Rockley's Multi-Channel Silicon Photonic Chipset is designed as a next-generation solution for high-speed data transmission. This sophisticated chipset integrates hybrid III-V DFB lasers and electro-absorption modulators within a silicon photonic framework, providing 4x106 Gb/s 400 GBASE-DR4 data rates. Each channel achieves high modulation amplitude and low TDECQ penalty, delivering compliance with industry standards. This scalability ensures robust performance for data centers and high-bandwidth communication needs. The chipset exemplifies Rockley's expertise in combining optical components to craft preciseness and efficiency suited for heavy data-centric environments.
