All IPs > Analog & Mixed Signal > Analog Subsystems
Analog subsystems are a critical component in modern semiconductor IPs, offering essential functions for converting real-world signals into a form that digital systems can process. These modules are responsible for amplifying, filtering, and converting analog signals, ensuring that they are suitable for further digital processing. At Silicon Hub, our catalog of analog subsystem IPs provides the building blocks needed to develop sophisticated electronic systems, facilitating seamless integration with digital components.
Incorporating analog subsystems is pivotal in a wide array of electronics, from consumer gadgets like smartphones and tablets to industrial devices and automotive systems. These subsystems are crucial in handling audio signals, managing sensor inputs, and processing power management tasks. Analog to Digital Converters (ADCs), Digital to Analog Converters (DACs), Phase-Locked Loops (PLLs), and Voltage Regulators are just a few examples of the integral components you can find within our analog subsystem offerings.
The complexity of analog design can often present challenges, which is why opting for pre-designed analog subsystem semiconductor IP can significantly reduce development time, lower costs, and improve reliability. By utilizing these specialized IPs, designers can focus on optimizing the digital sections of their projects, knowing that the analog components are robust and optimized for performance. This integration allows for faster time-to-market and aligns with the increasing demand for highly integrated, mixed-signal systems.
In the dynamic field of electronics design, analog subsystems semiconductor IPs play a vital role in bridging the gap between the analog world and digital processing realms, ensuring that the signals are accurately sampled and reproduced for high-fidelity applications. Silicon Hub provides a comprehensive selection of these critical components, essential for any modern electronic design aiming for excellence in both performance and efficiency.
The agilePMU Subsystem is an efficient and highly integrated power management unit for SoCs/ASICs. Featuring a power-on-reset, multiple low drop-out regulators, and an associated reference generator. The agilePMU Subsystem is designed to ensure low power consumption while providing optimal power management capabilities. Equipped with an integrated digital controller, the agilePMU Subsystem offers precise control over start-up and shutdown, supports supply sequencing, and allows for individual programmable output voltage for each LDO. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Silicon Creations' Analog Glue solutions enhance the clock management systems in semiconductors by providing essential analog macros that support the main silicon architectures. These solutions are vital in ensuring smooth on-chip operations by interconnecting various components reliably. These macros include components such as bandgap references, power-on reset (POR) generators, and clock distribution buffers, which significantly reduce integration complexities and enhance overall performance. They play a crucial role in maintaining the low-jitter operation and stable power conditions indispensable for advanced electronic systems. The Analog Glue macros are designed to complement PLLs and SerDes solutions, extending their functionality and broadening their applicability across different systems. By enabling efficient signal distribution and robust management, these components contribute critically to the performance and reliability of modern high-tech devices.
The Bandgap offering from SkyeChip is a precise voltage reference circuit aimed at maintaining stability across variations in temperature and power supply. This analog IP delivers a consistent output voltage of about 0.9V with minimal deviation, making it crucial for applications requiring stability across a wide temperature range from -40C to 125C. Its low power consumption and robust design suit a variety of circuits where voltage stability is critical. The Bandgap circuit ensures effective performance in diverse conditions, contributing to the reliability and accuracy of the systems it supports.
The AFX010x Product Family is a series of high-performance Analog Front Ends by SCALINX, crafted for systems requiring meticulous data acquisition. Designed for benchtop and portable devices, this family supports up to 4 channels with a resolution reaching 16 bits and sampling rates up to 5 Gsps. It offers exceptional flexibility with a digitally-selectable 3dB bandwidth up to 300MHz, making it suitable for various high-resolution applications. Each AFX010x unit encapsulates four independent channels, each featuring programmable input capacitance, a single-ended to differential Programmable Gain Amplifier, an offset DAC, an ADC, and an integrated digital processor. The IC's compact design in a 12 mm × 12 mm, 196-Ball BGA package minimizes PCB footprint while their proprietary SCCORETM technology supports significant power saving, estimated at 50%. This product line is optimal for data acquisition cards, both PC-based and USB oscilloscopes, handheld and benchtop digital storage oscilloscopes, non-destructive testing, particle measurement, and noise diagnostics. With low power consumption recorded at 425 mW per channel at maximum sampling rates, the AFX010x ensures efficient high-speed processing suitable for dynamic environments.
