All IPs > Analog & Mixed Signal > RF Modules
In the dynamic world of semiconductor IPs, RF Modules play a crucial role in ensuring seamless wireless communication across a wide range of devices. RF, standing for Radio Frequency, refers to the technology that utilizes electromagnetic spectrum frequencies to transmit data wirelessly, thereby eliminating the need for physical connection and enabling greater flexibility and convenience in electronic systems. Our RF Modules category within the Analog & Mixed Signal primary category consists of a diverse collection of products designed to facilitate this wireless interaction by offering effective solutions for complex radio frequency circuits.
The applications of RF Modules semiconductor IPs are vast and versatile, encompassing a multitude of industries including consumer electronics, telecommunications, automotive, and industrial systems. In consumer electronics, RF modules are crucial for developing devices such as smartphones, smartwatches, and wireless earbuds, where they help in managing and optimizing data transmission over wireless networks. Telecommunications heavily rely on these modules for building robust infrastructure, enabling efficient data handling in mobile networks and satellite communications.
Moreover, in the automotive sector, RF modules contribute to the advancement of vehicle connectivity technologies, supporting features like keyless entry, tire pressure monitoring systems, and vehicle-to-everything (V2X) communication. Similarly, in the industrial domain, these modules are fundamental components in systems that require reliable long-distance wireless communication, such as in smart grid applications and remote monitoring systems.
Within the RF Modules category, you will discover a comprehensive selection of semiconductor IPs tailored to meet various design specifications. These include components that support different frequency bands, offer varying levels of integration, and are designed to comply with a range of communication standards and protocols. Whether you need baseband processors, RF transceivers, or complete system-on-chip solutions, our RF Modules in Analog & Mixed Signal provide ample choices for engineers and designers looking to enhance the performance, reliability, and functionality of wireless-enabled products.
CoreVCO represents CoreHW's commitment to delivering innovative wideband voltage-controlled oscillator (VCO) solutions, particularly suited for extremely demanding environments. Constructed utilizing robust SiGe technologies, the CoreVCO incorporates dual radiation-hardened VCOs, catering effectively to applications requiring minimal phase noise and resilient performance. The VCO operates over wide frequency ranges—0.7 GHz to 6.6 GHz—utilizing two distinct oscillator designs (VCOPMOS and VCOBJT). Its ability to maintain low phase noise under harsh conditions makes it ideal for critical applications like military communication systems and space exploration. The design's intrinsic radiation hardness ensures operational continuity where reliability is paramount. CoreHW's CoreVCO incorporates a host of integrated features such as bandgap references, low-dropout regulators, and SPI interfaces for precise control and tuning. With its small form factor, it serves as an efficient solution for a range of high-reliability wireless and communication systems, offering consistent performance across various operating conditions.
The ORC3990 is a sophisticated System on Chip (SoC) solution designed for low-power sensor-to-satellite communication within the LEO satellite spectrum. Utilizing Totum's DMSS technology, it achieves superior doppler performance, facilitating robust connectivity for IoT devices. The integration of an RF transceiver, power amplifiers, ARM CPUs, and memory components makes it a highly versatile module. Leveraging advanced power management technology, this SoC supports a battery life that exceeds ten years, even within industrial temperature ranges from -40 to +85°C. It's optimized for usage with Totum's global LEO satellite network, ensuring substantial indoor signal coverage without the need for additional GNSS components. Efficiency is a key feature, with the chip operating in the 2.4 GHz ISM band, providing unparalleled connectivity regardless of location. Compact in design, comparable in size to a business card, and designed for easy mounting, the ORC3990 offers sought-after versatility for IoT applications. The ability to function with excellent TCO in terms of cost compared to terrestrial IoT solutions makes it a valuable asset for any IoT deployment focused on sustainability and longevity.
This innovative chiplet offers a complete transmission solution, integrating a 16-channel 112G modulator and driver. The chip is designed for optimal performance in transmitting optical signals and features advanced digital control for precision tuning and stability. It is built to support systems requiring high bandwidth and efficient modulation, making it ideal for deployment in next-generation telecommunication networks. The combination of integrated modulator and driver ensures reduced power consumption and higher signal integrity, addressing the needs of modern data center applications.
The H-Series PHY supports the latest in high-speed memory interfaces, specifically engineered for comprehensive compatibility with a range of memory standards. By generating extensive support ecosystems including Design Acceleration Kits, this PHY aims to streamline integration and enhance performance for high-demand applications. With significant emphasis on minimizing die size, while optimizing both performance and latency, this PHY is particularly useful for graphics and compute-intensive operations where speed and reliability are paramount.
This ISM Band RF IP provides a comprehensive solution designed for integration into BLE applications, offering a robust platform with GF 22FDX process node capabilities. Its components include an advanced RF transceiver and digital power amplifier, achieving a peak power output of +23 dBm. The IP optimizes signal strength and minimizes space requirements with an integrated balun and matching network. Designed for versatility, the ISM Band RF IP is adaptable across different process nodes, making it a flexible choice for customers seeking to develop sophisticated RF ICs. The transceiver is in line with modern communication standards and is particularly useful for applications in low-power communication environments. This flexibility allows for the development of cost-effective, high-performing merchant market ICs. Orca Systems ensures that their IP can be efficiently licensed and integrated into various systems, promoting a streamlined and effective path to market for BLE developers. The focus on reduced power consumption and enhanced signal capabilities underscores the value of this IP in expanding and enhancing wireless communication methodologies.
