The BlueLynx Chiplet Interconnect represents a pivotal development in die-to-die communication, emphasizing versatility through support for both the Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project's Bunch of Wires (BoW) standards. This innovative solution is designed to integrate smoothly with on-die buses and Networks-on-Chip (NoCs), accommodating a variety of protocols such as AMBA, AXI, and ACE.
This product is optimized for high-bandwidth applications, addressing the stringent power, performance, and area (PPA) requirements of modern chip designs. By utilizing a dual-mode PHY and offering extensive configurability in data rates and packaging options, the BlueLynx interconnect facilitates rapid, efficient system integration.
Silicon-proven across numerous process nodes, including advanced nodes like 3nm and 4nm, BlueLynx is tailored to meet the diverse needs of the semiconductor market. Its customizable architecture ensures that each implementation maximizes bandwidth and minimizes power usage, supporting complex systems with ease.
