to manage diverse video processing tasks efficiently. This level of flexibility positions it as a key component in modern avionics systems requiring robust video transmission.
The UWB Impulse Radar Toolkit provides a comprehensive suite of components for developing ultra-wideband (UWB) radar applications. Known for their high precision and penetrating capabilities, UWB radars are ideal for applications ranging from subterranean exploration to secure communications. This toolkit includes various software and hardware modules that facilitate the rapid development and testing of UWB systems. The advanced capabilities of the toolkit enable users to implement precise localization and imaging techniques, making it indispensable for researchers and developers working in advanced radar domains.
The ARINC 818 Switch IP Core is engineered to address the increasing demand for versatile video switching in avionics systems. Built to manage up to 12 ARINC 818 channels, this IP core excels in various switching modes including broadcast, unicast, multicast, and mixed modes, ensuring comprehensive control over video and data routes.\n\nCompliant with the ARINC 818-2 standards, the switch utilizes a simple streaming interface accommodating a wide array of video outputs, which can be managed through intelligent synchronous switching. It supports multiple link rates up to 4x, offering flexibility for video signal routing in complex avionics environments. The switch can operate over optical transmission media or using copper interfaces, depending on the system requirements.\n\nUnique to this switch is its ability to perform real-time link control and monitoring via an AXI-4 lite interface, enhancing operational efficiency. The hardware implementation allows for quick adaptation according to specific interface control document (ICD) requirements, typically within a 3-4 week delivery window, providing significant agility to meet evolving system demands.