All IPs > Analog & Mixed Signal > Oversampling Modulator
The Oversampling Modulator category within Silicon Hub's Analog & Mixed Signal section houses a comprehensive range of semiconductor IPs specially designed to improve signal resolution and processing in high-performance integrated circuits. These IP solutions are integral in the conversion of analog signals into digital formats, utilizing advanced techniques to achieve superior resolution and reduce quantization noise. An oversampling modulator essentially increases the signal-to-noise ratio (SNR) by sampling the signal at a higher rate than the Nyquist frequency, which is paramount for applications requiring high fidelity data conversion.
Oversampling modulators are a critical component in the design and development of devices that demand precise digital representation of analog inputs, such as in high-end audio equipment, instrumentation, and communications systems. These systems often require robust performance characteristics to handle complex signals with minimal distortion and loss. By utilizing semiconductor IPs in this category, developers can streamline their design process, reduce time-to-market, and optimize the performance of their signal processing applications.
In products ranging from digital audio converters to advanced communication transceivers, oversampling modulator semiconductor IPs provide the necessary tools for achieving precise analog-to-digital and digital-to-analog conversion, while maintaining data integrity. They are particularly useful in applications that necessitate the suppression of noise and the enhancement of dynamic range, where audio and data quality are paramount. In addition, these modulators can also play a role in reducing system power consumption, thus contributing to the development of energy-efficient solutions.
Our selection of oversampling modulator semiconductor IPs at Silicon Hub caters to a broad spectrum of needs within various industries. Whether you are developing consumer electronics, automotive systems, or medical devices, our library of IPs offers versatile solutions capable of adapting to the unique requirements of specialized applications. Empower your development projects with our state-of-the-art modulator IP offerings to ensure exceptional signal processing and conversion capabilities in your innovative designs.
Designed for high-speed transmission, the 16x112G Tx Chiplet showcases superior integration with 16 channels, each operating at 112Gbps. It includes a modulator and driver within a single silicon unit, optimized for optical communication systems requiring high-speed, high-bandwidth data transfer. This sophisticated chiplet ensures seamless modulation of optical signals, supporting efficient driver control and optimized data transmission. The integrated design simplifies system architecture, reducing the overall footprint while maintaining exceptional reliability and performance. Its built-in digital control aids in managing complex signal processing requirements, suitable for diverse applications within optical networking infrastructures. Verifying its design through silicon-proven processes assures users of its capability to meet rigorous industry standards. The application of this chiplet spans high-speed data centers, telecommunications networks, and beyond, where its efficiency and performance are indispensable. The innovation behind its creation reflects Enosemi's dedication to advancing optical technology, offering clients robust and reliable tools to meet current and future communication needs.
The TW330 Image Warping IP utilizes advanced GPU processing technology to offer high-performance image distortion correction. It features extensive capabilities including coordinate transformation, any-shape image transformations, and supports resolutions up to 16K x 16K for both RGB and YUV formats. Ideal for digitally correcting images distorted by wide-angle or fish-eye lenses on various devices, this technology is key in fields such as automotive display systems, VR/AR devices, and high-definition projectors. It makes real-time, on-the-fly image correction feasible, elevating the quality of visual outputs for demanding applications. Through its flexible and efficient design, TW330 enables seamless integration into systems requiring dynamic and precise image modification capabilities, paving the way for developing more interactive and immersive visual experiences.
The 3D Imaging Chip developed by Altek is a remarkable example of cutting-edge imaging technology, tailored to meet the evolving needs of industries that require three-dimensional image capture. This chip is designed to provide high-resolution 3D images, making it ideal for applications in areas such as augmented reality, virtual reality, and industrial automation. The chip integrates advanced depth-sensing capabilities, ensuring that it can capture intricate details with high fidelity. This feature is particularly beneficial for tasks that require precise measurements and accurate representations of spatial relationships, such as in robotics and autonomous systems. The 3D Imaging Chip's robustness also contributes to its functionality in challenging environments, making it suitable for a variety of industrial applications. Additionally, this chip is engineered to operate efficiently, incorporating power management techniques that enhance its performance while minimizing energy consumption. Altek's focus on innovation is evident in the chip's ability to deliver enhanced depth perception and its integration with AI technologies, which significantly expand its application potential.
