The Die-to-Die (D2D) Interconnect solution by SkyeChip is a comprehensive technology facilitating high-speed data transfer between dies. Compliant with the UCIe 2.0 specification, it provides high bandwidth and minimal power overhead making it ideal for chiplet-based architectures. This lightweight interconnect supports diverse protocols such as PCIe and CXL, allowing adaptability to numerous communication requirements. It is designed to support major packaging technologies, ensuring flexibility and robustness in post-package yields and supporting loopback tests for integrity assurance.