Thermal Oxide Processing is a critical service offered by NanoSILICON, Inc., utilizing silicon dioxide (SiO2) as a key insulation material in semiconductor devices. This material serves as a field oxide, separating conductive layers like polysilicon and metal from the silicon base. Additionally, it functions as a gate oxide, playing a crucial role in the device's operation. Silicon wafers are subjected to oxidation within a high-temperature range of 800°C to 1050°C in quartz tube furnaces, ensuring a slow and controlled heating process to prevent deformation. The characteristics of dry oxidation, which include slow oxide growth and high density, make it suitable for high breakdown voltage applications. On the other hand, wet oxidation offers faster growth, even at lower temperatures, allowing for the creation of thicker oxide layers. These processes are conducted using ultra-pure steam and oxygen sources, ensuring batch thickness uniformity within ±5% and intra-wafer uniformity within ±3%. Technical proficiency is emphasized with the employment of advanced measurement tools like the Nanometrics 210 for optical parameter adjustment and precise film thickness verification. This technique allows for accurate measurement at various stages of the semiconductor fabrication, from as small as 10µm, guaranteeing the high quality of the thermal oxide films.
TmlExpert is a specialized tool designed for detailed transmission-line modeling and simulation. It is particularly valuable in environments where high-speed signal integrity is crucial. The tool provides advanced capabilities to model intricate transmission line structures, enabling users to predict their behavior accurately under various conditions. By delivering precise results, TmlExpert allows designers to optimize their designs for better performance, leading to improved stability and bandwidth. One of the key advantages of TmlExpert is its ability to handle complex high-speed circuit environments. It is engineered to assess a wide range of scenarios, providing valuable insights into potential signal integrity issues. The tool's user-friendly interface ensures that engineers can quickly set up and execute simulations, obtaining results in a timely manner. This efficiency is vital in fast-paced design cycles where time-to-market is critical. TmlExpert's accurate modeling capabilities make it indispensable for electronics professionals looking to enhance the performance of their high-speed digital systems. By providing comprehensive analytics and simulation options, TmlExpert supports the development of robust designs capable of meeting stringent industry standards.
The agilePVT Sensor Subsystem is a low power integrated macro consisting of Process, Voltage and Temperature sensors, and associated reference generator, for on-chip monitoring of a device's physical, environmental, and electrical characteristics. The monitoring of process, voltage and temperature variations are critical to optimize power and performance for modern SoCs/ASICs, especially for advanced node and FinFET processes. Equipped with an integrated digital controller, the agilePVT Subsystem offers precise control over start-up and shutdown. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance over the full product lifecycle. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The agileSensorIF Subsystem is an efficient and highly integrated sensor interface for SoCs/ASICs. Featuring multiple Analog-to-Digital converters (agileADC), Digital-to-Analog converter (agileDAC), low-power programmable analog comparators (agileCMP_LP), and an associated reference generator (agileREF). The agileSensorIF Subsystem enables easy interaction with the analog world. The components within the subsystem can be customized to suit a variety of applications. This includes selecting the number of agileADC, agileDAC and agileCMP_LP blocks, as well as their bit depth and sample rate. This allows the agileSensorIF Subsystem to be perfectly tailored to your exact needs and use case. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
The agileSMU Subsystem is a low power integrated macro consisting of the essential IP blocks required to securely manage waking up a SoC from sleep mode. Typically containing a programmable oscillator for low frequency SoC operation including a RTC, a number of low power comparators which can be used to initiate the wake-up sequence, and a power-on-reset which provides a robust, start-up reset to the SoC. Equipped with an integrated digital controller, the agileSMU Subsystem offers precise control over wake-up commands and sequencing. Status monitors provide real-time feedback on the current state of the subsystem, ensuring optimal system performance over the full product lifecycle. Agile Analog designs are based on tried and tested architectures to ensure reliability and functionality. Our automated design methodology is programmatic, systematic and repeatable leading to analog IP that is more verifiable, more robust and more reliable. Our methodology also allows us to quickly re-target our IP to different process options. Our highly configurable and multi-node analog IP products are developed to meet the customer’s exact requirements. These digitally-wrapped and verified solutions can be seamlessly integrated into any SoC, significantly reducing complexity, time and costs.
