All IPs > Memory & Logic Library > Embedded Memories
Embedded memories play a crucial role in the architecture of modern electronic devices, offering storage and retrieval capabilities that are integral to processor function and data management. In Silicon Hub's Memory & Logic Library, the Embedded Memories category encompasses a wide variety of semiconductor IPs designed to meet these needs in diverse applications, from consumer electronics to industrial systems.
The primary function of embedded memories is to store and manage data internally within a device, which is essential for efficient processing and quick data access. These semiconductor IPs are typically integrated within a system on chip (SoC) to optimize performance and minimize latency compared to off-chip memory solutions. This integration helps improve overall device performance, reduce power consumption, and enhance the speed of data processing.
Common types of embedded memories available in this category include SRAM (Static Random Access Memory), DRAM (Dynamic Random Access Memory), MRAM (Magnetic Random Access Memory), and non-volatile memory types like Flash and EEPROM. Each type offers distinct advantages, such as high speed in SRAM, lower power consumption in DRAM, or the ability to retain data without power in non-volatile memories. These memory IPs are utilized in a plethora of products from smartphones and tablets to automotive systems and IoT devices, where compact, reliable, and efficient memory solutions are paramount.
Developers seeking to enhance computational efficiency and data handling capabilities in their designs will find this category indispensable. By choosing the right embedded memory IP from our Memory & Logic Library, manufacturers can create products that meet the demanding requirements of modern applications, ensuring reliability and excellent performance in a competitive market.
Dolphin Technology offers a comprehensive range of memory IP products, catering to diverse requirements in semiconductor design. These products include a variety of memory compilers, specialty memory, and robust memory test and repair solutions such as Memory BIST. Designed to meet the demands of contemporary low-power and high-density applications, these IPs are built to work across a broad spectrum of process technologies. Advanced power management features, like light and deep sleep modes and dual rails, enable these products to tackle even the toughest low-leakage challenges. What sets these products apart is their flexibility and adaptability, evident in the support for different memory types and process nodes. Dolphin Technology’s memory IPs benefit from seasoned design teams that have proven their mettle in silicon across several generations. Thus, these IPs are not only versatile but also reliable in serving a wide variety of industry needs for technology firms worldwide. Clients can expect memory solutions that are fine-tuned for both power efficiency and performance. Additional capabilities such as power gating cater to ultra-low power devices while achieving a high level of device integration and compatibility. The specialized focus on low noise and rapid cycle times makes these memory solutions highly effective for performance-driven applications. These features collectively make Dolphin Technology’s memory IP an invaluable asset for semiconductor designers striving for innovation and excellence.
The AHB-Lite Memory component from Roa Logic offers an efficient solution for implementing on-chip memory accessible by an AHB-Lite-based master. This module is designed to manage data storage and retrieval efficiently, playing a vital role in the data handling capabilities of integrated systems. Fully parameterized, it allows developers to tailor the memory configuration to suit specific needs, facilitating the creation of designs that are both space-efficient and high-performance. Its implementation focuses on reducing access latency, thereby enhancing the throughput of data operations within various system environments. Supporting a wide range of applications, this memory IP is available to developers under a non-commercial use license, providing opportunities to explore its potential in prototype and experimental designs. Its adaptability makes it a cornerstone for any project requiring reliable and robust on-chip memory solutions.
The AndeShape Platforms are designed to streamline system development by providing a diverse suite of IP solutions for SoC architecture. These platforms encompass a variety of product categories, including the AE210P for microcontroller applications, AE300 and AE350 AXI fabric packages for scalable SoCs, and AE250 AHB platform IP. These solutions facilitate efficient system integration with Andes processors. Furthermore, AndeShape offers a sophisticated range of development platforms and debugging tools, such as ADP-XC7K160/410, which reinforce the system design and verification processes, providing a comprehensive environment for the innovative realization of IoT and other embedded applications.
The LEE Flash G1 is designed to cater to cost-sensitive embedded flash applications, leveraging a simple SONOS architecture that scales efficiently down to 40nm. This flash technology is perfect for moderate memory capacity needs, typically up to several hundred kilobytes, making it suitable for automotive and power-sensitive tasks. The G1 Flash supports a wide temperature range, enhancing its viability for extreme automotive requirements and ensuring long-term data retention stability. One of the standout features of the LEE Flash G1 is its power efficiency, characterized by low power consumption during program and erase cycles. This efficiency is achieved through Fowler-Nordheim tunneling technology, drastically minimizing power requirements compared to traditional methods. Furthermore, this technology simplifies the integration of flash memory by requiring only 2 to 3 additional masks, reducing the overall cost and complexity of chip fabrication. Operating on a standard CMOS logic process without altering the SPICE model, LEE Flash G1 allows for the re-use of existing IPs and design assets, offering a path to cost savings and simplifying design processes. The G1's architecture also shortens baking and testing times, significantly cutting down on chip production costs while maintaining quality and reliability under rigorous conditions.
Silvaco's Embedded Memory Compilers are designed to meet the dynamic needs of modern semiconductor applications. These compilers enable the generation of various memory architectures that are vital for high-performance computing and device functionality. Incorporating cutting-edge technology, they support a wide range of process nodes, thereby offering flexibility and scalability for developers and designers. The compilers are fitted with an array of tools that enhance integration, customization, and optimization, ensuring the development of tailored memory solutions for specific project requirements.