Functioning as a comprehensive cross-correlator, the XCM_64X64 facilitates efficient and precise signal processing required in synthetic radar receivers and advanced spectrometers. Designed on IBM's 45nm SOI CMOS technology, it supports ultra-low power operation at about 1.5W for the entire array, with a sampling performance of 1GSps across a bandwidth of 10MHz to 500MHz. The ASIC is engineered to manage high-throughput data channels, a vital component for high-energy physics and space observation instruments.
The Hyperspectral Imaging System from Imec offers unparalleled capabilities in capturing spectral data, enabling detailed analysis and identification of materials based on their spectral signatures. This system is designed to provide high-resolution imaging across a range of wavelengths, making it an invaluable tool for industries such as agriculture, mining, and environmental monitoring. By integrating cutting-edge sensor technology, the system facilitates advanced analytics that support decision-making in various applications requiring precise material composition detection. This advanced imaging solution leverages Imec’s proprietary sensor innovations, which inherently allow for real-time data acquisition and processing. The compact nature of the system makes it adaptable for field deployments, allowing users to conduct in-situ analyses efficiently. Moreover, its robust design ensures consistent performance in diverse environmental conditions, thus broadening its application scope. Core to the Hyperspectral Imaging System is Imec’s commitment to enhancing the functionality of their semiconductor technology. With its ability to seamlessly integrate into existing infrastructures, it offers users a cost-effective upgrade path for significantly improving the precision of their diagnostic capabilities. As industries look for integrated solutions, this imaging system stands out by offering a high degree of customization to meet specific operational needs.
ISPido is a sophisticated Image Signal Processing Pipeline designed for comprehensive image enhancement tasks. It is ultra-configurable using the AXI4-LITE protocol, supporting integration with processors like RISCV. The ISP Pipeline accommodates procedures such as defective pixel correction, color interpolation using the Malvar-Cutler algorithm, and various statistical adjustments to facilitate adaptive control. Furthermore, ISPido incorporates comprehensive color conversion functionalities, with support for HDR processing and chroma resampling to 4:2:2/4:2:0 formats. Supporting bit depths of 8, 10, or 12 bits, and resolutions up to 7680x7680, ISPido ensures high-resolution output crucial for next-generation image processing needs. This flexibility positions it perfectly for projects ranging from low power devices to ultra-high-definition vision systems. Each component of ISPido aligns with AMBA AXI4 standards, ensuring broad compatibility and modular customization possibilities. Such features make it an ideal choice for heterogeneous electronics ecosystems involving CPUs, GPUs, and specialized processors, further solidifying its practicality for widespread deployment.
The ADQ35-WB stands out as a versatile and high-performance data acquisition module, featuring either a dual-channel setting at 5 GSPS or a single-channel mode at 10 GSPS. It boasts a substantial 9 GHz usable analog input bandwidth, rendering it suitable for high-frequency applications. Integrated with an open FPGA, the device enables custom real-time digital signal processing, supports peer-to-peer streaming up to 14 Gbyte/s, and is equipped with hardware triggers for a variety of advanced applications.
The XCM_64X64_A is a powerful array designed for cross-correlation operations, integrating 128 ADCs each capable of 1GSps. Targeted at high-precision synthetic radar and radiometer systems, this ASIC delivers ultra-low power consumption around 0.5W, ensuring efficient performance over a wide bandwidth range from 10MHz to 500MHz. Built on IBM's 45nm SOI CMOS technology, it forms a critical component in systems requiring rapid data sampling and intricate signal processing, all executed with high accuracy, making it ideal for airborne and space-based applications.
With its superior resolution and high sampling rate, the ADQ7DC digitizer is designed to improve application performance tremendously. It offers 14 bits of vertical resolution and can operate in a dual-channel mode at 5 GSPS, or a single-channel arrangement at 10 GSPS, with a wide 3 GHz input bandwidth. The digitizer supports a diverse range of applications including mass spectrometry and LiDAR, thanks to its versatile modular setup and peer-to-peer streaming capabilities to GPUs and CPUs.
The MVDP2000 Series features differential pressure sensors that emphasize sensitivity and accuracy, thanks to a novel capacitive sensing technology. These sensors are designed to be digitally calibrated over a range of pressures and temperatures, ensuring optimal performance even in challenging environments. Their quick response and low power needs make them versatile for numerous applications, from HVAC systems to medical devices.