The MIPITM CSI2MUX-A1F operates as a sophisticated CSI2 video multiplexor designed to handle multiple camera inputs simultaneously. In compliance with CSI2 rev 1.3 and DPHY rev 1.2 standards, this multiplexor can manage inputs from up to four CSI2 cameras, consolidating them into a single comprehensive video stream. Engineered for high-efficiency video streamlining, it operates at a data rate of 4 x 1.5Gbps, ensuring real-time processing and efficient data throughput. The ability to integrate multiple video feeds into a single output makes it suitable for systems requiring complex multimedia handling and advanced video applications. This multiplexor provides solutions for systems where video data from various sources needs to be aggregated efficiently, optimizing space and resource utilization across video interfaces. Its seamless integration expands its utility across multiple paradigms, making it a staple in any comprehensive video system architecture.
The THOR Toolbox is designed to provide robust NFC and UHF connectivity solutions, enabling efficient wireless communication across devices. This toolbox is crucial for developing products that require seamless integration of near-field communication and ultra-high-frequency radio tags, which are instrumental in applications such as inventory management and product tracking. THOR Toolbox facilitates easy development and integration, offering a complete set of tools necessary for prototyping and testing NFC and UHF features. It allows engineers to validate their design concepts quickly and effectively, ensuring that the final product meets all necessary specifications and standards. By utilizing the THOR Toolbox, designers can expedite the design process, minimize time-to-market, and enhance the functionality and reliability of their products. It is particularly valuable in environments where data security and seamless connectivity are paramount, ensuring that products are future-proofed for evolving standards and requirements in communication technology.
The RF/Analog offerings from Certus Semiconductor represent cutting-edge solutions designed to maximize the potential of wireless and high-frequency applications. Built upon decades of experience and extensive patent-backed technology, these products comprise individual RF components and full-chip transceivers that utilize sophisticated analog technology. Certus's solutions include silicon-proven RF IP and full-chip RF products that offer advanced low-power front-end capabilities for wireless devices. High-efficiency transceivers cover a range of standards like LTE and WiFi, alongside other modern communication protocols. The design focus extends to optimizing power management units (PMU), RF signal chains, and phase-locked loops (PLLs), providing a full-bodied solution that meets high-performance criteria while minimizing power requirements. With the ability to adapt to various process nodes, products in this category are constructed to offer definitive control over power output, noise figures, and gain. This adaptability ensures that they align seamlessly with diverse operational requirements, while cutting-edge developments in IoT and radar technologies exemplify Certus's commitment to innovation. Their RF/Analog IP line is a testament to their leadership in ultra-low power solutions for next-generation wireless applications.
The MIPITM SVRPlus-8L-F is an advanced 8-lane second-generation serial video receiver tailored for FPGA applications. It adheres to the CSI2 rev 2.0 and DPHY rev 1.2 standards, featuring an impressive ability to handle 16 virtual channels and output 4 pixels per clock. The receiver boasts a robust calibration support mechanism coupled with comprehensive communication error statistics, making it an optimal choice for high-performance video applications. Operating at a substantial data rate of 12Gbps, the IP is designed to meet the high demands of modern video systems. Its integration ease and high functionality are supported by its detailed error-reporting capabilities, which provide invaluable insights for system improvements. This IP's architecture is ideal for ensuring seamless video data reception, maintaining integrity, and optimizing performance. Further enhancing its effectiveness, the MIPITM SVRPlus-8L-F is equipped with calibration support, offering a complete package for efficient and reliable video signal processing in varied environments.
The ADQ35-WB is a robust data acquisition module designed to handle both high-frequency and dual-channel applications at a high sampling rate. It offers either a dual-channel configuration at 5 GSPS or a single-channel setup at 10 GSPS. The digitizer boasts a significant 9.0 GHz usable analog input bandwidth, making it ideal for complex and high-demand applications such as RADAR, LiDAR, and scientific research. Equipped with an open onboard Xilinx Kintex Ultrascale KU115 FPGA, the ADQ35-WB provides substantial resources for custom real-time digital signal processing. This module also supports high-speed peer-to-peer streaming of data to GPUs or CPUs at speeds up to 14 Gbyte/s. This high throughput is complemented by advanced triggering options, making it highly functional for sophisticated data handling and processing. In terms of practical usage, the ADQ35-WB includes a comprehensive suite of hardware options, firmware, and software tools designed for straightforward integration into existing systems. This includes the default data acquisition firmware, optional waveform averaging, and pulse detection firmware, as well as a development kit for customized FPGA development.
The MIPITM SVRPlus2500 is an efficiently designed 4-lane video receiver that meets the challenges of contemporary video systems through its compliance with CSI2 rev 2.0 and DPHY rev 1.2 standards. This device is crafted for high-performance applications, featuring a low clock rating that facilitates easy timing closure and supports PRBS. Capable of handling 4/8/16 output pixels per clock, this receiver includes innovative calibration support and 1:16 input deserializers per lane. Its 16 virtual channels empower it to manage robust data streams, operating effectively at a data throughput of 4 x 2.5Gbps, which ensures high fidelity in video reception. The SVRPlus2500 stands as a versatile solution for diverse video processing needs, balancing performance and integration with ease. Its reliability in managing high data rates and providing seamless video reception makes it ideal for a wide array of advanced video applications.