The xT CDx is a sophisticated tumor profiling solution designed to advance precision oncology care for solid malignancies. This assay uses next-generation sequencing to assess alterations in 648 genes, identifying single nucleotide variants, multi-nucleotide variants, and insertions/deletions. It also evaluates microsatellite instability status and serves as a companion diagnostic to explore potential treatment avenues according to specific therapeutic product labeling. Uniquely, xT CDx offers mutation profiling through samplings from both formalin-fixed paraffin-embedded tumor tissues and matched normal samples such as blood or saliva, enhancing diagnostic clarity and treatment direction for patients with solid tumors. The comprehensive report generated includes valuable insights that can inform the personalized treatment path for cancer patients.
CodaCache provides a comprehensive solution for enhancing SoC performance through advanced caching techniques, optimizing data access, and improving power efficiency. This last-level cache complements NoC applications by minimizing memory latency and power consumption. Its configurable design offers flexible memory organization, supporting diverse caching requirements and real-time processing. CodaCache is designed to seamlessly integrate with existing SoC infrastructures, accelerating development timelines and enhancing data reusability. It aids in reducing layout congestion and timing closure issues, resulting in better resource management and performance optimization across a range of electronic design applications.
The Secure OTP (One-Time Programmable) solution by PUFsecurity elevates standard OTP technology by integrating anti-fuse memory and robust encryption techniques, ensuring the high-level protection of sensitive data. This sophisticated approach allows for secure data storage and management, even under duress from advanced attack methodologies. Secure OTP transforms how critical data like encryption keys and configuration states are stored, enabling devices to maintain data integrity during storage and transit. By encapsulating both physical macro implementations and digital RTL designs with intuitive control, Secure OTP allows seamless integration into a host of applications while safeguarding against unauthorized data extraction. The integration of diverse interface protocols makes Secure OTP adaptable to a wide range of industrial requirements. It stands as a robust defensive measure in the face of modern threats, offering reliability in an era where secure data storage solutions are more important than ever.
Cache MX provides an enhanced cache compression solution, effectively doubling cache capacity. It achieves this with an impressive 80% savings in both area and power, compared to traditional SRAM capacity. This solution allows for high-efficiency memory usage, optimizing both energy consumption and performance across varied applications. It is specially designed to boost the overall efficiency of data centers by reducing overheads associated with standard memory usage.
The YouDDR solution offered by Brite Semiconductor is a comprehensive sub-system that includes a DDR controller, PHY, and I/O. This solution is meticulously crafted to support various DDR technologies like LPDDR2, DDR3, LPDDR3, DDR4, and LPDDR4/4x, with data transfer rates ranging from 667Mbps to 4266Mbps. YouDDR is equipped with advanced dynamic self-calibration logic (DSCL) and dynamic adaptive bit calibration (DABC) technologies. These advancements allow for automatic adjustment to variations such as process, voltage, and temperature (PVT) changes, ensuring robust performance across different conditions. The system also supports training sequences for both read and write operations, ensuring optimized signal integrity and data accuracy. Brite's YouDDR technology guarantees high speed and low power consumption, making it ideal for applications requiring fast memory access and energy efficiency. Its design is highly flexible, supporting multiple configuration options to meet diverse application needs, including different interface types like AXI and AHB. These features make it particularly well-suited for use in high-performance computing systems, consumer electronics, and network systems where quick data retrieval is paramount. The YouDDR IP provides significant advantages over competing products due to its small area and power-efficient design. It also incorporates a comprehensive set of verification tools and support for seamless integration into larger system designs. This makes it a valuable asset for designers seeking a reliable and efficient memory subsystem with proven performance in varied industry applications.
NRAM Technology by Nantero represents a significant leap forward in memory technology, utilizing carbon nanotubes to create non-volatile memory that outperforms traditional solutions. This technology is designed to combine the speed and durability of DRAM with the non-volatility of flash, providing a much-needed enhancement in performance and efficiency. One of the core strengths of NRAM is its ability to function in extreme conditions, maintaining data integrity without the need for constant power. Its low power requirements make it an ideal choice for a variety of applications, ranging from consumer electronics to high-performance computing infrastructures. Furthermore, NRAM's inherent scalability ensures that it can be seamlessly integrated into existing manufacturing processes with minimal disruption, offering a path forward for industries looking to enhance their memory capabilities without prohibitive costs. Its versatility and robustness continue to make it a highly attractive alternative to current memory technologies.
SRAM, or Static Random-Access Memory, is a critical component in semiconductor design, known for its high-speed data access and reliability. DXCorr’s SRAM solutions are built to maximize performance in a multitude of applications, offering significant advantages in power efficiency and operational speed. These memory arrays are adept at providing the rapid access necessary for high-performance computing environments, paving the way for enhanced data processing and storage capabilities. The flexibility and customizable nature of DXCorr’s SRAM offer clients the ability to tailor capabilities to specific application needs. This makes it an ideal choice for applications requiring low latency and high throughput, such as cache memory in processors and performance-critical applications in telecommunications. Its distinct architecture allows for robust integration into various systems, providing the foundational memory support essential for advanced computing solutions. Designed with leading-edge technology, DXCorr’s SRAM products not only optimize current computing requirements but also anticipate the needs of future technologies. The focus on efficiency ensures reduced power consumption, critical for battery-dependent applications and eco-friendly computing initiatives. SRAM's modular design also facilitates easy scalability, making it a preferred choice for developers aiming to expand functionality and performance consistently.
