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All IPs > Analog & Mixed Signal > Coder/Decoder > Terefilm Photopolymer

Terefilm Photopolymer

From Terecircuits

Description

Terefilm® Photopolymer is an advanced material solution designed to tackle critical challenges in the semiconductor industry such as precision mass transfer, high-resolution photolithography, and temporary bonding-debonding. Its unique characteristics include a perfect blend of precise patternability, clean decomposition, and low activation energy, making it ideal for high-throughput semiconductor applications that demand stringent cleanliness and precise control. Terefilm® is engineered to offer thermal stability up to 180°C, integrating seamlessly into high-temperature manufacturing processes.

Upon exposure to low-energy UV irradiation, Terefilm®'s decomposition temperature is significantly reduced, necessitating substantially lower energy for vaporization. This reaction, assisted by photo-acid generators similar to those in photoresists, occurs almost instantaneously, vaporizing the material without leaving residues. This clean transformation from a solid to an entirely gaseous phase ensures that the transition leaves no particulates, setting Terefilm apart in applications requiring absolute cleanliness.

One of the standout features of Terefilm® is its low activation energy, which allows it to function efficiently under the fluence threshold of most mask materials, facilitating processes like MicroLED mass transfer. It contributes to reducing operational costs while extending the lifespan of lasers and optics involved in LIFT systems, offering a more cost-effective alternative to traditional ablation methods. The polymer's design allows for precise component transfers, high-resolution patterning, and the delicate release of bonded wafers, supporting an array of semiconductor process innovations.

Features
  • Low activation energy
  • Clean decomposition
  • Precise patterning
Foundries & Process Nodes
Foundry Process Nodes
TSMC 16nm
28nm
65nm
Tech Specs
Class Value
Categories Analog & Mixed Signal > Coder/Decoder
Interface Controller & PHY > AMBA AHB / APB/ AXI
Interface Controller & PHY > MIL-STD-1553
Memory Controller & PHY > DDR
Thermal Stability Up to 180°C
UV Decomposition Energy ~60°C
Availability All Countries & Regions
Applications
  • Mass transfer for MicroLEDs
  • High-resolution photolithography
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