Designed for FPGA contexts, the MIPITM SVTPlus-8L-F is a sophisticated 8-lane second-generation serial video transmitter. Adhering to the stringent requirements of the CSI2 rev 2.0 and DPHY rev 1.2 standards, this transmitter delivers data at an impressive 12Gbps. It stands out for its seamless integration into video systems, offering unparalleled data transmission capabilities and upholding the fidelity of transmitted signals. The transmitter is designed to support high data loads, ensuring that it can handle intensive video applications with ease. Its design not only facilitates robust data rates but also ensures that the transmitted signals maintain clarity and accuracy, essential for advanced video processing systems. By incorporating modern design methodologies, the MIPITM SVTPlus-8L-F ensures reliable data flow, minimal transmission errors, and enhanced system performance. This transmitter is a pivotal addition to any advanced digital video system, providing essential high-speed data transmission features.
The MIPITM V-NLM-01 is specialized for efficient image noise reduction using non-local mean (NLM) algorithms. This resourceful hard core supports parameterized search-window sizes and a customizable number of bits per pixel to enhance visual output quality remarkably. Designed to facilitate HDMI outputs at resolutions up to 2048×1080 at frame rates ranging from 30 to 60 fps, it delivers flexibility for numerous imaging applications. Its efficient implementation renders it suitable for tasks demanding high-speed processing and precise noise reduction in video outputs. The MIPITM V-NLM-01’s algebraic approach to noise reduction ensures exceptional image clarity and fidelity, making it indispensable for high-definition video processing environments. Its adaptability for variable processing requirements makes it a robust solution for current and future video standards.
The mmWave PLL by CoreHW is a sophisticated frequency synthesizer designed to meet the demands of modern wireless communication networks and radar systems. It features a high-accuracy fractional-N PLL frequency synthesizer with a very low noise voltage-controlled oscillator (VCO). This design supports efficient generation of low phase noise carriers and rapid chirp frequency modulations required for fast-frequency modulated continuous wave (FMCW) radar. Operating initially in the frequency range of 19.00-20.15 GHz, the mmWave PLL is engineered to extend to radar frequency bands from 38-40.5 GHz and even further to 76-81 GHz through frequency multipliers. Its scalable frequency configuration makes it suitable for diverse applications including 5G networks and various mmWave communication devices, providing flexibility for adaptation to specific needs. Key features include integrated bandgap references, low-dropout regulators (LDOs), and integrated frequency multipliers. The PLL supports fractionally precise chirp modulation capabilities, making it ideal for automotive radar applications like collision avoidance and distance measurement. The device is robust, maintaining optimal performance across a wide temperature range, and includes comprehensive built-in self-test and calibration features to facilitate reliable deployment in high-demand environments.
ArrayNav is an innovative GNSS solution that employs multiple antennas, enhancing sensitivity and accuracy to combat common issues like multipath interference and signal jamming. This technology is designed to increase the effectiveness of global positioning systems by using adaptive antenna systems, a concept borrowed from advanced wireless communications. ArrayNav provides up to 18dB gain in signal strength for fading channels and ensures robust performance even in complex environments like urban canyons. By identifying and nulling unwanted signals, it maintains the integrity of GNSS operations against spoofing and interference. This technology is vital for applications needing high precision under challenging signal conditions. With its sophisticated antenna diversity, ArrayNav is crafted to deliver sub-meter precision and swift signal acquisition. This makes it a valuable component for navigation in densely constructed urban landscapes or covered environments where satellite visibility might be obscured. ArrayNav's capability to handle multipath and interference issues effectively makes it a preferred choice for high-reliability navigation systems, contributing to both enhanced security and accuracy.
Hermes 3D is crafted for the simulation of arbitrary 3D structures, offering unparalleled insights into electromagnetic performance across a variety of applications. Its core strength lies in providing high-precision FEM simulations that support the evaluation of complex geometrical designs typical in today's advanced electronic circuits. Hermes 3D empowers engineers with the capability to investigate and optimize diverse electromagnetic interactions within detailed 3D structures. This function is particularly essential when working with components that require precise behavior predictions under various operational conditions, ensuring that systems maintain their integrity and performance over time. By facilitating rigorous analysis, Hermes 3D aids in reducing costly design iterations and enhances efficiency in the product development cycle. Its application in arbitrary structural simulations makes it an essential tool for any designer seeking to ensure their systems are both innovative and reliable.