Analog Bits' I/O solutions are engineered to provide high-quality signaling between integrated circuits, supporting a variety of applications with unparalleled efficiency. These I/Os are optimized for low power consumption and high performance, designed to meet the stringent demands of state-of-the-art electronic devices. The wide array of I/O solutions is tailored to support die-to-die communications with minimal power loss, ensuring swift data exchange processes. These I/O products are implemented on advanced process nodes, guaranteeing their effectiveness in modern semiconductor environments. The expertise of Analog Bits in crafting these solutions ensures that they are highly customizable, adapting seamlessly to diverse client requirements and thereby offering significant improvements in design flexibility. Silicon-proven and trusted across leading foundries, these I/O solutions are at the heart of high-volume semiconductor production. They are particularly effective in applications that demand precise signal transmission and reception, underscoring their vital role in facilitating reliable chip-to-chip communication in various high-tech industries.
The Digital I/O offerings from Certus Semiconductor are meticulously designed to cater to a wide range of GPIO/ODIO standards involving various protocols such as I2C, I3C, and SPI among others. These solutions support 1.2V, 1.8V, 2.5V, 3.3V, and 5V configurations, ensuring adaptability across numerous nodes and foundries. They boast features such as ultra-low power consumption, minimal leakage, and multiple drive strengths, making them suitable for diverse applications. Advanced Electronic Distribution Systems (ESD) protection is a standout feature, capable of withstanding severe ESD stress way beyond common levels. The design includes comprehensive compliance with popular standards like eMMC, RGMII, and LPDDR, providing robustness in various scenarios. The Digital I/O solutions are engineered to be highly resilient, capable of adapting to challenging environmental and operational conditions while maintaining impressive performance metrics. These digital IO designs are complemented by a strong support for rad-hard applications, designed for high reliability and minimal failure rates even in extreme conditions. Certus's digital IO solutions embody a strategic blend of power efficiency and advanced ESD protection that guarantees exceptional performance across a myriad of implementations.
The 16-bit Sigma-Delta ADC is crafted leveraging the advanced 55nm SMIC CMOS technology, tailored for applications requiring high-resolution audio capture and processing. This ADC features programmable gain and a selectable microphone bias, perfect for audio input, with specialized serial interfaces like PDM, I2S, and TDM. Offering a 16KSPS conversion rate and operating with a wide supply voltage range, it handles audio applications with ease, providing exceptional signal-to-noise ratios and efficient power usage. Its compact design not only ensures low current consumption but also facilitates easy integration into diverse audio systems.
iModeler simplifies the creation of process design kits (PDKs) for passive devices with rapid model synthesis across various nodes. Leveraging full-band 3D electromagnetic simulation, iModeler enhances the speed and accuracy of PDK modeling. The tool integrates seamlessly with Cadence Virtuoso, allowing users to control model parameters and configure complex on-chip passive devices such as inductors and capacitors. With its rich library of templates and dedication to optimizing parametric models, iModeler stands as a vital resource for the efficient and precise design of on-chip passive devices within different process environments.
I-fuse® technology leads the way in non-volatile memory with a non-explosive programming method that avoids thermal disruptions commonly associated with other memory systems. It reduces the footprint by a factor of ten compared to eFuse and can be implemented without extra masks or process steps across multiple foundries. With low programming voltage capabilities (1.1V/1.8V) and high data security features, it provides reliability tested up to 300°C, making it suitable for harsh environmental conditions, especially in automotive applications.
NuRAM Low Power Memory represents a breakthrough in memory technology, utilizing the reliable MRAM architecture to deliver fast access times while significantly reducing leakage power. This IP is a compelling choice for system designs looking to upgrade from traditional SRAM or nvRAM, as well as embedded Flash. Its innovative design allows for substantial size reduction, enabling more efficient memory footprints, which translates into reduced power needs and potentially minimal DDR memory access. Furthermore, the memory can be completely powered down without losing stored data, offering impressive power and latency optimizations that are critical for modern digital systems.
Toggle MRAM Technology from Everspin Technologies is a memory solution that melds non-volatility with the high-speed performance of RAM, enabling devices to have an "always-on" capability. This MRAM utilizes a single transistor and a magnetic tunnel junction (MTJ) to ensure high-density storage with excellent reliability and long-term data retention of up to 20 years even under significant thermal stress. This technology is designed to blend seamlessly into existing systems, delivering the speed of SRAM with the durability of non-volatile Flash memory in a single module. Its architecture fortifies data against power interruptions by automatically safeguarding it during voltage dips, making it ideal for essential applications across various sectors. The architecture of Toggle MRAM involves the use of magnetism in electrons to store information, which eliminates the typical wear-out associated with electrical charge memory. The magnetic properties grant it swift read/write capability, combined with robustness and longevity, making it particularly suitable for use in industrial IoT and other demanding environments. This MRAM uses a unique design consisting of a fixed magnetic layer opposite to a free one, separated by a thin dielectric, which helps maintain consistent data integrity. Toggle MRAM is especially advantageous in scenarios where data reliability and quick access times are critical, such as in industrial automation, telecommunications, and aerospace technologies. Its resistance-based read mechanism ensures efficient data retrieval, while its magnetic field writing technique enhances its performance by targeting specific memory locations without disturbing surrounding data. This makes it highly scalable and adaptable for various technological needs, thereby positioning it as a dynamically integrative component in modern architectures.
