Eliyan's NuLink Die-to-Memory (D2M) PHY technology enables robust communication between logic dies and memory dies using standard packaging solutions. By offering high-speed data transfer rates and low latency operations, this technology is critical in overcoming traditional memory wall challenges in advanced computing systems. The technology supports seamless, high-efficiency interconnects creating a perfect synergy between computational and memory components within a single package.
As opposed to conventional unidirectional solutions, the D2M technology from Eliyan provides a bidirectional data flow in a low-power, high-performance framework. This increases the throughput efficiency enabling intensive data-driven applications to optimize their processing cycles effectively. Additionally, the NuLink D2M PHY supports configurable bump map layouts, facilitating seamless integration into various industry-standard protocols and enhancing its adaptability for different design architectures.
This solution is engineered for situations where separation between high-temperature processors and heat-sensitive memory components is crucial. It achieves interposer-like performance levels without the cost implications of advanced silicon interposer technologies, making it ideal for scalable high performance applications demanding extensive memory interaction.