Vantablack S-VIS Space Coating is a pioneering solution designed for the suppression of stray light in space applications. This coating excels in optical performance by absorbing nearly all incident light, thereby providing unmatched minimization of reflection. As a result, it enhances the calibration of optical instruments used in space, critical for precise astronomical measurements and other space exploration applications. Vantablack S-VIS is formulated to withstand the harsh conditions of space, maintaining its superior blackening properties without degradation even in extreme environments. The use of Vantablack S-VIS offers significant advantages to scientific missions by improving the accuracy and reliability of data collected through telescopes and other space-borne instruments. Unlike traditional paints and coatings, Vantablack S-VIS can be applied to complex optical structures without affecting their functionality. This makes it an essential component in designing systems that operate in high-precision, and high-sensitivity environments where error margins are minimal. In addition to its functional applications, the aesthetic appeal of Vantablack S-VIS is unmatched, creating a breathtaking void of light when applied. This aspect has also found applications in art and design, where the darkest black available transforms ordinary surfaces into seemingly infinite voids. As such, Vantablack S-VIS serves both scientific and creative endeavors by harnessing its unique optical properties to transform how surfaces are seen and used in various industries.
The 802.11ah HaLow Transceiver by Palma Ceia represents a significant advance in IoT communications technology. Designed to address the power and bandwidth limitations of traditional Wi-Fi for IoT applications, it offers enhanced range, lower power consumption, and operates in sub-1 GHz bandwidths. This transceiver supports low data rate communications over long distances, making it perfect for IoT devices that require reliable network presence. Its integrated power management mechanisms ensure prolonged battery life for sensor-based applications. Moreover, with stringent adherence to the 802.11ah standard, the transceiver guarantees compatibility with various IoT ecosystems. This IP's capability to function as both a standalone component or part of a System-on-Chip (SoC) allows for flexible design implementations. Applications range from smart city infrastructures to personal health monitoring devices, highlighting its versatility in meeting diverse connectivity needs in the IoT domain.
Hermes X3D is engineered to expedite the process of RLGC extraction, which is critical for power, package, and touch panel modeling. The tool is particularly useful in scenarios demanding quick and accurate results to optimize circuit behavior, allowing designers to refine and improve system performance by addressing the nuances of resistance, inductance, capacitance, and conductance (RLGC). Its high-speed computation abilities make Hermes X3D an ideal solution for environments where time-efficient modeling is crucial. The tool's detailed extraction processes enable precise prediction of circuit parameters, supporting engineers in achieving balanced designs that optimize function and durability. Hermes X3D is indispensable for developers looking to enhance power and package design as well as those engaged in intricate touch panel circuit design. Its focused approach to simulation offers critical insights that help streamline the development process and elevate the quality and performance of electronic products.
Suited for high throughput applications, the MIPITM SVTPlus2500 is a versatile 4-lane video transmitter compliant with CSI2 rev 2.0 and DPHY rev 1.2 standards. This transmitter offers seamless operation with a low clock rating, simplifying timing closure challenges, and supports PRBS and calibration for enhanced accuracy. It is designed to handle 8/16 pixel inputs per clock, offering programmable timing parameters for versatile use across different systems. With its capacity to manage 16 virtual channels and achieve data rates up to 4 x 2.5Gbps, it ensures efficient video signal transmission with minimal data loss. The SVTPlus2500's adaptability makes it ideal for sophisticated video systems, offering controlled and precise data transmission over flexible configurations. Its robust system integration capabilities are designed to meet a broad range of industry standards, enhancing overall operational efficiency.
The EW6181 is an advanced multi-GNSS silicon designed for high sensitivity and low power consumption, a stand-out product in GPS and GNSS technology. It supports multiple global positioning systems like GPS L1, Glonass, BeiDou, Galileo, SBAS, WASS, and A-GNSS. This silicon includes an integrated RF frontend, a digital baseband for signal processing, and ARM MCU to efficiently run the necessary firmware. This chip is tuned for low energy use, incorporating a DC-DC converter along with high voltage and low voltage LDOs, which makes it ideal for battery-powered devices. Its size and energy efficiency make it a competitive module component that reduces the overall Bill of Materials (BoM) for manufacturers. The EW6181's architecture is optimized for cloud readiness, offering enhanced capabilities for applications needing intensified accuracy and power savings through cloud connectivity. A unique feature of the EW6181 is its implementation in a 2-antenna Evaluation Kit, showcasing its potential to improve device connectivity and performance with antenna diversity mode, perfect for rotating devices like action cameras and wearable tech. This diversity offers key advantages in both connectivity and user experience, emphasizing the EW6181 as a flexible, high-performing component in various technological ecosystems.
Rockley's Multi-Channel Silicon Photonic Chipset is designed as a next-generation solution for high-speed data transmission. This sophisticated chipset integrates hybrid III-V DFB lasers and electro-absorption modulators within a silicon photonic framework, providing 4x106 Gb/s 400 GBASE-DR4 data rates. Each channel achieves high modulation amplitude and low TDECQ penalty, delivering compliance with industry standards. This scalability ensures robust performance for data centers and high-bandwidth communication needs. The chipset exemplifies Rockley's expertise in combining optical components to craft preciseness and efficiency suited for heavy data-centric environments.
