Hermes Layered is a sophisticated tool dedicated to 3D finite element method (FEM) simulation, aimed at IC, package, and PCB applications. This tool enhances the designer's ability to analyze complex electromagnetic interactions within layered structures. Its advanced simulation capabilities ensure that critical design metrics such as signal integrity and electromagnetic compatibility are thoroughly evaluated.
The power of Hermes Layered lies in its ability to manage detailed simulations of multiple layers, essential in the design of high-performance ICs and advanced packaging systems. By providing designers with a thorough analysis of electromagnetic effects, Hermes Layered helps optimize designs to ensure both reliability and functionality.
This tool is indispensable for those engaged in cutting-edge IC and PCB design, where the ability to predict and mitigate potential EM challenges can significantly impact the success of the final product. Hermes Layered offers precision and quality insights needed to meet the high demands of today's electronic systems.
