The BlueLynx Chiplet Interconnect facilitates seamless communication between chiplets, vital for modern semiconductor designs that emphasize modularity and efficiency. This technology supports both physical and link layer interfaces, adhering to the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards. BlueLynx ensures high-speed data transfer, offering customizable options to tailor designs for specific workloads and application needs.
Optimized for AI, high-performance computing, and mobile markets, BlueLynx's die-to-die adaptability provides system architects with the leeway to integrate a variety of packaging types and process nodes, including 2D, advanced 2.5D, and innovative 3D packaging options. The solution is recognized for delivering a balance of bandwidth, energy efficiency, and latency, ensuring robust system performance while minimizing power consumption.
This IP has been silicon-proven across multiple process nodes, including advanced technologies like 3nm, 4nm, and 5nm, and is supported by major semiconductor foundries. It offers valuable features such as low latency, improved PPA (Power, Performance, Area), and industry-standard compliance, positioning it as a reliable and high-performing interconnect solution within the semiconductor industry.