The ADQ7DC is a state-of-the-art digitizer that offers a blend of high resolution with 14 bits and a rapid 10 GSPS sampling rate. This model surpasses previous limitations in high-speed applications, opening new possibilities for advanced measurement and processing tasks. It operates in both single-channel at 10 GSPS and dual-channel at 5 GSPS modes, offering versatility in data capture requirements. Its DC-coupled input boasts a commendable 3 GHz input bandwidth, with capabilities for programmable DC-offsets and a digital noise reduction filter. The onboard Xilinx Kintex Ultrascale KU115 FPGA provides ample resources for diverse real-time digital signal processing tasks. With peer-to-peer data streaming to GPUs facilitated at 7 Gbyte/s, users gain enhanced efficiency for intensive data handling applications. With its broad compatibility with various form factors like PCIe and PXIe, ADQ7DC is ideal for high-speed RF data recording, scientific instruments, and more. The built-in firmware offers a rich selection of application-specific functions that can be accessed without any need for FPGA development, significantly simplifying its operation and integration.
The 100BASE-T1 Ethernet PHY is engineered for high-speed communication over a single pair of unshielded twisted-pair cable, ideal for automotive and industrial applications requiring minimal cabling. This Ethernet physical layer transceiver facilitates efficient data transmission at 100Mbps, ensuring robust connectivity even in compact spaces. It is lightweight and boasts a low-power design that is optimized for versatile deployment across various environments. Designed to meet stringent performance criteria, the 100BASE-T1 Ethernet PHY offers enhanced signal integrity and low-latency communication, which are critical in complex network setups. The transceiver's ability to deliver high-speed data transfer makes it a reliable choice for applications demanding seamless communication. Its compact form factor not only helps in space-constrained designs but also reduces installation costs related to cabling. The 100BASE-T1 Ethernet PHY is a strategic choice for systems where conserving space and boosting performance without compromising quality is paramount.
The FCM1401 is part of Falcomm's innovative Dual-Drive™ series, designed to offer exceptional efficiency in power amplification. This model, operating at a center frequency of 14.5 GHz, harnesses advanced dual-drive technology to achieve milestones in power efficiency, outperforming traditional power amplifier solutions. With a meticulous design focusing on minimal silicon area usage and high efficiency, it presents a compelling option for enhancing battery life and reducing energy consumption in wireless communications. Falcomm's FCM1401 achieves impressive benchmarks, such as world-class efficiencies validated in commercial CMOS SOI platforms. The power amplifier is notable for its substantial reduction in silicon area, evidenced by the significant power-added efficiency (PAE) results of 34% using a 64QAM signal, averaged at 14.1dBm while maintaining a drain efficiency of 70% at device output. Such enhancements are crucial for applications requiring sustained high efficiency without the downside of increased power draw. This power amplifier caters to high-demand sectors like space communications and modern telecommunications where efficient power use is vital. Operating without efficiency degradation at supply voltages ranging from 1.6V to 2.0V, it offers substantial improvements in signal strength while reducing the operational costs for network operators.
IRIS is a precision-engineered tool tailored for RF and analog IC simulation. Its primary purpose is to provide designers with accurate and fast electromagnetic simulations that are essential for crafting high-performance RF circuits and analog designs. With the growing demand for advanced radio frequency applications, IRIS serves as a vital resource for engineers aiming to push the boundaries of innovation. The tool boasts high fidelity in simulating RF and analog behaviors, catering to the need for precise modeling in frequency-dependent environments. IRIS allows engineers to evaluate various scenarios, ensuring device robustness and reliability when deployed in real-world applications. This foresight is particularly beneficial in rapidly evolving industries where technological superiority is a cornerstone of success. By facilitating comprehensive assessments, IRIS ensures that potential performance issues are identified and rectified early in the design process, thus securing a smoother path to production. The tool's efficient simulations make it indispensable for developers focused on cutting-edge RF and analog designs.
These optical components serve as foundational elements for building advanced optical systems. Designed to offer flexibility and customization, the building blocks cover a spectrum of applications from simple optical connections to intricate network configurations. They are integral in streamlining the optical design process, providing reliable, high-performance solutions that are pre-tested to meet industry standards. Their adaptability makes them suitable for diverse application scenarios, pushing the boundaries of optical communication technologies.
The RT990 represents RafaelMicro's prowess in developing optical communication components, specifically for Cable Television (CATV) systems. This TIA excels in signal amplification, essential for clear, high-fidelity video and audio transmission across optical networks.
InPsytech's ADC solutions include SAR, Pipeline, and SigmaDelta converters, catering to a variety of precision and high-speed conversion needs. These converters are integral in converting analog signals to digital form in a range of applications, from consumer electronics to high-precision instruments. The ADC solutions are designed to deliver accurate, fast results, essential for detailed signal processing tasks.
Akronic stands out in the design of mmW-IC wireless transceivers, optimized for both telecom and radar sensor applications. Leveraging a solid understanding of the mm-Wave spectrum, the company has produced numerous complete integrated transceiver solutions. These designs are often customized to CMOS and BiCMOS processes, ensuring high-frequency operation across a vast range from 6 to 120 GHz. The company's mmW-IC transceivers are geared towards high-speed communication applications such as backhaul and fronthaul systems. They deliver efficient wireless connections at frequencies like 30GHz and 39GHz, and extend their capabilities to unlicensed 60GHz bands for Gbps wireless links. Akronic’s engineering solutions efficiently accommodate E-band wireless links at 71-76GHz and 81-86GHz, including extremely high-frequency operations at 120GHz for multi-Gbps communications. In the radar sensor realm, Akronic employs its mmW expertise for advanced FMCW radar transceivers ideal for automotive applications and high-resolution sensing technologies. The ICs can support various imaging and radar frequencies, such as 77-81GHz, which is crucial for automotive radar, establishing Akronic’s leadership in innovative mmW wave transceiver design and deployment.
