The UCIe Chiplet Interconnect provides an advanced connectivity solution for integrated circuit chiplet architecture, offering high bandwidth and low latency communication between chiplets. This IP ensures seamless die-to-die (D2D) and chip-to-chip (C2C) interactions with high efficiency, crucial for data-intensive applications and advanced computing systems. Its integration aids in maximizing data throughput while reducing power consumption, aligning with the latest UCIe standards. Designed for a broad range of process technologies, it supports expansive configurability and scalable designs.