Certus Semiconductor's Analog I/O solutions are distinguished by their ESD protection capabilities, including ultra-low capacitance designs. These solutions are ideal for RF and high-speed SerDes applications, offering integration without compromising signal quality. Features include integration into existing RF networks, maximum impedance matching, and handling of signal swings below ground level, thereby ensuring robust performance even in extreme operating conditions. They offer protection from up to 16kV HBM and 1000V CDM, along with high-temperature endurance, enhancing reliability against environmental stresses.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
The Aeonic Integrated Droop Response System is designed to enhance droop and DVFS response for integrated circuits. It includes multi-threshold droop detection and fast adaptation times, ensuring power savings and optimal system performance. This technology provides extensive observability and integrates standard interfaces like APB & JTAG, aiding silicon health management by delivering data-driven insights for lifecycle analytics.
Hermes Layered is a sophisticated tool dedicated to 3D finite element method (FEM) simulation, aimed at IC, package, and PCB applications. This tool enhances the designer's ability to analyze complex electromagnetic interactions within layered structures. Its advanced simulation capabilities ensure that critical design metrics such as signal integrity and electromagnetic compatibility are thoroughly evaluated. The power of Hermes Layered lies in its ability to manage detailed simulations of multiple layers, essential in the design of high-performance ICs and advanced packaging systems. By providing designers with a thorough analysis of electromagnetic effects, Hermes Layered helps optimize designs to ensure both reliability and functionality. This tool is indispensable for those engaged in cutting-edge IC and PCB design, where the ability to predict and mitigate potential EM challenges can significantly impact the success of the final product. Hermes Layered offers precision and quality insights needed to meet the high demands of today's electronic systems.
The aLFA-C is a versatile interfacing ASIC specifically engineered for infrared ROICs typically utilized in space applications. This device significantly replaces traditional front-end electronics infrastructure by incorporating advanced features. Designed to operate with minimal power requirements, it leverages on-chip LDOs and regulators, allowing the device to function on a single unregulated power supply. User-friendly interfaces such as SpaceWire enhance connectivity, while a fully programmable ROIC sequencer with multiple levels of nesting allows dynamic reprogramming.\n\nThe aLFA-C accommodates a wide range of input and output configurations with its 32 programmable digital outputs and 16 digital inputs, supporting differential and single-ended formats in CMOS or LVDS. It integrates a robust SPI interface alongside comprehensive analog acquisition capabilities through its numerous ADC channels. The device ensures precise control and measurement with its programmable gain and offset features, complemented by current biasing adjustments.\n\nThis ASIC is targeted towards critical environments offered by its resilience to radiation and extreme temperatures, facilitating reliable operations from deep cryogenic to high-temperature environments. With features tailored for adaptability, the aLFA-C proves indispensable in mission-critical sensor applications, enabling high precision and integration in space technology systems.
Omni Design Technologies' Specialty IP solutions cater to specific functions that are critical for a variety of high-tech applications. These solutions are designed to support advanced functions such as glitch detection, latch-up detection, and precision clock receiving in sophisticated semiconductor environments. By integrating these specialty solutions, Omni Design aids in addressing complex electronic design challenges encountered in sectors like automotive, defense, and high-density telecommunications systems. Specialty IP from Omni Design includes a range of options like high-performance voltage buffers and programmable gain amplifiers that ensure efficient and reliable signal conditioning. Additionally, their LVDS I/O cells are engineered for high-speed data transmission over significant signal distances, maintaining performance integrity where precision and reliability are indispensable. These IPs are equipped to seamlessly integrate with other chip functions, assisting developers in achieving stable and efficient performance in their designs. With process compatibility extending to advanced FinFET nodes, these Specialty IP solutions help optimize system functionality across varied market segments and use cases, ensuring robust application adaptability.
ViaExpert is tailored for intricate via modeling and simulation, offering precise analysis for systems requiring high-fidelity interconnects. As high-speed digital designs become increasingly prevalent, the accurate modeling of vias - essential pathways in an electronic design - becomes critical. ViaExpert provides the tools necessary to evaluate vias' electrical characteristics comprehensively, ensuring designs can accommodate desired performance levels. This tool addresses challenges in high-frequency environments by offering detailed simulations of via structures, facilitating seamless integration with overall circuit designs. The emphasis on accuracy helps designers mitigate potential signal integrity issues, such as reflection and crosstalk, which can arise in complex electronic systems. ViaExpert is particularly suited for engineers seeking precise interconnect modeling to ensure reliability and efficiency in design outcomes. Its advanced simulation capabilities support the creation of resilient and effective electronic systems, valuable for industries where performance cannot be compromised.
