LEE Flash G1 is a highly cost-effective embedded Flash solution optimized for scalability down to a 40nm process, making it an excellent fit for medium memory capacity applications requiring up to several hundred kilobytes. Built on a simplified SONOS architecture, it supports automotive-grade temperature and quality standards. The G1 model allows seamless integration with standard CMOS processes, preserving existing IPs and macros without altering the SPICE model of logic transistors, thus avoiding costly redesigns. Its minimal mask requirement (2-3 additional masks) further ensures a cost-efficient setup, with reduced testing and bake times achieved through innovative power management techniques. Proven for long-term data retention in high-temperature conditions, LEE Flash G1 demonstrates unparalleled endurance and performance for demanding embedded applications.
