LEE Flash G1 is a highly efficient SONOS-based embedded Flash solution tailored for medium capacity memory requirements. By leveraging a refined SONOS architecture, it ensures minimal changes to existing standard CMOS processes, allowing for seamless integration into current designs without altering the logic characteristics. G1 supports high-temperature reliability and long-term data retention, making it an ideal choice for automotive applications.
This product excels in reducing cost thanks to its low power consumption during programming and erasure operations, supported by 2 to 3 additional masks, a significant economization compared to typical Flash solutions. The architecture supports a high number of program/erase cycles and guarantees stable retention over temperature extremes, which is crucial for automotive and industrial applications.
Its architecture allows for the reuse of existing IP assets, thus eliminating the need for additional expensive investments on Flash technology-specific designs. Manufacturing adaptations are minimal, aimed at keeping chip costs low while delivering reliable, high-speed performance.
