Eliyan’s NuLink technology extends its innovation to die-to-memory connections, providing unmatched bidirectional signaling, which maximizes bandwidth efficiency and system performance on standard and advanced packaging platforms. The NuLink die-to-memory PHY supports advanced communication for memory-intensive applications, utilizing transceivers that operate in bidirectional mode, adapting based on the memory activity, either as sender or receiver.
The technology caters to memory connections that require quick switching between operations, such as read and write, and dramatically enhances memory integration capabilities using the Universal Memory Interface (UMI) proposals. This supports seamless pairing of an ASIC with a variety of memory chip configurations, including DDR and HBM, leveraging the versatility of dynamic half-duplex transceivers. This capability significantly augments memory traffic handling, doubling the bandwidth potential on memory lanes, even when using cost-efficient standard packaging substrates.
Moreover, Eliyan's proposition for broader adoption within industry standards suggests replacing traditional DRAM PHYs and controllers with more efficient configurations using NuLink PHYs. Consequently, this not only optimizes the ASIC design by saving power and space but also positions Eliyan’s solutions as a pillar for advancing chiplet-based architectures, particularly in high-demand applications like AI, automotive, and telecommunication markets.