Designed for high-performance image warping, the TW220/240 IP offers distortion correction and various transformations such as scaling and rotation. It supports resolutions up to 4K x 4K in RGB and YUV formats, facilitating high-quality image outputs. This IP is particularly suited for compact, but high-resolution processing needs found in automotive, VR, and digital camera applications. With GPU-accelerated processing, it ensures efficient alteration of images in real-time, meeting the demands of modern visual technologies. Whether for innovation in automotive mirror systems or in enhancing VR headset displays, TW220/240 stands as an essential asset. It provides the technical prowess required to handle intricate image processing with accuracy and speed.
The Orion Family of Pattern Projectors by Metalenz is an innovative series of high-precision projectors designed to enhance 3D depth sensing across various platforms such as smartphones, AR/VR devices, and IoT systems. These projectors feature a groundbreaking meta-optic technology that enables the transformation of laser light into high-contrast dot or line patterns, facilitating superior 3D imaging performance. By leveraging a single flat meta-optic, Orion projectors simplify the integration process, reducing the requirement for multiple optical components traditionally necessary in pattern projection systems. A key component of this family, the Orion 18K projector, stands out with its exceptional ability to generate approximately 18,000 dots in a pseudorandom pattern at 940nm. This ensures efficient operation under varying lighting conditions, both indoors and outdoors, providing class-leading power and contrast per dot. The single meta-optic design also ensures stability at extreme temperatures, making them suitable for a wide array of applications. This innovative approach results in a dramatic reduction in module size and simplifies assembly, offering a highly compact solution for 3D sensing. The Orion projectors' adaptability is further reflected in their application potential across multiple industries, including automotive, consumer electronics, and smart robotics. This versatility, combined with their superior performance metrics, positions the Orion series as a prime choice for systems requiring precise depth information. Their use extends to face authentication, security systems, and beyond, reflecting Metalenz's commitment to delivering cutting-edge optical solutions that meet the demands of modern technology markets.
The ELFIS2 is a sophisticated visible light imager designed by Caeleste, incorporating a robust radiation-hard design to ensure reliability in demanding environments prone to radiation exposure. It features a true high dynamic range (HDR), enabling it to function effectively even in varied lighting conditions without compromising image quality. Additionally, its motion artifact-free (MAF) imaging ensures precision and clarity in capturing moving objects, a crucial requirement for dynamic applications. The sensor is equipped with a global shutter, enabling it to capture all pixels in the field of view concurrently, a feature that is paramount for high-speed imaging applications. The incorporation of backside illumination (BSI) optimizes the sensor's performance by enhancing sensitivity and reducing noise, thereby improving the overall image output quality. This imaging solution is particularly suitable for space and scientific imaging applications, where high-performance imaging is paramount. The ELFIS2's features make it ideal for applications that demand high fidelity and radiation resistance, truly standing out as a reliable component for cutting-edge imaging needs in challenging environments.
The Pipeline ADC developed by ASIC North is designed for high-speed, high-resolution applications. With the capability to process at 62.5 Msps and a 12-bit resolution, these ADCs are essential in situations where speed and precision are crucial. Pipeline ADCs are optimized for applications requiring rapid data conversion, supporting a wide range of input frequencies while maintaining signal integrity. This is particularly beneficial in systems that demand real-time data processing with minimal latency. The architecture of these ADCs ensures efficient handling of high-frequency signals and reduces power consumption while upholding performance. ASIC North's expertise ensures that each component of the pipeline ADC is meticulously designed to meet the strict demands of modern electronics. The ADC's robust design and adaptability make it a versatile choice for various industries, including telecommunications and digital media.
The 16x112G Rx Chiplet is a highly integrated solution featuring 16 channels at 112G, designed for advanced optical communication applications. It incorporates a photodetector and a trans-impedance amplifier (TIA), paired with digital control functionalities to meet the demanding requirements of modern data transmission systems. This chiplet offers a compact yet robust solution that eases integration challenges while ensuring high-speed performance. Engineered to provide exceptional signal integrity, the chiplet supports high data throughput, making it ideal for deployment in bandwidth-intensive environments. By integrating key components into a single chiplet, it simplifies the design process and enhances system reliability. The carefully verified silicon implementation ensures that performance metrics align with the needs of cutting-edge optical networks. This chiplet is particularly suitable for applications where minimizing form factor and maximizing efficiency without compromising on speed or reliability is critical. Its advanced features support the development of next-generation optical systems, positioning it as an essential building block in the rapid evolution of digital communication technologies.
