SkyeChip's Die-to-Die (D2D) Interconnect is a lightweight solution crafted to deliver superior performance with minimal power and area overhead. Adaptable to any communication protocol, this interconnect extends the capabilities of both non-coherent and coherent NOC configurations across multiple dies. It significantly reduces wiring across dies, supporting transfer rates up to 6.4GT/s. This interconnect is compatible with major 2.5D and 3D IC packaging technologies, providing a robust solution for advanced chipset applications and ensuring optimal cross-die communication with minimal resource consumption.
