The CANmodule-III is a comprehensive CAN controller module that offers mailbox-based architecture. It meets the international CAN standard ISO 11898-1 and includes 16 receive buffers, each equipped with its own message filter, and 8 transmit buffers with a priority-based arbitration scheme. This configuration ensures optimal support for Higher Layer Protocols (HLP) like DeviceNet and SDC, which demand intricate application-specific features.
Built with technology-independent HDL, the CANmodule-III integrates seamlessly into both ASIC and FPGA frameworks, fully utilizing on-chip SRAM structures for enhanced performance. An AMBA 3 Advanced Peripheral Bus (APB) interface simplifies the integration into ARM-based systems-on-chip (SoCs), guaranteeing zero wait-state interface performance. This module supports advanced features such as automatic remote transmission request (RTR) handling and configurable interrupt generation mechanisms.
The design is fully synchronous and includes robust test and debugging capabilities—such as various loopback modes and an SRAM test mode—ensuring high reliability and ease of development. This versatile CAN controller offers a sophisticated solution for implementing reliable, high-performance CAN communications in diverse embedded systems.