The Application Specific Analog Front End (AFE) IP from Omni Design Technologies is tailored for distinctive high-performance market needs, addressing complex signal processing tasks in environments such as wireless and wireline communications, automotive networking, and advanced imaging systems. Utilizing the robust Swift™ technology, these AFEs are designed to ensure high accuracy and efficiency in data conversion and signal conditioning. These AFEs support an impressive range of operational conditions by integrating best-in-class data converters and unique signal conditioning modules that optimize performance for specific end-use markets. They offer solutions that incorporate digital logic to enhance performance readiness and adaptability, making them ideal for systems demanding rigorous data processing functionalities. With a focus on power efficiency, Omni Design's AFE IPs are fabricated utilizing various advanced process nodes, from traditional CMOS to FinFET technologies. They exemplify optimal integration capabilities, melding seamlessly with other system components to deliver top-of-the-line stability and performance, enabling developers to meet and exceed operational benchmarks in critical applications.
CableExpert focuses on cable harness modeling and simulation, a crucial component in modern electronics where complexity and performance are paramount. By simulating cable behavior, this tool helps designers understand the impacts of physical and electrical constraints on harness performance. Its sophisticated modeling environment allows for the exploration of various configurations to optimize system connections. Through its ability to simulate a variety of cable types, CableExpert helps reduce potential failures by predicting problems like impedance mismatch and signal degradation. This capability is essential in ensuring that cable harnesses meet both performance specifications and reliability requirements, especially in industries such as automotive and aerospace where safety and precision are critical. CableExpert's robust simulation features enable engineers to evaluate and refine cable designs effectively, ensuring seamless integration into larger systems. This tool's comprehensive approach aids in the development of efficient, high-performance harness solutions that meet the rigorous demands of advanced electronic systems.
Imec's Monolithic Microsystems embody the seamless integration of diverse functionalities onto a single chip, heralding a new era of miniaturization and efficiency in various applications. These microsystems are crafted through state-of-the-art semiconductor processes, allowing for the incorporation of multiple components into one coherent unit. This innovation is particularly revolutionary for technologies requiring sophisticated multi-domain integration, such as wearable devices, medical implants, and smart sensors. By uniting digital logic, sensors, actuators, and communication capabilities onto a single chip, the Monolithic Microsystems greatly reduce the need for additional components, thereby minimizing device size and enhancing reliability. Imec's comprehensive approach to microsystem development ensures that these chips deliver powerful capabilities with low energy consumption, meeting the demands of modern technologies aiming for sustainability without sacrificing performance. As a cornerstone of smart technology advancement, Monolithic Microsystems set the stage for future integrated solutions in complex tech ecosystems.
eSi-Analog is a portfolio of silicon-proven analog IP blocks that play a pivotal role in enabling custom ASIC and SoC designs. The offerings include a variety of critical analog functions such as oscillators, PLLs, and low-dropout regulators (LDOs), all optimized for low power consumption and high performance. These blocks are designed for easy integration across numerous process nodes, catering to diverse customer specifications in sectors ranging from wireless communication to healthcare. By incorporating advanced analog technology, eSi-Analog helps ensure that systems meet both performance and cost targets while maintaining high levels of functionality.
Metis stands as a powerful solution designed for tackling the complexities of 2.5D/3D IC packaging. Tailored to support the analysis of multi-die integration, Metis provides comprehensive simulation capabilities essential for modern IC design requirements. As the industry moves towards more compact and complex packaging, Metis plays a pivotal role in ensuring that these designs meet the necessary criteria for SI/PI performance and thermal management. What sets Metis apart is its extensive capacity to handle large-scale simulations, enabling designers to model and evaluate the electromagnetic interactions within densely packed IC assemblies. This capability is crucial in maintaining signal integrity and power integrity, which are often the bedrock of functional and reliable electronic systems. Metis supports the development of advanced IC packaging solutions by offering detailed visualizations and simulation insights, empowering engineers to address critical design challenges proactively. Its role in optimizing packaging solutions ensures that products not only meet but exceed industry standards for performance and reliability.