The LEE Fuse ZA offers a robust anti-fuse memory solution, optimized for one-time programmable (OTP) applications such as system trimming and memory redundancy setups. This IP eliminates the need for additional manufacturing masks, offering a cost-effective path to integration within wide-ranging process nodes from 180nm down to advanced sub-10nm technologies. Its design, requiring only two or three metal layers, offers flexibility in using upper metal layers for further circuit integration, broadening its applicability across several advanced process technologies. This feature ensures that the LEE Fuse ZA can seamlessly integrate into complex semiconductor environments without the substantial costs usually associated with new IP incorporation. LEE Fuse ZA's support for extensive temperature ranges and long retention periods makes it a valuable resource for automotive standard products requiring severe condition reliability. Its track record spans various manufacturing statuses, making it a mature choice for industries looking for a dependable OTP solution capable of handling modern technology nodes efficiently.
SmartMem Subsystem IP enhances ease of use and scalability by optimizing power, performance, and endurance across a variety of memory types, including NuRAM and other MRAM technologies, as well as RRAM, PCRAM, and embedded Flash. This versatile memory subsystem is fully synthesizable and configurable, making it an excellent choice for SOC designs that require customizable compute-in-memory solutions. SmartMem supports high performance in demanding environments, providing essential features for adaptive memory management that greatly improve the deployed memory's operational efficiency and effectiveness. Its value lies in its ability to improve the utility of existing memory technologies while offering a robust framework for new developments.
aiData introduces a fully automated data pipeline designed to streamline the workflow of automotive Machine Learning Operations (MLOps) for ADAS and autonomous driving development. Recognizing the enormous task of processing millions of kilometers of driving data, aiData employs automation from data collection to curation, annotation, and validation, enhancing the efficiency of data scientists and engineers. This crafted pipeline not only facilitates faster prototyping but also ensures higher quality in deploying machine learning models for autonomous applications. Key components of aiData include the aiData Versioning System, which provides comprehensive transparency and traceability over the data handling process, from recording to training dataset creation. This system efficiently manages metadata, which is integral for diverse use-cases, through advanced scene and context-based querying. In conjunction with the aiData Recorder, aiData automates data collection with precise sensor calibration and synchronization, significantly improving the quality of data for testing and validation. The aiData Auto Annotator further enhances operational efficiency by handling the traditionally labor-intensive process of data annotation using sophisticated AI algorithms. This process extends to multi-sensor data, offering high precision in dynamic and static object detection. Moreover, aiData Metrics tool evaluates neural network performance against baseline requirements, instantly detecting data gaps to optimize future data collection strategies. This makes aiData an essential tool for companies looking to enhance AI-driven driving solutions with robust, real-world data.
The Fast Access Controller (FAC) is a specialized solution developed by Intellitech, targeting efficient external flash programming in production environments. It is engineered to hasten on-board Flash memory programming, especially when configured with FPGAs, by utilizing a minimal bitstream through the 1149.1 bus. This IP is purpose-built for microcontroller, DSP, and CPU designers, aligning with the demands for enhanced design-for-test features and stronger programming performances in manufacturing processes.
Everspin's Parallel Interface MRAM is designed to offer a combination of high-speed performance and robust data storage capabilities. Compatible with SRAM, this MRAM supports both 8-bit and 16-bit parallel interfaces, providing data access times of 35 to 45 nanoseconds and handling an endurance beyond conventional limitations. The MRAM architecture ensures data persistence, protecting information against power failure scenarios via integrated low-voltage inhibit circuits that suspend writing operations if voltages go beyond specification limits. Available in multiple configurations ranging from 256Kb to 32Mb, the Parallel Interface MRAM is engineered to meet the demands of various applications needing fast data access and retention, especially in environments where data integrity is paramount. Its comprehensive support for a range of supply voltages (typically around 3.3 volts) and flexible timing specifications allow it to be integrated into diverse system architectures efficiently, catering to the needs of industries like automotive, aerospace, and data-driven infrastructure. This MRAM variant is particularly beneficial for systems that require dependable performance in less-than-ideal conditions — including high-frequency data logging in avionics and harsh automotive environments. The MRAM's quick response times and resistance to electrical fluctuations make it indispensable in maximizing operational reliability, helping to streamline system designs by removing the necessity of additional energy storage or backup components traditionally associated with data safeguarding.
SystemBIST is an advanced product offering from Intellitech that provides a plug-and-play solution for flexible FPGA configuration and embedded JTAG testing. It stands out with its proprietary architecture that allows for efficient, codeless configuration of field-programmable gate arrays (FPGAs) as well as built-in system testing capabilities. SystemBIST is designed to be vendor-neutral, supporting any FPGA or CPLD compliant with the IEEE 1532 or IEEE 1149.1 standards. This design enables robust anti-tamper measures and enhances system reliability by embedding JTAG test patterns directly into PCBs.
