The E-DIP is a state-of-the-art integrated diplexer that represents a leap forward in diplexer design for E-band applications. Notably compact, it is crafted using a BT laminate substrate that is suitable for plastic IC packaging. This component is characterized by high out-of-band suppression and low insertion loss, making it ideal for applications requiring tight frequency control and efficiency. Its small size and robust performance make it an attractive option for modern high-frequency systems.