Engineered for the digital processing and enhancement of video inputs, the logiISP-UHD Image Signal Processing UltraHD Pipeline offers sophisticated processing capabilities for Ultra High Definition video, including 4K2Kp60 support. It is specifically designed for embedded systems leveraging AMD's Zynq UltraScale+ MPSoC, Zynq 7000 AP SoC, Series 7, and newer FPGA devices.<br><br>This IP core is tailored for scenarios requiring elevated image quality and real-time processing, making it indispensable in modern high-definition video environments. It is highly suitable for broadcast applications, security systems, and any system necessitating enhanced visual clarity and video fidelity.<br><br>The logiISP-UHD stands out by streamlining complex video processing tasks, providing designers with the tools needed to significantly elevate image quality within their applications. By ensuring high-quality video outputs under varying conditions, the IP core supports the creation of superior embedded video solutions.
The logiREF-ACAP-VDF is a complete IP design framework that supports the development of embedded multi-camera vision systems using AMD Versal Adaptive SoC. It is tailor-made to work with the logiVID-ACAP-6CAM vision kit, providing a pre-verified reference design that significantly reduces project development time.<br><br>Ideal for applications in advanced driver assistance systems (ADAS), robotics, and machine vision, the framework helps users focus on vision-specific areas rather than starting from scratch. The framework also includes display and LIDAR visualization capabilities, enhancing its utility in complex vision systems.<br><br>With the logiREF-ACAP-VDF framework, users can achieve a higher degree of integration efficiency, ensuring that advanced vision systems are developed swiftly, aligning with modern technological demands and project timelines.
The TRV106TSM180BCD offers a Nyquist-rate ADC solution with impressive specifications suited for diverse technological needs. Operating at a low power of 1.8V with a frequency of 32MHz, this single-bit switched-capacitor Delta-Sigma Modulator ADC is crafted to deliver signals within the 7.8125kHz to 62.5kHz range. Utilizing TSMC’s Low-Power 180nm CMOS technology, it presents a 13-bit performance standard. This ADC's architecture supports programmable decimation rates, which is ideal for high-performance sensor interface systems. The flexibility in configuration allows for its use in fine-line instrumentation, promoting accuracy in measurement systems, and expanding applicability across wireline and wireless technologies. Designed for the modern IoT landscape, the TRV106TSM180BCD is a prime choice for integration into IoT connected devices. It manages power efficiently and ensures optimal signal clarity, supporting advanced analytical tasks in ever-evolving network environments.
The TRV107TSM180BCD is a Sigma-Delta Modulator designed for high-performance applications requiring precise analog-to-digital conversion. Implemented in a 1.8V low-power, 32MHz single-bit switched-capacitor architecture, it operates over a frequency range of 7.8125kHz to 62.5kHz, making it ideal for Nyquist-rate ADC applications. This device is executed using TSMC's Low-Power 180nm CMOS process technology, offering a 13-bit resolution perfect for wireless and wireline sensor interfaces. Engineered to enhance fine-line instrumentation, the TRV107TSM180BCD is also suitable for Internet-of-Things (IoT) subsystem integrations. Its nuanced architecture ensures minimal power consumption, which is critical for battery-dependent applications. This modulator stands out due to its versatility, enabling adaptability across various industrial and consumer electronics. The TRV107TSM180BCD's robust design supports high-resolution applications, significantly improving the performance of existing systems. Within the field of ADC technologies, its precise modulation capabilities enable accurate digital signal interpretation, enhancing overall system effectiveness.
Omni Design offers the Swift™ Low Power Data Converter IP, a collection of high-speed, ultra-low-power data converters that are integral for modern applications like 5G, LiDAR, RADAR, and cutting-edge image sensors. Leveraging advanced process nodes from 28nm to FinFET, these converters excel in delivering energy-efficient operation without compromising performance. The Swift™ Low Power Data Converter IP supports resolutions ranging from 6 to 14 bits and offers sample rates from as low as 5MSPS to over 100GSPS, catering to a broad spectrum of usage scenarios. These IPs are available as individual blocks, matched IQ pairs, or even as comprehensive subsystems that integrate AFEs and digital logic, making them versatile for various system configurations. The converters feature built-in calibration that adjusts for both static and dynamic conditions, ensuring high performance across diverse environments. Omni Design's ADC solutions also integrate seamlessly with their bandgap references, voltage regulators, and input buffers, reflecting their commitment to complete system solutions.
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