The LEE Flash G2 represents a cutting-edge evolution from its predecessor, offering enhanced memory capabilities and innovative features that cater to advanced electronic requirements. Built upon the proven architecture of the LEE Flash G1, the G2 version incorporates a clever switch transistor array, allowing for direct integration with logic circuits and enabling non-volatile SRAM functionalities. This design maintains a low power profile by not requiring high voltage for read operations and reduces layout complexity by eliminating isolation areas. This innovative flash solution is capable of supporting memory capacities up to several megabytes, making it ideal for applications that demand larger storage space while prioritizing energy efficiency. The G2 architecture also ensures compatibility with existing CMOS platforms without the need for changes in the SPICE model, facilitating the adoption of G2 technology within existing processes seamlessly. Other notable attributes include its suitability for high-temperature environments and long retention times, positioning it as a reliable option for automotive and industrial applications. The use of few additional masks further minimizes costs and accelerates production cycles, making G2 a cost-efficient choice for next-generation flash memory requirements.
PermSRAM is a sophisticated nonvolatile memory macro designed to operate on standard CMOS platforms, spanning process nodes from 180nm to 28nm and beyond. It supports a wide variety of nonvolatile memory functions, including a one-time programmable ROM and a pseudo multi-time PROM with exceptional multi-page configuration capabilities. The memory sizes range from 64 bits to 512Kbits, making it highly versatile for various applications. It features a non-rewritable hardware safety lock, specifically for secure code storage, ensuring data integrity and security.\n\nPermSRAM's robust design supports security code storage, program storage, and analog trimming, among other applications. It also provides features like gamma correction and chip ID management, making it suitable for complex tasks. The memory benefits from a compact silicon area, being tamper-resistant due to its invisible charge trap mechanism. Its built-in self-test circuits ensure seamless testing environments and all bits can be tested using conventional test equipment. Furthermore, it offers automotive-grade data retention capabilities, functioning optimally under high temperatures.\n\nCustomers benefit from its cost-efficiency, as it does not require a charge pump for read operations, which simplifies the design and lowers costs. The product's compatibility with conventional test strategies and its suitability for high-temperature environments make it an ideal choice for automotive applications and other demanding industrial uses.
DRAM modules are essential components used in a range of electronics, from gaming machines to medical devices. Avant's DRAM offerings are particularly noted for their compliance with JEDEC standards, which ensures interoperability and reliability across different systems and environments. Available in various configurations and designed to manage both low voltage and high power demands, Avant's DRAM caters to industrial, commercial, and consumer needs. Their embedded series of DIMMs offers extensive options, enabling a wide application spectrum, including use in point-of-sale and automation systems.
Spectral CustomIP offers a diverse set of silicon-proven, specialized memory architectures tailored for various integrated circuit applications. This comprehensive lineup includes options like Binary and Ternary CAMs, multi-ported memories, low voltage SRAMs, caches, and eFlash, showcasing Spectral's versatility in memory architecture design. Each CustomIP solution leverages foundry or custom bit cells to ensure robust counting while delivering high-density and low-power operations. These Speciality IPs focus on achieving speedy performance with minimal power use, aligning with the stringent demands of contemporary chip designs. Additionally, these are available in source code format, empowering users to further adapt the technology to their specific technological needs and capabilities. The range supports a multitude of features such as separate power rails, advanced compiler options, multiple aspect ratios, and comprehensive SOC integration views, making it applicable for a wide array of consumer electronics ranging from mobile devices to hearing aids. With rights-to-modify packages available, Spectral CustomIP allows for a breadth of customization to meet exacting specifications and market demands.
EverOn offers a silicon-proven Single Port Ultra Low Voltage (ULV) SRAM solution, providing up to 80% dynamic power savings and up to 75% static power reductions when operated within its voltage range of 0.6V to 1.21V. This high-performing SRAM meets the needs of cutting-edge applications, with cycle times as low as 20MHz at its minimum voltage, scaling up to over 300MHz. Its innovation lies in achieving remarkable power reductions while maintaining flexibility for applications in wearables and IoT, ensuring that devices remain functional across a wide range of power conditions.
The Stream Buffer Controller is engineered to provide a robust solution for managing data streams in Intel and AMD FPGAs, acting as a bridge to memory-mapped DMA. Its major function is to buffer data in external memory, essentially creating a virtual FIFO capable of handling up to 4 GB of data. The controller is notable for its ability to handle 16 independent streams, each configurable in terms of buffer size and operation mode, including FIFO, Write, Read, or ROM modes. This IP core is designed for seamless integration thanks to its AMBA AXI4-Stream interfaces, supporting easy access to external memory. Additionally, the design facilitates the development of standalone systems with VHDL-based stream configuration without the necessity of a CPU. Its adaptability provide ready-made solutions for data acquisition and image processing tasks, requiring precise data flow management. With features like data width conversion and a vendor-independent implementation, the Stream Buffer Controller is highly adaptable for a range of tasks including test and measurement applications, making it a versatile component in modern FPGA design workflows.
The LEE Flash ZT is engineered for automotive and industrial environments where high temperature and durability are critical. What sets the LEE Flash ZT apart is its zero additional mask requirement, significantly reducing manufacturing costs and enabling rapid integration within existing product lines. Its ability to maintain data retention over 20 years at 125°C demonstrates its reliability in demanding applications. Lee Flash ZT supports a wide range of use cases, making it ideal for precision trimming, parameter storage, and sensor integration in high-performance electronic devices. It leverages FN tunneling to achieve ultra-low power during program and erase cycles, which not only cuts down operation costs but also accelerates testing and final product release. Its compact form factor and compatibility with standard CMOS processes allow companies to re-use existing designs and IPs, eliminating the need for bespoke development efforts. This adaptability combined with its performance characteristics makes it a viable solution for manufacturers looking to enhance their product lines without incurring substantial initial investments or production delays.
