All IPs > Interface Controller & PHY > D2D > AresCORE UCIe Die-to-Die PHY
AresCORE focuses on high-bandwidth, low-latency interconnects between multiple dies within a package. It supports configurations conducive to advanced packaging techniques, ensuring high data rate transfers and low energy consumption. Primarily aimed at cutting-edge fields such as AI and high-performance computing, it extends chip designers the opportunity to surpass reticle limits by embracing multi-die packaging solutions.
| Foundry | Process Nodes |
|---|---|
| Intel Foundry |
14nm FinFET |
| TSMC |
14nm FinFET |
| Class | Value |
|---|---|
| Categories |
Interface Controller & PHY > D2D |
| Data Rate | Up to 64 Gbps |
| Availability | All Countries & Regions |
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