The E-DIP integrated diplexer is a pioneering product among E-band diplexers, conceived to function within Multifractal's high-performance CMOS-based systems. This product represents a leap in miniaturization and efficiency, designed to be the smallest diplexer available commercially. With its compact size of 3.8 x 4.5 mm, it aligns with current industry demands for more compact components without sacrificing performance.
The E-DIP is designed to be highly compatible with various packaging standards including FCCSP and BGA, ensuring that it integrates smoothly with existing systems and new deployments. This compatibility, combined with high out-of-band suppression exceeding 60 dB, makes the E-DIP a critical component for ensuring reliable signal transmission in high-frequency application scenarios.
This diplexer achieves a balance of minimal insertion loss and high degree of suppression, which translates to efficient signal management and improved overall network performance. By leveraging BT laminate substrate technology, it exemplifies Multifractal's forward-thinking approach in the deployment of high-functionality, compact form factor components.