Spectral's MemoryIP encompasses a suite of silicon-proven, high-density, low-power SRAMs, built to optimize embedded systems. Offering six core compiler architectures, including Single Port and Dual Port SRAMs, ROM, and Register Files, these designs integrate advanced circuitry to maintain high-speed operations while minimizing power use. The solutions use either foundry or Spectral custom bit cells, ensuring solid performance coupled with spectral capabilities available in source code for further customizability. The MemoryIP is crafted not just for efficiency, but for adaptability, supporting multiple aspect ratios and high-density designs. Features such as separate power rails enhance flexibility and performance optimization across various scenarios. MemoryIP libraries support a full integration view set, easing the implementation process for developers and ensuring seamless compatibility with modern CMOS processes. This product line is also distinguished by the integration of SpectralTrak™ technology, which dynamically monitors environmental changes to safeguard critical memory operations. With options for deep customization and licensing, Spectral MemoryIP remains a versatile choice for fabless companies and foundries seeking a foundational memory library that delivers performance and efficiency.
RAAAM's GCRAM technology revolutionizes on-chip memory by offering significant enhancements over traditional SRAM. It facilitates up to a 50% reduction in silicon area and a dramatic tenfold drop in power consumption, translating into significant cost savings for chip manufacturing. Utilizing a standard CMOS process, GCRAM requires no additional masks, maintaining production simplicity while extending the benefits of Moore's law. This makes it an ideal choice for applications in AI, ML, AR/VR, automotive, and high-performance computing sectors.
CrossBar's ReRAM Memory is a pioneering memory solution that significantly enhances data storage capabilities for modern applications. Employing a minimalist three-layer structure, ReRAM Memory utilizes a silicon-based switching medium between two electrodes to facilitate resistive switching. This setup results in a highly stable memory cell that operates across varied temperatures and conditions. ReRAM Memory's ability to scale vertically in 3D allows it to deliver extensive terabyte-level storage on a single chip, alongside providing incredible endurance and rapid read/write capabilities. The technology's compatibility with standard CMOS processes facilitates easy integration into existing manufacturing setups, making it highly versatile for a wide range of applications, from IoT devices to data centers, and more. Notably, ReRAM Memory's unique design addresses some critical challenges facing conventional memory technologies. By reducing energy consumption to a mere 1/20th of traditional memory solutions, it delivers unmatched performance, sustaining up to 1000 times more write cycles and operating reliably with significant endurance and retention capabilities. Furthermore, its potential to be combined directly with logic circuits in a foundry augments the memory performance significantly while optimizing space and power requirements. Applications of ReRAM Memory spread across various domains such as artificial intelligence, mobile computing, and secure computing. Its benefits are clearly outlined in its secure features, where the memory is deployed for developing advanced applications involving secure cryptographic keys and tamper-resistant solutions. This makes ReRAM Memory an ideal choice for scenarios demanding high security and reliability, paving the way for future innovations in the semiconductor industry. CrossBar's ReRAM Memory showcases a perfect blend of cutting-edge design and practical implementation potential, enabling the semiconductor field to explore new possibilities in data processing and storage technologies. As digital landscapes continue to evolve, CrossBar's ReRAM offers lifecycle improvements and operational efficiencies that align with the industry's growing needs for high-density, reliable, and energy-efficient memory technologies.
Xenergic's High-Speed Low-Power SRAM IP is designed to deliver maximum power efficiency without compromising on performance. This solution sees significant reductions in dynamic power usage and leakage, while maintaining high speeds and a competitive area. It is specifically optimized for applications such as IoT, sensors, and wearables, where conserving power is critical due to limited power budgets. The SRAM architecture supports better power optimization through both dynamic and static adjustments, positioning it as an ideal choice for always-on applications. By leveraging its low power nature, it enables efficient computation at the edge, particularly valuable in the burgeoning IoT landscape, ensuring reduced latency and improved device performance.
Sensor Interface Derivatives are critical in bridging the analog and digital realms, especially in the burgeoning Internet of Things (IoT) market. These devices convert various analog signals—like temperature, voltage, and geographical position—into digital form for seamless integration with digital systems. Designed for durability in varying environmental conditions, these interfaces ensure autonomous and long-lived battery performance. ASIC North's sensor interface solutions excel in managing radio communication interfaces and include built-in digital signal processing to filter data before transmission, enhancing efficiency. They feature a sensor concentrator capability that stimulates sensors while measuring responses across multiple channels, adeptly handling various signal types through robust interface circuits. With extensive experience in Analog to Digital and Digital to Analog conversion, ASIC North has successfully deployed millions of these interfaces with a high production yield, underscoring their reliability and quality. These interfaces not only withstand environmental stresses but also offer a long battery life, making them ideal for IoT applications.