Vantablack S-VIS is a state-of-the-art material specifically engineered for use in space applications. It is distinguished by its ability to significantly reduce stray light in optical instruments, enhancing the calibration of IR camera systems. Vantablack S-VIS coatings provide a high-performance solution with spectrally flat absorption capabilities that range from the ultraviolet to near-millimeter spectral areas. In the challenging environment of space, these coatings help streamline instrument design by reducing size and weight while maintaining exceptional light absorption and high emissivity.
The RF Front-End for Satellite Reception Beam-Forming is a sophisticated system designed to optimize satellite signal reception. Operating in the Ku band (11-13 GHz), this phased array system enables precise beam steering and signal enhancement, which is critical for high-performance satellite communication. The system architecture is specifically designed to support multi-channel operation and advanced modulation schemes, ensuring robust performance even in challenging environments. Ideal for applications requiring high gain and low noise figures, this front-end is engineered to integrate seamlessly into larger satellite systems. Furthermore, its compact design and power-efficient operation make it a versatile solution for both commercial and defense satellite applications.
This Analog Front End (AFE) supports the EPC Gen 2 UHF standard, providing the necessary interface for analog signal processing in RFID systems. The AFE manages essential tasks such as modulation and demodulation, signal amplification, and data conversion, ensuring seamless interaction with the digital protocol engine. Its ability to maintain signal integrity and quality across varying conditions makes it a critical component in the reliable operation of RFID technologies.
Support Circuit IP from Analog Circuit Works forms the backbone of integrated circuit designs, ensuring that all components function harmoniously to deliver first-pass silicon success. These circuits are verified down to the transistor level, embedding reliability within their frameworks to provide customizable solutions.\n\nTailored to meet specific design needs, these support circuits are engineered for rapid deployment, adapting to an array of functional requirements while maintaining performance consistency. This IP portfolio supports diverse technological implementations, allowing flexibility and high adaptability in electronic design projects.\n\nBy leveraging these support solutions, developers can solidify their designs with reliable, performance-driven circuits, facilitating reduced time-to-market and increased product robustness, which are essential in contemporary semiconductor projects.
Akronic specializes in designing state-of-the-art analog and mixed-signal integrated circuits. Their extensive experience covers all essential building blocks used in modern telecom and radar transceiver radios. Akronic's portfolio includes low-pass filters, often utilizing Leapfrog, OPAMP, or Gm-C architectures. These incorporate sophisticated configurations like Chebyshev or Butterworth to achieve high cut-off frequencies exceeding 1GHz. Their ICs also encompass base-band functions such as bandgap voltage references and gain-control operations, ensuring precise signal management. The company's expertise extends to high-speed signal converters, featuring both switched-capacitor and current-source DACs, along with advanced ADC designs like successive-approximation and time-interleaved architectures. Additionally, Akronic's frequency synthesis capabilities embody both fractional and integer-N PLL technologies, complete with multi-modulus prescalers and loop filters. Their focus on minutiae extends through aspects like VCO design, including innovative drivers and multiplexing solutions, making their analog and mixed-signal ICs a hallmark of advanced integrated design. Akronic integrates power-efficient designs with meticulous attention to signal integrity and stability. They provide linear-in-dB or stepped gain-control mechanisms and boast advanced AGC and ALC loop designs. Their emphasis on advanced compensation techniques, like LO leakage control, ensures optimal real-world performance, reinforcing Akronic’s authority in analog and mixed-signal innovation.
The Bandgap Voltage Reference is a critical component for stable voltage regulation in various electronic circuits. It utilizes the bandgap principle to deliver a constant voltage output, regardless of variations in temperature, power supply levels, or circuit loading. This precision reference is crucial for applications requiring consistent performance, such as in power management systems or analog signal processing circuits. Its robust design ensures minimal drift and maximum efficiency in delivering stable voltage across diverse environmental conditions.
The 24-bit Sigma-Delta Analog-to-Digital Converter (ADC) with Analog Front End (AFE) is a high precision solution from RafaelMicro. Designed for applications requiring exceptional accuracy and noise performance, this ADC integrates seamlessly into various types of sensory equipment, providing a robust bridge between the analog world and digital processing environments.