The BlueLynx Chiplet Interconnect is designed for advanced and standard packaging applications, providing a versatile solution that supports high bandwidth requirements while adhering to industry standards. Its architecture simplifies the transition from System on Chips (SoCs) to chiplets by connecting effectively to various on-die Network-on-Chip (NoCs) standards. With the ability to customize bandwidth and process selections, BlueLynx IP is silicon-proven in several process nodes and foundries, ensuring both rapid silicon bring-up and first-pass success. The IP's design allows it to deliver low latency, high bandwidth, and energy efficiency, making it a cost-effective choice for modern semiconductor applications.