TwinBit Gen-1 by NSCore is an innovative non-volatile memory solution that leverages electrical erase operations. It offers a memory density ranging from a minimum of 64 bits to a maximum of 512K bits, engineered to perform multiple program/erase cycles without additional masking layers, ensuring cost-effectiveness. The design is compatible with CMOS logic processes, supporting process nodes from 180nm to 55nm, which allows seamless integration into advanced technological environments. Its security features make it suitable for storing security keys and analog trimming data required for specific applications.\n\nThis memory technology emphasizes high endurance, with the ability to endure more than 10,000 program and erase cycles. TwinBit Gen-1’s design mandates no extra masks or process alterations, incorporating a true logic-based approach for non-volatile memory development. It supports a broad spectrum of applications including IoT devices, microcontrollers, field-programmable gate arrays (FPGAs), and application-specific standard products with re-writable firmware.\n\nIn terms of reliability, TwinBit Gen-1 is capable of automotive-grade data retention according to AEC-Q100 standards, making it ideal for applications that require low-voltage and low-power operation. Its built-in testing mechanisms facilitate stress-free verification, ensuring that it only requires conventional test equipment. The memory's durability, combined with cost-efficient production, positions it as an optimal choice for specialized sectors needing flexible memory solutions.
The Vega eFPGA is a flexible programmable solution crafted to enhance SoC designs with substantial ease and efficiency. This IP is designed to offer multiple advantages such as increased performance, reduced costs, secure IP handling, and ease of integration. The Vega eFPGA boasts a versatile architecture allowing for tailored configurations to suit varying application requirements. This IP includes configurable tiles like CLB (Configurable Logic Blocks), BRAM (Block RAM), and DSP (Digital Signal Processing) units. The CLB part includes eight 6-input Lookup Tables that provide dual outputs, and also an optional configuration with a fast adder having a carry chain. The BRAM supports 36Kb dual-port memory and offers flexibility for different configurations, while the DSP component is designed for complex arithmetic functions with its 18x20 multipliers and a wide 64-bit accumulator. Focused on allowing easy system design and acceleration, Vega eFPGA ensures seamless integration and verification into any SoC design. It is backed by a robust EDA toolset and features that allow significant customization, making it adaptable to any semiconductor fabrication process. This flexibility and technological robustness places the Vega eFPGA as a standout choice for developing innovative and complex programmable logic solutions.
Engineered for efficiency, the 65nm 8-channel 12-bit ADC is targeted at low power applications requiring reliable data conversion. It features a conversion rate up to 1MSPS, suitable for high-speed data acquisition systems. The ADC operates within an analog power range of 2.4V to 3.6V and a digital power range of 1.08V to 1.32V, leveraging its compact design for integration in systems where space and power-saving are priorities. Its steady performance in varied voltage and temperature conditions makes it ideal for battery-powered and remote sensing applications.
The Serial Peripheral Interface (SPI) MRAM from Everspin features rapid data transfer using a minimalistic pin configuration, optimized for efficient use in space-constrained applications. This MRAM is engineered for applications where quick storage and retrieval are critical, such as in advanced RAID controllers and state-of-the-art server system logs. It operates with speed and efficiency, delivering data transfer rates up to 52MB/s using a quad SPI configuration, surpassing traditional parallel interfaces in performance and flexibility. The MR10Q010, Quad SPI MRAM, epitomizes high-speed access facilitated by a 16-pin small-form-factor package, making it an excellent choice for embedded systems and storage buffers where space and power efficiency are of paramount importance. Its ability to function under a 3.3V power supply, with an adaptive 1.8V I/O operation, underscores its versatility across different system voltages and configurations, making it a go-to solution for next-generation electronics. This versatile MRAM's suitability spans various realms, providing reliable data storage and quick access in systems requiring intense data throughput under constraints of space and energy. It is tailored for applications where the impact of non-volatility and low latency can substantially elevate system performance, thereby serving crucial roles in embedded computing, storage applications, and flexible data solutions across platforms.
SEMIFIVE's SoC platform provides a rapid and cost-effective path to developing purpose-built custom silicon solutions. By leveraging silicon-proven IPs and optimized design methodologies, this platform aims to lower costs, reduce risks, and accelerate time-to-market. The platform is distinguished by its domain-specific architecture, which supports a pre-configured and verified IP pool, allowing for a swift hardware/software bring-up. This platform empowers companies to turn their ideas into silicon efficiently, minimizing development costs and engineering risks. The SoC platform's benefits include significant cost savings with up to 50% lower non-recurring engineering (NRE) costs compared to the industry average. It also ensures a rapid turnaround time, up to 50% faster than typical timelines, due to its pre-verified design components and reuse capabilities. The platform's pre-established IP pools, which are selected, configured, implemented, and verified, simplify the engagement model, promising a comprehensive suite of services from architecture to manufacturing. Technical highlights of the SoC platform include configurations for AI inference with a SiFive quad-core U74 RISC-V CPU, LPDDR4x memory interfaces, and PCIe Gen4 connectivity, optimized for applications like big data analytics and vision processing. The SoC platform also supports AIoT and HPC applications, featuring scalable configurations for various performance demands and integration flexibility for customer-specific IPs.
The 12-bit 1MSPS ADC, utilizing Samsung's 100nm LF6 CMOS technology, is engineered for a broad operating range with a maximum conversion rate of 1MHz at nominal conditions. It accommodates an analog input range that extends from ground level to the supply voltage, offering a strong signal-to-noise ratio and excellent dynamic performance. With low power consumption and a robust design, it is suitable for a wide array of measurement applications. This ADC is particularly efficient with a minimal power down current, supporting various configurations of high-speed and precision-demanding tasks.