The OSIRE E3731i is crafted to meet high-intensity RGB lighting demands in automotive interiors, featuring an intelligent RGB LED configuration with an embedded integrated circuit. This circuit manages the R/G/B LEDs and stores optical measurement data, ensuring enhanced control over color algorithms via an external microcontroller. The device uses open system protocols, allowing comprehensive data reading and control features, including temperature management for color consistency. The OSIRE E3731i is specifically patent-compliant and supports automotive production requirements, maintaining rigorous standards for both temperature compensation and controller communication within the LED unit.
Designed for the demands of high-speed data communications, the RT923 by RafaelMicro comprises a 10Gbps Trans-Impedance Amplifier (TIA). This critical component excels in optical or network communication systems, where it converts optical signals into electrical ones with remarkable efficiency and minimal noise.
Moonstone, an offering from Lightelligence, is a highly versatile laser source available in both single and multi-wavelength configurations. Unlike conventional laser packages, Moonstone features a compact design and enhanced temperature management, making it a cost-effective and modular solution for diverse applications including telecommunications, LiDAR, and sensor technologies. The product leverages an automated optical packaging process that integrates off-the-shelf laser chips with the Moonstone carrier through advanced techniques like eutectic soldering and die-bonding. The ensuing laser assembly enables a free-space coupling method for single wavelength use, and a multiplexing approach for multi-wavelength scenarios, optimizing optical signal combination and transmission efficiencies. Moonstone's precision engineering and thermal regulation provide low coupling losses and high output power, suitable for demanding environments where high-speed and high-bandwidth data transmission are crucial. It serves a vital role in optical computing, offering substantial power delivery while maintaining a low phase noise footprint, thus bolstering AI computational capacities significantly.
Notus provides a comprehensive platform for SI/PI, thermal, and stress analysis, crucial for engineers striving to optimize electronic circuit performance under various environmental conditions. Integrating signal integrity, power integrity, and multi-physics simulation within a single tool, Notus offers unmatched analytical capabilities that ensure designs meet rigorous operational standards. Designed to tackle complex simulations, Notus helps in identifying potential problems before they become costly failures. Its detailed analyses encompass a range of scenarios, aiding in the prediction and enhancement of circuit reliability and longevity. This integrated approach supports forward-thinking design strategies that are essential in today's competitive electronics marketplace. Notus enhances productivity by simplifying the design process and reducing the need for multiple software tools, thereby accelerating time-to-market. The powerful simulations it provides are indispensable for engineers working on high-stakes projects where precision and reliability are non-negotiable.
SnpExpert is a dedicated platform designed for in-depth S-parameter analysis, which is vital in understanding the behavior of RF and high-speed digital circuits. By providing an unparalleled view of network parameters, this tool helps engineers ensure that designs will perform as expected across different frequencies and scenarios. The precision and clarity offered by SnpExpert simplify the analysis of complex interactions within electronic systems, allowing for efficient troubleshooting and optimization. This feature is particularly valuable when modifications are needed to enhance circuit performance, enabling refined design choices that foster innovation and reliability. SnpExpert's robust analytical capabilities make it an essential tool for tackling the intricate challenges associated with RF design and testing. Its insights into S-parameter metrics enable designers to achieve the optimal performance required in today's demanding technological landscape.
XDS offers a specialized platform for the design and simulation of RF and microwave circuits. Its precision-focused tools provide detailed insights into electromagnetic performance critical to the development of modern RF systems. XDS excels in modeling the complex interactions inherent in these high-frequency designs, facilitating optimized circuit performance and reliability. With its robust simulation capabilities, XDS empowers designers to visualize and address potential performance challenges before practical implementation. This foresight in design allows for the crafting of circuits that are not only efficient but also resilient to real-world interferences and stresses. Engineers utilizing XDS benefit from its ability to streamline the design process, reducing development time while enhancing product functionality and performance. The tool is a vital asset for those focused on advancing RF technologies and maintaining best-in-class standards in microwave circuit design.
Operating at 28 GHz, the FCM2801-BD is another flagship model within Falcomm's Dual-Drive™ lineup, exemplifying the company's leadership in power amplifier technology. This two-stage amplifier features unmatched efficiency and performance metrics, setting new standards in the industry for wireless communications. Suitable for both commercial and cutting-edge applications, it stands as a testament to Falcomm's innovative spirit and technical prowess. The FCM2801-BD is constructed to deliver record-setting power-added efficiency and drain efficiency, validated within a robust CMOS SOI framework. The dual-drive core achieves up to 62% drain efficiency at device output levels, cementing its capability to handle high-data throughput scenarios while conserving energy. Such impressive efficiencies directly contribute to lowering battery consumption and enhancing the operational lifespan of connected devices. Moreover, this PA is a strategic choice in telecommunications and space communications fields, where power efficiency and signal quality are paramount. Its versatile design supports operations over the required frequency band without efficiency losses, emphasizing adaptability in various network environments. By incorporating this PA, service providers and satellite operators can advance their operational goals with reduced power expenditure, aligning with sustainable energy practices.
