Credo Semiconductor's SerDes PHY solutions are at the forefront of connectivity technologies, designed for seamless integration into next-generation ASICs. These SerDes products strike a balance between optimal performance and cost-efficiency by utilizing innovative mixed signal DSP architectures. Credo's offerings can be integrated into multichip module systems-on-chip (MCM SoC) and 2.5D Silicon Interposer designs, featuring adaptability to varying manufacturing processes without sacrificing efficiency. The flexibility inherent in these products allows for integration of tens to hundreds of SerDes lanes, catering to different application scales and ensuring they meet diverse customer needs. Their design supports both high-performance and power-efficient requirements, with solutions available across mature process nodes. This adaptability ensures that Credo's SerDes PHY solutions provide robust, consistent performance, helping to minimize the risks associated with new technology deployments. They are particularly suited for high-performance computing and AI ASIC applications, where they enable rapid data transfer speeds with minimal latency, critical in today's data-driven computational environments.
