Eliyan’s NuLink technology revolutionizes die-to-die connections in the semiconductor landscape by delivering robust performance and energy efficiency using industry-standard packaging. The NuLink PHY is designed to optimize serial high-speed die-to-die links, accommodating custom and standard interconnect schemes like UCIe and BoW. It achieves significant benchmarks in terms of power efficiency, bandwidth, and scalability, providing the same benefits typical of advanced packaging techniques but within a standard packaging framework. This versatility enables broader cost-effective solutions by circumventing the high cost and complexity often associated with silicon interposers.
NuLink Die-to-Die PHY stands out for its integration flexibility, supporting both silicon and organic substrate environments while maintaining superior data throughput and minimal latency. This innovation is particularly beneficial for system architects aiming to maximize performance within chiplet-based architectures, allowing the strategic incorporation of elements such as high-bandwidth memory and silicon photonics. NuLink further advances system integration by enabling simultaneous bidirectional signaling (SBD), doubling the effective data bandwidth on the same interface line. This singular feature is pivotal for intensive processing applications like AI and machine learning, where robust and rapid data interchange is critical.
Eliyan’s NuLink can be implemented in diverse application scenarios, showcasing its ability to manage large-scale, multi-die integrations without the customary bottlenecks of area and mechanical structure. By leading system designs away from vendor-specific, cost-prohibitive supply chains, Eliyan empowers designers with increased freedom and efficiency, further underpinning its groundbreaking role in die-to-die connectivity and beyond.