Designed to replace traditional laser fuses, I-fuse® Replaser provides comprehensive benefits in terms of programming and operational reliability. Its operation is characterized by low power requirements for both programming and reading, coupled with rapid response time, ensuring it meets rigorous industry standards like the AEC-Q100 Grade 0. It functions well in environments spanning -40°C to 150°C, further broadening its applicability in tough conditions. With attributes like low program/read voltage and soft programming features for pre-testing, it enables flexible integration into designs requiring efficient space use.
TwinBit Gen-2 represents the next evolution of non-volatile memory from NSCore, designed for advanced semiconductor processes from 40nm down to 22nm. This generation preserves the TwinBit legacy of not requiring additional masks or process steps, thus maintaining cost efficiency for large-scale applications. It incorporates a novel Pch Schottky Non-Volatile Memory Cell structure, which enables ultra-low-power operations essential for today’s energy-conscious applications.\n\nThe Pch Schottky NVM cell is engineered for minimal power consumption, helping clients design products that are power-efficient while providing reliable memory solutions. TwinBit Gen-2 supports a range of sophisticated applications, including hot carrier injection control via cell biasing, suitable for program and erase operations. Enhancements in hot-hole generation distribution during programming, and hot-electron distribution during erasing, contribute to its improved performance metrics.\n\nThe IP is suitable for high-performance applications requiring a combination of low power consumption and high-density memory solutions. Its design favors applications in modern consumer electronics and automotive industries that require state-of-the-art memory solutions to manage increasingly complex data processing needs efficiently and reliably.
Tower Semiconductor's Non-Volatile Memory Solutions offer advanced memory technology for a wide range of applications. This platform specializes in memory retention without power, crucial for devices that require data persistence. The NVM solutions encompass a variety of memory types, including EEPROM and Flash, enabling reliable data storage across sectors. These solutions are characterized by high reliability and endurance, making them suitable for industrial, consumer, and automotive applications. The ability to sustain numerous write/erase cycles without degradation ensures longevity and durability, critical in environments where stable memory performance is essential. The NVM Technology from Tower Semiconductor is designed to integrate easily with various logic processes, fostering efficient semiconductor design. This capability allows for the creation of optimized systems that enhance performance while minimizing energy consumption, aligning with industry demands for greener, more sustainable technologies.
The 55nm 8-channel 12-bit ADC is designed for energy-efficient applications requiring precision data conversion. This ADC stands out with its low power consumption, operating at 1.1mA typically, and providing a wide input voltage range from 2.4V to 3.6V. It achieves conversion rates between 0.1MSPS and 1MSPS, making it adaptable for varied data acquisition tasks. With a size-optimized core and capabilities like single-ended inputs, the ADC is perfect for space-constrained projects demanding low power. The device is compact, facilitating integration into power-sensitive environments like sensor networks or portable data systems.
Magnetoresistive Random-Access Memory (MRAM) is a cutting-edge memory technology widely acclaimed for its stability and endurance. DXCorr has engineered MRAM solutions that deliver non-volatility and fast write and read speeds, positioning it as a reliable memory choice for diverse applications ranging from consumer electronics to high-performance computing. MRAM technology is distinguished by its ability to offer higher endurance compared to traditional RAMs, mainly due to its robust magnetic storage elements. This characteristic extends the memory's lifespan and efficiency in data retention, minimizing data loss and ensuring reliable performance across various operating environments. As computing demands scale, MRAM serves as a steadfast component facilitating seamless data management and retrieval processes. Incorporating DXCorr’s MRAM into systems not only bolsters data security but also enhances energy efficiency, a crucial factor in the design of sustainable computing solutions. Its incorporation into semiconductor designs helps in achieving superior power-performance metrics while maintaining robustness, making it a pivotal choice for modern memory-intensive applications.
Xenergic's High-Speed Turbo Memory IP represents a significant evolution in high-speed data processing. This memory architecture leverages predictable access patterns to achieve tremendous reductions in power usage and chip area. By exploiting these predictable patterns, such as those found in AI and graphic processing applications, it manages to operate at double the speed of the fastest current SRAMs available. This solution reduces dynamic power consumption by 80%, diminishes leakage by up to 60%, and minimizes area by 60%, all while maintaining cutting-edge performance capabilities. Its design supports high throughput for applications scalable to large buffer and cache systems, making it perfect for ML, AI, and advanced image processing tasks.
The TSP1 Neural Network Accelerator from Applied Brain Research is a cutting-edge AI solution built to handle complex AI workloads with remarkable efficiency. Designed specifically for battery-powered devices, this chip excels in low-power operations while processing extensive neural network tasks. At its core, the TSP1 integrates state-of-the-art processing capabilities tailored for time series data, essential for applications like natural voice interfaces and bio-signal classification. This innovative chip is notable for its energy efficiency, consuming less than 10mW for complex AI tasks, making it an ideal solution for energy-conscious applications. Furthermore, it supports an array of sensor signal applications, ensuring versatile functionality across different domains including AR/VR, smart home automation, and medical wearables. By incorporating the Legendre Memory Unit, a proprietary advanced state-space neural network model, the TSP1 achieves superior data efficiency compared to traditional network architectures. ABR’s TSP1 stands out for its ability to perform powerful AI inferences with low latency, essential for real-time applications. It supports a wide range of interfaces, making it suitable for diverse integration scenarios, from voice recognition to industrial automation. Additionally, the chip's optimized hardware is key for algorithm scaling, facilitating smooth processing of larger neural models without compromising speed or performance.
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