LEE Fuse ZA stands out as an Anti-Fuse Non-Volatile Memory suitable for trimming tasks that do not demand reprogramming. This solution is particularly valued for its application in memory redundancy without the necessity for additional manufacturing steps or mask alterations.
ZA leverages a low-complexity manufacturing methodology needing only a basic metal layer setup, distinguishing itself by its suitability for advanced processes. With its versatile compatibility across various process nodes from 180nm to sub-10nm, it is a practical choice for diverse technological requirements.
This memory type excels in high-temperature applications, making it particularly useful in automotive sectors where reliability and durability over extended operational periods are crucial. As a proven design, ZA caters to projects looking for cost-effective, robust, and easy-to-deploy NVM solutions.