ViaExpert is tailored for intricate via modeling and simulation, offering precise analysis for systems requiring high-fidelity interconnects. As high-speed digital designs become increasingly prevalent, the accurate modeling of vias - essential pathways in an electronic design - becomes critical. ViaExpert provides the tools necessary to evaluate vias' electrical characteristics comprehensively, ensuring designs can accommodate desired performance levels. This tool addresses challenges in high-frequency environments by offering detailed simulations of via structures, facilitating seamless integration with overall circuit designs. The emphasis on accuracy helps designers mitigate potential signal integrity issues, such as reflection and crosstalk, which can arise in complex electronic systems. ViaExpert is particularly suited for engineers seeking precise interconnect modeling to ensure reliability and efficiency in design outcomes. Its advanced simulation capabilities support the creation of resilient and effective electronic systems, valuable for industries where performance cannot be compromised.
The VibroSense AI Chip is tailored for vibration analysis applications, providing ultra-low power neuromorphic processing capabilities to industrial IoT systems. This chip excels in converting complex vibration data into manageable patterns, facilitating efficient local processing and dramatically reducing data transfer volumes. It is especially valuable in applications such as tire and machine health monitoring, where real-time data analysis can significantly enhance safety and maintenance efficiency. VibroSense enables direct on-sensor preprocessing, transforming high-frequency vibration signals into concise data sets for further evaluation. This not only diminishes the data load on network systems but also supports long-distance, low-bandwidth communications crucial for remote monitoring tasks. Implementing VibroSense in road condition monitoring for automotive applications ensures quick and precise feedback to advanced driver assistance systems, contributing to improved vehicular safety. The chip's ability to predict maintenance needs through vibration-based monitoring makes it a powerful tool in industrial applications. By analyzing vibrations, it can detect potential machinery issues, thus optimizing operational uptime and reducing maintenance costs. The VibroSense chip's integration encourages the development of energy-efficient, reliable predictive maintenance solutions in complex industrial settings.
ParkerVision's D2D® Technology, short for Direct-to-Data, represents a groundbreaking shift in RF receiver design, offering unmatched performance in frequency conversion from RF to baseband. This distinctive approach has allowed RF receivers to be constructed from cost-effective CMOS chips that consume minimal power while maintaining agility across global radio frequency bands. \n\nD2D® technology optimizes RF carrier signal processing to accommodate vast data requirements typical of 4G and the emerging 5G communication standards. The technology's hallmark is its ability to maintain high data transfer rates, crucial for real-time video streaming and extensive data accumulation. By integrating multimode RF solutions, D2D® encompasses a variety of legacy and advanced communication standards within a single compact framework. \n\nBy employing innovative energy transfer sampling methodologies, the technology challenges the status quo, offering a more efficient alternative to traditional super-heterodyne RF receivers. ParkerVision's D2D® technology not only reduces the redundancy and area needed for silicon solutions but also enhances resilience against signal interference, providing better connectivity. \n\nThe multi-faceted approach of ParkerVision's D2D® platform has been pivotal in enabling modern smartphones, delivering faster data speeds and reliable operation under diverse conditions. As an enabler of enhanced RF receiver performance, this technology supports the evolving needs of consumer electronics by marrying sophisticated digital processing with low-power, high-performance analog solutions.
The FCM3801-BD further expands Falcomm's Dual-Drive™ series, addressing the high-frequency demands of 38 GHz applications. This power amplifier is meticulously engineered to optimize energy efficiency without compromising on power output, making it an ideal choice for modern, power-constrained environments. As a testament to Falcomm's innovative strides, it blends cutting-edge technology with practicality, meeting diverse needs across various sectors. Engineered within a CMOS SOI platform, the FCM3801-BD achieves a balance between power conservation and performance. It embodies the apex of power amplifier design, showcasing drain efficiencies up to 70% at device output. Such performance metrics offer sizable reductions in operational costs, enhancing the environmental sustainability of wireless communication networks. Furthermore, the core design benefits from minimized silicon area footprint, further enhancing its appeal in compact device architectures. Targeting crucial industry areas like space and telecommunications, the FCM3801-BD provides the needed functionality to extend signal reach significantly while boosting power savings. It operates efficiently across varied voltage ranges without sacrificing its adept energy performance. These characteristics highlight its exceptional capabilities for stakeholders prioritizing efficiency, reliability, and technological advancement in their service delivery models.
Hermes Layered is a sophisticated tool dedicated to 3D finite element method (FEM) simulation, aimed at IC, package, and PCB applications. This tool enhances the designer's ability to analyze complex electromagnetic interactions within layered structures. Its advanced simulation capabilities ensure that critical design metrics such as signal integrity and electromagnetic compatibility are thoroughly evaluated. The power of Hermes Layered lies in its ability to manage detailed simulations of multiple layers, essential in the design of high-performance ICs and advanced packaging systems. By providing designers with a thorough analysis of electromagnetic effects, Hermes Layered helps optimize designs to ensure both reliability and functionality. This tool is indispensable for those engaged in cutting-edge IC and PCB design, where the ability to predict and mitigate potential EM challenges can significantly impact the success of the final product. Hermes Layered offers precision and quality insights needed to meet the high demands of today's electronic systems.
Enosemi's photonic subsystems offer a comprehensive platform for deploying optical circuits in various high-tech applications. Designed for integration into larger systems, these subsystems enhance the overall functionality and performance of photonic infrastructures. They incorporate high-efficiency components that deliver precision and stability required for demanding environments, such as telecommunications and data centers. The subsystems are built with a keen focus on reducing the time-to-market while improving system reliability and operational efficiency.
Engineered for functionality in the 24 to 32GHz range, the 28GHz SP4T switch functions with minimal insertion loss of roughly 0.8dB and ensures superior isolation over 23dB. Designed using a PIN diode process, this switch showcases its capabilities by providing efficient and reliable performance, essential in lowering signal loss and improving clarity in high-frequency telecom applications. The broad frequency range positions this switch as a critical component in modern communication systems, ensuring seamless data transmission and effective signal distribution.
The ATEK552 is a high-power Gallium Nitride (GaN) Power Amplifier with exceptional output capabilities. Operating within the range of 3 GHz to 17 GHz, this amplifier delivers a notable output power of 6 watts. With a gain of 21 dB, the ATEK552 is crafted to boost signal levels efficiently in demanding RF environments. Deprecated for its robust performance, the ATEK552 can adapt seamlessly into various applications due to its flexible power supply requirements, with Vdd set at 28V and a current draw of 510 mA. Its die-based construction facilitates easy integration into larger systems, making it a suitable choice for bands requiring high power amplification. This power amplifier is ideal for use in telecommunications, defense systems, and aerospace applications, where dependable amplification and high power are crucial. Its solid performance metrics ensure reliability and efficiency, supporting advanced communications infrastructure and secured data transmission.
The Yuzhen 600 RFID Chip by T-Head is a high-efficiency chip designed for radio-frequency identification applications. This chip is equipped with advanced features to facilitate reliable and fast data capture in RFID systems. It supports a wide range of operating frequencies, making it versatile for various application environments, from logistics to retail management.\n\nThe Yuzhen 600 is crafted with energy efficiency in mind, ensuring prolonged operation and minimal power consumption. Its architecture allows for quick read and write cycles, enhancing throughput and operational efficiency in high-demand settings. This makes it ideal for inventory tracking, asset management, and supply chain logistics.\n\nFurthermore, the Yuzhen 600 offers robust security features to protect data integrity and privacy, a crucial aspect in high-stakes environments where sensitive information is processed. The chip's adaptability to diverse RFID protocols makes it a flexible solution for integrators looking for versatile RFID products.
ChannelExpert is a high-speed system simulation platform specifically designed for assessing signal integrity and power integrity in complex electronic architectures. It stands out for its capacity to simulate entire systems, providing comprehensive insights that are invaluable during the design phase of high-frequency, high-speed circuits. This platform caters to the challenges of modern electronic environments where data throughput and speed are critical success factors. By enabling the simulation of various operational scenarios, ChannelExpert assists designers in predicting system behavior accurately, ensuring robust performance and integrity under demanding conditions. ChannelExpert's advanced features include detailed analytical tools that support system optimization, fostering the development of products that can thrive in today's fast-paced technological landscape. It is an essential tool for engineers dedicated to creating high-performance electronic systems with minimal signal interference and maximum throughput.
Metis stands as a powerful solution designed for tackling the complexities of 2.5D/3D IC packaging. Tailored to support the analysis of multi-die integration, Metis provides comprehensive simulation capabilities essential for modern IC design requirements. As the industry moves towards more compact and complex packaging, Metis plays a pivotal role in ensuring that these designs meet the necessary criteria for SI/PI performance and thermal management. What sets Metis apart is its extensive capacity to handle large-scale simulations, enabling designers to model and evaluate the electromagnetic interactions within densely packed IC assemblies. This capability is crucial in maintaining signal integrity and power integrity, which are often the bedrock of functional and reliable electronic systems. Metis supports the development of advanced IC packaging solutions by offering detailed visualizations and simulation insights, empowering engineers to address critical design challenges proactively. Its role in optimizing packaging solutions ensures that products not only meet but exceed industry standards for performance and reliability.
The NB-IoT (LTE Cat NB1) Transceiver provides a cost-effective solution for low-bandwidth wide-area network IoT applications. With compliance to the 3GPP Release 13 and 14 standards, this transceiver is tailored for efficient communication across cellular networks. It offers a robust receiver and transmitter performance with a diverse range of bandwidths and modulation options, ensuring high data reliability and low latency. The receiver features internal DC offset and IQ mismatch correction capabilities, while the programmable interface facilitates easy integration into existing systems. Optimized for low power consumption without compromising performance, this transceiver is suitable for applications ranging from smart metering to environmental sensors. Its extensive documentation and support resources further simplify the integration process, ensuring a smooth transition during deployment.
This module caters to the demands of contemporary wireless communication, enhancing connectivity and performance for devices operating on WiFi6, LTE, and 5G networks. It features a front-end module that combines a switch, LNA, and PA, operating in the 2.4 and 5-7 GHz frequency ranges. This integration is designed to optimize the RF front-end path in mobile and communication devices, ensuring seamless data transfer and robust connection strength in advanced wireless systems.